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Discusses patterning, insulating, and packaging polymeric materials for the $150-billion microelectronics industry as well as the rapidly emerging nanoelectronics and organic electronics industries. Chapters discuss patterning, insulating, and packaging polymeric materials as well as organic materials for nanoelectronics, organic electronics, and optoelectronics. This book covers the synthesis, characterization, structure-property relationship, performance, and applications of these materials.
Developed from a symposium at the 203rd Meeting of the ACS in San Francisco, April 1992, this volume presents new information on advanced polymers for applications in the manufacture of electronic devices and systems. The 38 chapter-papers are organized in four sections: chemically amplified resists; top-surface imaging and dry development resists; electron-beam, X-ray, and photoresists; and polyimides and dielectric polymers. Annotation copyright by Book News, Inc., Portland, OR
The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field. * Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field
The Handbook of Polymers in Electronics has been designed to discuss the novel ways in which polymers can be used in the rapidly growing electronics industry. It provides discussion of the preparation and characterisation of suitable polymeric materials and their current and potential applications coupled with the fundamentals of electrical, optical and photophysical properties. It will thus serve the needs of those already active in the electronics field as well as new entrants to the industry.
The object of this book is to review and to discuss some important applications of polymers in electronics. The first three chapters discuss the current primary applications of polymers in semiconductor device manufacturing: polymers as resist materials for integrated circuit fabrication, polyimides as electronics packaging materials, and polymers as integrated circuits encapsulates.
This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered the development of many new and improved coating polymers and formulations. Both the theoretical aspects of coatings (molecular structure of polymer types and their correlation with electrical and physical properties) and applied aspects (functions, deposition processes, applications, testing) are covered in the book. Over 100 proprietary coating formulations were reviewed, their properties collated, and tables of comparative properties prepared. This book is useful as both a primer and as a handbook for collecting properties data.
Learn how recent advances are fueling new possibilities in textiles, optics, electronics, and biomedicine! As the field of conjugated, electrically conducting, and electroactive polymers has grown, the Handbook of Conducting Polymers has been there to document and celebrate these changes along the way. Now split into two vo