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The development of photosensitive materials in general and photoreactive polymers in particular is responsible for major advances in the information, imaging, and electronic industries. Computer parts manufacturing, information storage, and book and magazine publishing all depend on photoreactive polymer systems. The photo-and radiation-induced processes in polymers are also active areas of research. New information on the preparation and properties of com mercially available photosensitive systems is constantly being acquired. The recent demand for environmentally safe solvent-free and water-soluble materials also motivated changes in the composition of photopolymers and photoresists. The interest in holographic recording media for head-up displays, light scanners, and data recording stimulated development of reconfigurable and visible light sensitive materials. Photoconductive polymerizable coatings are being tested in electrostatic proofing and color printing. The list of available initiators, poly meric binders, and other coating ingredients is continually evolving to respond to the requirements of low component loss (low diffusivity) and the high rate of photochemical reactions.
This handbook explains principles, processes, methods, and procedures of optical engineering in a concise and practical way. It emphasizes fundamental approaches and provides useful formulas and step-by-step worked-out examples to demonstrate applications and clarify calculation methods. The book covers refractive, reflective, and diffractive optical components; lens optical devices; modern fringe pattern analysis; optical metrology; Fourier optics and optical image processing; electro-optical and acousto-optical devices; spatial and spectral filters; optical fibers and accessories; optical fabrication; and more. It includes over 2,000 tables, flow charts, graphs, schematics, drawings, photographs, and mathematical expressions.
Ultra-high resolution holograms are now finding commercial and industrial applications in such areas as holographic maps, 3D medical imaging, and consumer devices. Ultra-Realistic Imaging: Advanced Techniques in Analogue and Digital Colour Holography brings together a comprehensive discussion of key methods that enable holography to be used as a te
Advanced Optical Instruments and Techniques includes twenty-three chapters providing processes, methods, and procedures of cutting-edge optics engineering design and instrumentation. Topics include biomedical instrumentation and basic and advanced interferometry. Optical metrology is discussed, including point and full-field methods. Active and adaptive optics, holography, radiometry, the human eye, and visible light are covered as well as materials, including photonics, nanophotonics, anisotropic materials, and metamaterials.
Integrating advances in instrumentation and methods, this work offers an approach to solving problems in surface and interface analysis, beginning with a particular problem and then explaining the most rational and efficient route to a solution. The book discusses electron optical and scanned probe microscopy, high spatial resolution imaging and synchrotron-based techniques. It emphasizes problem-solving for different classes of materials and material function.
Recent progress in organic and LED structures, in photorefractive response in molecular ferromagnetism, as well as the ultrafast and large non-linear optical response in conjugated systems are attracting great interest from the scientific community. The discovery of fullerenes has added further impetus to this field. Two areas bear particular promise for the development of a new electronics based on SEM materials: the integration of organic materials into the planar silicon technology such as, for instance, the advances in "all organic" field-effect transistors (FET) and the new organic light emitting diodes (LED); and secondly the appearance of a totally new electronics in which photons, rather than electrons, carry the information and SEM materials act as switching devices. Both aspects and more are covered in this volume. The quality of the 52 contributions attests to the fact that this subject area has progressed from the level of a scientific curiosity to a mature field of materials science introducing important technological perspectives for electronic applications.
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.