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Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.
Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction.
Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process
Model-making: Materials and Methods focuses primarily on the wide variety of materials that can be employed to make models; those which have been favoured for a while and those which are relatively new. The book looks at how these materials behave and how to get the best out of them, then illustrates a range of relatively simple methods of building, shaping, modelling, surfacing and painting with them. Useful features of the book include: the different uses of models in various disciplines; the sequence of making; planning and construction, creating surfaces, painting and finishing; methods of casting, modelling and working with metals; step-by-step accounts of the making of specially selected examples; simple techniques without the need for expensive tools or workshop facilities; a 'Directory' of a full range of materials, together with an extensive list of suppliers. This book is intended for students of theatre production, art & architecture, animation and theatre/television set designers where accurate scale models are necessary, and is also of interest to anyone involved with the process of making forms in 3D and the challenge of making small-scale forms in general. Superbly illustrated with 185 colour photographs.
Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.
Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.
Learn how ART and ADT can reduce cost, time, product recalls, and customer complaints This book provides engineers with the techniques and tools they need to use accelerated reliability testing (ART) and accelerated durability testing (ADT) as key factors to accurately predict a product's quality, reliability, durability, and maintainability during a given time, such as service life or warranty period. It covers new ideas and offers a unique approach to accurate simulation and integration of field inputs, safety, and human factors, as well as accelerated product development, as components of interdisciplinary systems engineering. Beginning with a comprehensive introduction to the subject of ART and ADT, the book covers: ART and ADT as components of an interdisciplinary systems of systems approach Methodology of ART and ADT performance Equipment for ART and ADT technology ART and ADT as sources of initial information for accurate quality, reliability, maintainability, and durability prediction and product accelerated development The economical results of the usage of ART and ADT ART and ADT standardization The book covers the newest techniques in the field and provides many case studies that illuminate how the implementation of ART and ADT can solve previously inaccessible problems in the field of engineering, such as reducing product recalls, cost, and time during design, manufacture, and usage. Professionals will find the answers to how one can carry out ART and ADT technology in a practical manner. Accelerated Reliability and Durability Testing Technology is indispensable reading for engineers, researchers in industry, usage, and academia who are involved in the design of experiments, field simulations, maintenance, reliabilty, durabilty, accurate prediction, and product development, and graduate students in related courses.