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Integrated photonic devices based on optical waveguides have been extensively studied for various applications, especially the high-speed intra- and inter-chip interconnects. Usually, a waveguide contains a core with high refractive index and cladding with lower refractive index. Among various waveguides, silicon, polymer, and silicon-polymer hybrid devices are the most promising candidates for low cost, small size, light weight, and low power consumption (CSWaP) optical interconnect. Firstly, silicon-based optical devices can be fabricated using CMOS compatible nanofabrication technology, which is already widely used to manufacture integrated circuits. Silicon photonic devices can have very small footprint and enable high density photonic circuits, due to high refractive index contrast. However, one of the intrinsic obstacles is the absence of [chi](2)-nonlinearity in unstrained silicon due to its centrosymmetric crystal structure, making modulating photons on silicon platform a great challenge. Secondly, polymer-based devices have been found very attractive, owing to the advantages of high thermo-optic (TO) or electro-optic (EO) coefficient, high transparency in the telecommunication wavelength windows, and fabrication feasibility over large areas on printed circuit board (PCB) or other kinds of substrates. The roll-to-roll (R2R) compatible imprinting and ink-jet printing for developing polymer-based devices on flexible or rigid substrates enable large-area, light-weight, low-cost optical interconnects. However, due to the low refractive index contrast, the polymer photonic devices always require large footprint. Finally, the silicon-organic hybrid (SOH) platform enables the marriage of the best of these two materials and thus has been receiving substantial attention. In this dissertation, integrated photonic devices based on silicon, polymer, or hybrid platform will be presented. First, high-efficiency quasi-vertical tapers for polymer waveguide based inter-board optical interconnects will be demonstrated. A triangular-shape tapered structure is adopted above the waveguide core to transform a fiber mode into a single mode polymer rib waveguide mode as an optical mode transformer. A coupling loss of 1.79±0.30 dB and 2.23±0.31 dB per coupler for the quasi-TM and quasi-TE mode respectively have been experimentally demonstrated, across the C and L bands (1535 nm – 1610 nm). Then, a reconfigurable thermo-optic polymer switch based true-time-delay network will be analyzed and demonstrated. Thirdly, I will show a novel subwavelength-grating waveguide ring resonator based high-speed modulators, which is the largest bandwidth and the most compact footprint that has been demonstrated for the ring resonators on the silicon-organic hybrid (SOH) platform. Finally, the on-chip time-division multiplexing and de-multiplexing system will be designed and analyzed.
We have solved the crosslinker crystallization problem which has been a major bottleneck for several years. A new method of electrooptic measurenment is invented which has the advantage of being able to accurately measure r33 and r13 separately with a high accuracy. A theory of TE-TM mode conversion in tilted-poled NLO waveguides is developed. A new polarization-independent Mach-Zehnder modulator is designed and fabricated by using this theory. This device uses continuous modulation electrodes, thereby allowing the employment of traveling-wave modulation to achieve extremely high speed. Primary polarization-independent devices and directional-coupler devices have been fabricated. Further design and fabrication of new high performance electrooptic devices are under investigation.
The accelerating increase in information traffic demands the expansion of optical access network systems that require high-performance optical and photonic components. In short-range communication links, optical interconnects have been widely accepted as a viable approach to solve the problems that copper based electrical interconnects have encountered in keeping up with the surge in the data rate demand over the last decades. Low cost, ease of fabrication, and integration capabilities of low optical-loss polymers make them attractive for integrated photonic applications to support futuristic data communication networks. In addition to passive wave-guiding components, electro-optic (EO) polymers consisting of a polymeric matrix doped with organic nonlinear chromophores have enabled wide-RF-bandwidth and low-power active photonic devices. Beside board level passive and active optical components, on-chip micro- or nano-photonic devices have been made possible by the hybrid integration of EO polymers onto the silicon platform. In recent years, silicon photonics have attracted a significant amount of attentions, because it offers compact device size and the potential of complementary metal-oxide-semiconductor (CMOS) compatible photonic integrated circuits. The combination of silicon photonics and EO polymers can enable miniaturized and high-performance hybrid integrated photonic devices, such as electro-optic modulators, optical interconnects, and microwave photonic sensors. Silicon photonic crystal waveguides (PCWs) exhibit slow-light effects which are beneficial for device miniaturization. Especially, EO polymer filled silicon slotted PCWs further reduce the device size and enhance the device performance by combining the best of these two systems. The potential applications of these silicon-polymer hybrid integrated devices include not only optical interconnects, but also optical sensing and microwave photonics. In this dissertation, the design, fabrication, and characterization of several types of silicon-polymer hybrid photonic devices will be presented, including EO polymer filled silicon PCW modulators for on-chip optical interconnects, antenna-coupled optical modulators for electromagnetic wave detections, and low-loss strip-to-slot PCW mode converters. In addition, some polymer-based devices and silicon-based photonic devices will also be presented, such as traveling wave electro-optic polymer modulators based on domain-inversion directional couplers, and silicon thermo-optic switches based on coupled photonic crystal microcavities. Furthermore, some microwave (or RF) components such as integrated broadband bowtie antennas for microwave photonic applications will be covered. Some on-going work or suggested future work will also be introduced, including in-device pyroelectric poling for EO polymer filled silicon slot PCWs, millimeter- or Terahertz-wave sensors based on EO polymer filled plasmonic slot waveguide, low-loss silicon-polymer hybrid slot photonic crystal waveguides fabricated by CMOS foundry, logic devices based on EO polymer microring resonators, and so on.
