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Developed from a symposium at the 203rd Meeting of the ACS in San Francisco, April 1992, this volume presents new information on advanced polymers for applications in the manufacture of electronic devices and systems. The 38 chapter-papers are organized in four sections: chemically amplified resists; top-surface imaging and dry development resists; electron-beam, X-ray, and photoresists; and polyimides and dielectric polymers. Annotation copyright by Book News, Inc., Portland, OR
Volume Four discusses the applications of radiation curing and provides a synopsis of the latest research in coatings; graphic arts; microelectronics; optical fibres; adhesives; 3D machining; membranes and holographic optical elements as well as considering the worldwide trends in the market.
This new edition of the bestselling Microlithography: Science and Technology provides a balanced treatment of theoretical and operational considerations, from elementary concepts to advanced aspects of modern submicron microlithography. Each chapter reflects the current research and practices from the world's leading academic and industrial laboratories detailed by a stellar panel of international experts. New in the Second Edition In addition to updated information on existing material, this new edition features coverage of technologies developed over the last decade since the first edition appeared, including: Immersion Lithography 157nm Lithography Electron Projection Lithography (EPL) Extreme Ultraviolet (EUV) Lithography Imprint Lithography Photoresists for 193nm and Immersion Lithography Scatterometry Microlithography: Science and Technology, Second Edition authoritatively covers the physics, chemistry, optics, metrology tools and techniques, resist processing and materials, and fabrication methods involved in the latest generations of microlithography such as immersion lithography and extreme ultraviolet (EUV) lithography. It also looks ahead to the possible future systems and technologies that will bring the next generations to fruition. Loaded with illustrations, equations, tables, and time-saving references to the most current literature, this book is the most comprehensive and reliable source for anyone, from student to seasoned professional, looking to achieve robust, accurate, and cost-effective microlithography processes and systems.
Proceedings of the Third International Conference on Frontiers of Polymers and Advanced Materials held in Kuala Lumpur, Malaysia, January 16-20, 1995
This book is mostly based on papers presented at the Fourth International Symposium on this topic held in Savannah, Georgia. However, in addition to these papers, certain very relevant papers have also been included to broaden the scope and thus enhance the value of this book.Currently there is tremendous interest in these material because of their
The Polymeric Materials Encyclopedia presents state-of-the-art research and development on the synthesis, properties, and applications of polymeric materials. This groundbreaking work includes the largest number of contributors in the world for a reference publication in polymer science, and examines many fields not covered in any other reference. With multiple articles on many subjects, the encyclopedia offers you a broad-based perspective on a multitude of topics, as well as detailed research information, figures, tables, illustrations, and references. Updates published as new research unfolds will continue to provide you with the latest advances in polymer science, and will keep the encyclopedia at the forefront of the field well into the future. From novices to experienced researchers in the field, anyone and everyone working in polymer science today needs this complete assessment of the state of the art. The entire 12-volume set will be available in your choice of printed or CD-ROM format.
"Explores the science and technology of lithographic processes and resist materials and summarizes the most recent innovations in semiconductor manufacturing. Considers future trends in lithography and resist material technology. Reviews the interaction of light, electron beams, and X-rays with resist materials."
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
This is the first book to provide an in-depth presentation of photosensitive polyimides for electronic and photonic applications. The authors are leading specialists in this field from Japan, Europe and the U.S. From the Preface Aromatic polyimides were developed originally as thermostable flexible polymer films for space applications. Now polyimides have found widespread use in the manufacture of electronic devices and have been employed in increasingly diverse areas of electronics and information technology. In addition to their excellent thermal stability and high processability, a wide range of chemical and physical properties provided by molecular engineering makes polyimides highly versatile in the electronics and information industries. Lithography of polyimides is an inevitable process in using polyimides for microelectronic fields, and hence increasing research has been devoted to developing photosensitive polyimides, which make it unnecessary to use photoresists for patterning polyimides and diminishing markedly the number of steps in fabrication of various electronic devices. In addition, the development of technology of photosensitive polyimides is expected to play a great role in manufacturing photonic devices in the near future, when the design and control of hyper fine structures . . . including higher thermal stability and better processability would be essential.