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"The technology behind integrated circuits is growing rapidly with billions of devices integrated on the same die. These devices operate at several gigahertz and require tens of watts, with voltage levels below a volt. Highly complicated on-chip networks manage and support the operation of these billions of devices. Resources, such as metal, power, and area, are however limited; these resources must be efficiently utilized. The increase in the number of metal layers within an integrated circuit does not keep up with device scaling, creating challenges in global signaling, synchronization, and power delivery. The objective is to address design, analysis, and optimization challenges for highly complicated structures. Power distribution networks, global signal networks, and monolithic substrate are considered in this dissertation. An effective impedance model of a monolithic substrate is developed within this dissertation, achieving high accuracy in estimating power/ground noise characteristics. A methodology for simultaneously inserting shields and repeaters is described, optimizing multiple resources for global signal interconnects. A closed-form model of the self- and mutual inductance of an interdigitated power and ground distribution network is described, providing less than 5% error for a typical power distribution network. The optimal width of the metal lines that minimizes the impedance of the power distribution network is determined, significantly enhancing the performance of an integrated circuit. A design methodology is also described for a multi-layer power distribution network, achieving enhanced reliability by equalizing the current density over multiple metal layers. Furthermore, a novel link breaking methodology for a mesh structured power distribution network is introduced, reducing coupling noise while improving the maximum operating frequency, on average, by 12%. Finally, a globally integrated power and clock distribution network is presented which utilizes a single network to distribute both global signals; thereby reducing the metal requirement. The performance of integrated circuits is highly affected by the power delivery system. The primary focus of this dissertation is the development of design and analysis methodologies for on-chip power delivery systems. Integrated circuits developed with these novel design methodologies will provide higher performance, while simultaneously consuming less power, area, and metal"--Leaves viii-ix.
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
This book provides insight into the behavior and design of power distribution systems for high speed, high complexity integrated circuits. Also presented are criteria for estimating minimum required on-chip decoupling capacitance. Techniques and algorithms for computer-aided design of on-chip power distribution networks are also described; however, the emphasis is on developing circuit intuition and understanding the principles that govern the design and operation of power distribution systems.
Although the information and communication technology (ICT) industry accounted for only 2 percent of global greenhouse gas emissions in 2007, the explosive increase in data traffic brought about by a rapidly growing user base of more than a billion wireless subscribers is expected to nearly double that number by 2020. It is clear that now is the time to rethink how we design and build our networks. Green Networking and Communications: ICT for Sustainability brings together leading academic and industrial researchers from around the world to discuss emerging developments in energy-efficient networking and communications. It covers the spectrum of research subjects, including methodologies and architectures for energy efficiency, energy-efficient protocols and networks, energy management, smart grid communications, and communication technologies for green solutions. Examines foraging-inspired radio-communication energy management for green multi-radio networks Considers a cross-layer approach to the design of energy-efficient wireless access networks Investigates the interplay between cooperative device-to-device communications and green LTE cellular networks Considers smart grid energy procurement for green LTE cellular networks Details smart grid networking protocols and standards Considering the spectrum of energy-efficient network components and approaches for reducing power consumption, the book is organized into three sections: Energy Efficiency and Management in Wireless Networks, Cellular Networks, and Smart Grids. It addresses many open research challenges regarding energy efficiency for IT and for wireless sensor networks, including mobile and wireless access networks, broadband access networks, home networks, vehicular networks, intelligent future wireless networks, and smart grids. It also examines emerging standards for energy-efficient protocols. Since ICT technologies touch on nearly all sectors of the economy, the concepts presented in this text offer you the opportunity to make a substantial contribution to the reduction of global greenhouse gas emissions.
This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this second edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.
State-of-the-Art Approaches to Advance the Large-Scale Green Computing Movement Edited by one of the founders and lead investigator of the Green500 list, The Green Computing Book: Tackling Energy Efficiency at Large Scale explores seminal research in large-scale green computing. It begins with low-level, hardware-based approaches and then traverses up the software stack with increasingly higher-level, software-based approaches. In the first chapter, the IBM Blue Gene team illustrates how to improve the energy efficiency of a supercomputer by an order of magnitude without any system performance loss in parallelizable applications. The next few chapters explain how to enhance the energy efficiency of a large-scale computing system via compiler-directed energy optimizations, an adaptive run-time system, and a general prediction performance framework. The book then explores the interactions between energy management and reliability and describes storage system organization that maximizes energy efficiency and reliability. It also addresses the need for coordinated power control across different layers and covers demand response policies in computing centers. The final chapter assesses the impact of servers on data center costs.
3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.
Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.
A presentation of state-of-the-art approaches from an industrial applications perspective, Communication Architectures for Systems-on-Chip shows professionals, researchers, and students how to attack the problem of data communication in the manufacture of SoC architectures. With its lucid illustration of current trends and research improving the performance, quality, and reliability of transactions, this is an essential reference for anyone dealing with communication mechanisms for embedded systems, systems-on-chip, and multiprocessor architectures—or trying to overcome existing limitations. Exploring architectures currently implemented in manufactured SoCs—and those being proposed—this book analyzes a wide range of applications, including: Well-established communication buses Less common networks-on-chip Modern technologies that include the use of carbon nanotubes (CNTs) Optical links used to speed up data transfer and boost both security and quality of service (QoS) The book’s contributors pay special attention to newer problems, including how to protect transactions of critical on-chip information (personal data, security keys, etc.) from an external attack. They examine mechanisms, revise communication protocols involved, and analyze overall impact on system performance.