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A dual-cathode arc plasma source was combined with acomputer-controlled bias amplifier such as to synchronize substrate biaswith the pulsed production of plasma. In this way, bias can be applied ina material-selective way. The principle has been applied to the synthesismetal-doped diamond-like carbon films, where the bias was applied andadjusted when the carbon plasma was condensing, and the substrate was atground when the metal was incorporated. In doing so, excessive sputteringby too-energetic metal ions can be avoided while the sp3/sp2 ratio can beadjusted. It is shown that the resistivity of the film can be tuned bythis species-selective bias. The principle can be extended tomultiple-material plasma sources and complex materials.
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Metal Plasma Immersion Ion Implantation and Deposition (MePIIID) is a hybrid process combining cathodic arc deposition and plasma immersion ion implantation. The properties of metal plasma produced by vacuum arcs are reviewed and the consequences for MePIIID are discussed. Different version of MePIIID are described and compared with traditional methods of surface modification such as ion beam assisted deposition (IBAD). MePIIID is a very versatile approach because of the wide range of ion species and energies used. In one extreme case, films are deposited with ions in the energy range 20--50 eV, and at the other extreme, ions can be implanted with high energy (100 keV or more) without film deposition. Novel features of the technique include the use of improved macroparticle filters; the implementation of several plasma sources for multi-element surface modification; tuning of ion energy during implantation and deposition to tailor the substrate-film intermixed layer and structure of the growing film; simultaneous pulsing of the plasma potential (positive) and substrate bias (negative) with a modified Marx generator; and the use of high ion charge states.
Plasma Source Ion Implantation research at Los Alamos Laboratory includes direct investigation of the plasma and materials science involved in target surface modification, numerical simulations of the implantation process, and supporting hardware engineering. Target materials of Al, Cr, Cu-Zn, Mg, Ni, Si, Ti, W, and various Fe alloys have been processed using plasmas produced from Ar, NH3, N2, CH4, and C2H2 gases. Individual targets with surface areas as large as (approximately)4 m2, or weighing up to 1200 kg, have been treated in the large LANL facility. In collaboration with General Motors and the University of Wisconsin, a process has been developed for application of hard, low friction, diamond-like-carbon layers on assemblies of automotive pistons. Numerical simulations have been performed using a 21/2-D particle- in-cell code, which yields time-dependent implantation energy, dose, and angle of arrival for ions at the target surface for realistic geometries. Plasma source development activities include the investigation of pulsed, inductively coupled sources capable of generating highly dissociated N with ion densities n{sub i} (approximately) 1011/cm3, at (approximately)100 W average input power. Cathodic arc sources have also been used to produce filtered metallic and C plasmas for implantation and deposition either in vacuum, or in conjunction with a background gas for production of highly adherent ceramic coatings.
The retained dose of implanted ions is limited by sputtering. It is known that a sacrificial layer deposited prior to ion implantation can lead to an enhanced retained dose. However, a higher ion energy is required to obtain a similar implantation depth due to the stopping of ions in the sacrificial layer. It is desirable to have a sacrificial layer of only a few monolayers thickness which can be renewed after it has been sputtered away. We explain the concept and describe two examples: (i) metal ion implantation using simultaneously a vacuum arc ion source and filtered vacuum arc plasma sources, and (ii) Metal Plasma Immersion Ion Implantation and Deposition (MePIIID). In MePIIID, the target is immersed in a metal or carbon plasma and a negative, repetitively pulsed bias voltage is applied. Ions are implanted when the bias is applied while the sacrificial layer suffers sputtering. Low-energy thin film deposition - repair of the sacrificial layer -- occurs between bias pulses. No foreign atoms are incorporated into the target since the sacrificial film is made of the same ion species as used in the implantation phase.