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Discusses patterning, insulating, and packaging polymeric materials for the $150-billion microelectronics industry as well as the rapidly emerging nanoelectronics and organic electronics industries. Chapters discuss patterning, insulating, and packaging polymeric materials as well as organic materials for nanoelectronics, organic electronics, and optoelectronics. This book covers the synthesis, characterization, structure-property relationship, performance, and applications of these materials.
Developed from a symposium at the 203rd Meeting of the ACS in San Francisco, April 1992, this volume presents new information on advanced polymers for applications in the manufacture of electronic devices and systems. The 38 chapter-papers are organized in four sections: chemically amplified resists; top-surface imaging and dry development resists; electron-beam, X-ray, and photoresists; and polyimides and dielectric polymers. Annotation copyright by Book News, Inc., Portland, OR
The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field. * Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field
This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered the development of many new and improved coating polymers and formulations. Both the theoretical aspects of coatings (molecular structure of polymer types and their correlation with electrical and physical properties) and applied aspects (functions, deposition processes, applications, testing) are covered in the book. Over 100 proprietary coating formulations were reviewed, their properties collated, and tables of comparative properties prepared. This book is useful as both a primer and as a handbook for collecting properties data.
The Handbook of Polymers in Electronics has been designed to discuss the novel ways in which polymers can be used in the rapidly growing electronics industry. It provides discussion of the preparation and characterisation of suitable polymeric materials and their current and potential applications coupled with the fundamentals of electrical, optical and photophysical properties. It will thus serve the needs of those already active in the electronics field as well as new entrants to the industry.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Reports recent developments in polymer science and technology pertinent to microelectronics. Addresses such topics as photophysics and radiation physics and chemistry of polymers; photoresists, electron beam resists, and X-ray resists; insulating materials in microelectronics; photoresponsive materials; silicon-containing polymers; conducting polymers; and optoelectronic materials. Includes international contributions from both academia and industry.
This first book in the Materials and Processes for Electronics Applications series answers questions vital to the successful design and manufacturing of electronic components, modules, and systems such as: - How can one protect electronic assemblies from prolonged high humidity, high temperatures, salt spray or other terrestrial and space environments? - What coating types can be used to protect microelectronics in military, space, automotive, or medical environments? - How can the chemistry of polymers be correlated to desirable physical and electrical properties? - How can a design engineer avoid subsequent potential failures due to corrosion, metal migration, electrical degradation, outgassing? - What are the best processes that manufacturing can use to mask, clean, prepare the surface, dispense the coating, and cure the coating? - What quality assurance and in-process tests can be used to assure reliability? - What government or industry specifications are available? - How can organic coatings be selected to meet OSHA, EPA, and other regulations? Besides a discussion of the traditional roles of coatings for moisture and environmental protection of printed circuit assemblies, this book covers dielectric coatings that provide electrical functions such as the low-dielectric-constant dielectrics used to fabricate multilayer interconnect substrates and high-frequency, high-speed circuits. Materials engineers and chemists will benefit greatly from a chapter on the chemistry and properties of the main types of polymer coatings including: Epoxies, Polyimides, Silicones, Polyurethanes, Parylene, Benzocyclobenzene and many others. For manufacturing personnel, there is an entire chapter of over a dozen processes for masking, cleaning, and surface preparation and a comprehensive review of over 20 processes for the application and curing of coatings including recent extrusion, meniscus, and curtain coating methods used in processing large panels. The pros and cons of each method are given to aid the engineer in selecting the optimum method for his/her application. As a bonus, from his own experience, the author discusses some caveats that will help reduce costs and avoid failures. Finally, the author discusses regulations of OSHA, EPA, and other government agencies which have resulted in formulation changes to meet VOC and toxicity requirements. Tables of numerous military, commercial, industry, and NASA specifications are given to help the engineer select the proper callout.