This is the final report of a three-year, Laboratory-Directed Research and Development (LDRD) project at the Los Alamos National Laboratory (LANL). The recent discovery of electroluminescent polymers opens up, for the first time, the possibility of using optical interconnects for conventional silicon integrated circuits (ICs). If this capability can be realized, it will have a tremendous impact on the architecture and performance of complex computing and communication systems. The primary objective of this project was to understand the light-emission mechanism of electroluminescent polymers and to use this knowledge to make efficient light-emitting-polymer diodes (LEPDs). These devices are the critical missing element for a polymer-based integrated-optical interconnect technology. The authors studied and obtained experimental results in several areas including the energetic position of fundamental excitation, the degradation of the polymer caused by oxygen, and the luminescence efficiency of polymer and oligomers. Parallel to the experimental effort, theoretical calculations were performed on the microscopic scale and on the device scale.
As we move from long-distance network to short distance reach, optics encounters increasing difficulties in terms of packaging, reliability and system cost. However, with the rapid increasing speed and complexity of VLSI technology, electrical interconnects will fail to provide sufficient bandwidth beyond 10GHz after 2012. There does exist an opportunity for the continuing exploration of optics to complement or even replace the conventional board level electrical interconnects. An innovative approach with a fully embedded structure is anticipated to overcome the technical and cost barriers that prohibit the realization of optical interconnects in board levels. In the second half of this dissertation, technology efforts projected to relieve the concerns of low cost, high performance optical layers, as well as the system integration issues were carried out. The research accomplishments include a 51cm long molded waveguide array with 150GHz optical bandwidth, 85% coupling efficiency surface normal micro-mirror and system integration with laser diodes and photo detectors.
Current data centre networks, based on electronic packet switches, are experiencing an exponential increase in network traffic due to developments such as cloud computing. Optical interconnects have emerged as a promising alternative offering high throughput and reduced power consumption. Optical Interconnects for Data Centers reviews key developments in the use of optical interconnects in data centres and the current state of the art in transforming this technology into a reality. The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres. Optical Interconnects for Data Centers is a key reference text for electronics designers, optical engineers, communications engineers and R&D managers working in the communications and electronics industries as well as postgraduate researchers. Summarizes the state-of-the-art in this emerging field Presents a comprehensive review of all the key aspects of deploying optical interconnects in data centers, from materials and components, to circuit boards and methods for integration Contains contributions that are drawn from leading international experts on the topic
Nanophotonics is a field of science and technology based on the manipulation of light with equally miniscule structures, in the same way that computer chips are used to route and switch electrical signals. By enabling new high bandwidth, high speed optoelectronic components, nanophotonics has the potential to revolutionize the fields of telecommunications, computation and sensing. In this book, Zalevsky and Abdulhalim explore one of the key technologies emerging within nanophotonics, that of nano-integrated photonic modulation devices and sensors. The attempt to integrate photonic dynamic devices with microelectronic circuits is becoming a major scientific as well as industrial trend due to the fact that currently processing is mainly achieved using microelectronic chips but transmission, especially for long distances, takes place via optical links. Unlocks the technologies that will turn the rapidly growing research area of nanophotonics into a major area of commercial development, with applications in telecommunications, computing, security and sensing Nano-integrated photonic modulation devices and sensors are the components that will see nanophotonics moving out of the lab into a new generation of products and services By covering the scientific fundamentals alongside technological applications, the authors open up this important multidisciplinary subject to readers from a range of scientific backgrounds
The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field. * Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field