Download Free On Stochastic Modelling Of Very Large Scale Integrated Circuits Book in PDF and EPUB Free Download. You can read online On Stochastic Modelling Of Very Large Scale Integrated Circuits and write the review.

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits. Demonstrates how to overcome "interconnect bottleneck" with 3-D integrated circuit design...leading edge design techniques offer solutions to problems (performance/power consumption/price) faced by all circuit designers The FIRST book on 3-D integrated circuit design...provides up-to-date information that is otherwise difficult to find Focuses on design issues key to the product development cycle...good design plays a major role in exploiting the implementation flexibilities offered in the 3-D Provides broad coverage of 3-D integrated circuit design, including interconnect prediction models, thermal management techniques, and timing optimization...offers practical view of designing 3-D circuits
Masters Theses in the Pure and Applied Sciences was first conceived, published, and disseminated by the Center for Information and Numerical Data Analysis and Synthesis (CINDAS) * at Purdue University in 1957, starting its coverage of theses with the academic year 1955. Beginning with Volume 13, the printing and dissemination phases of the activity were transferred to University Microfilms/Xerox of Ann Arbor, Michigan, with the thougtit that such an arrangement would be more beneficial to the academic and general scientific and technical community. After five years of this joint undertaking we had concluded that it was in the interest of all con cerned if the printing and distribution of the volumes were handled by an interna tional publishing house to assure improved service and broader dissemination. Hence, starting with Volume 18, Masters Theses in the Pure and Applied Sciences has been disseminated on a worldwide basis by Plenum Publishing Cor poration of New York, and in the same year the coverage was broadened to include Canadian universities. All back issues can also be ordered from Plenum. We have reported in Volume 31 (thesis year 1986) a total of 11 ,480 theses titles trom 24 Canadian and 182 United States universities. We are sure that this broader base tor these titles reported will greatly enhance the value ot this important annual reterence work. While Volume 31 reports theses submitted in 1986, on occasion, certain univer sities do re port theses submitted in previousyears but not reported at the time.
The Springer Handbook for Computational Intelligence is the first book covering the basics, the state-of-the-art and important applications of the dynamic and rapidly expanding discipline of computational intelligence. This comprehensive handbook makes readers familiar with a broad spectrum of approaches to solve various problems in science and technology. Possible approaches include, for example, those being inspired by biology, living organisms and animate systems. Content is organized in seven parts: foundations; fuzzy logic; rough sets; evolutionary computation; neural networks; swarm intelligence and hybrid computational intelligence systems. Each Part is supervised by its own Part Editor(s) so that high-quality content as well as completeness are assured.
This book provides readers with an up-to-date account of the use of machine learning frameworks, methodologies, algorithms and techniques in the context of computer-aided design (CAD) for very-large-scale integrated circuits (VLSI). Coverage includes the various machine learning methods used in lithography, physical design, yield prediction, post-silicon performance analysis, reliability and failure analysis, power and thermal analysis, analog design, logic synthesis, verification, and neuromorphic design. Provides up-to-date information on machine learning in VLSI CAD for device modeling, layout verifications, yield prediction, post-silicon validation, and reliability; Discusses the use of machine learning techniques in the context of analog and digital synthesis; Demonstrates how to formulate VLSI CAD objectives as machine learning problems and provides a comprehensive treatment of their efficient solutions; Discusses the tradeoff between the cost of collecting data and prediction accuracy and provides a methodology for using prior data to reduce cost of data collection in the design, testing and validation of both analog and digital VLSI designs. From the Foreword As the semiconductor industry embraces the rising swell of cognitive systems and edge intelligence, this book could serve as a harbinger and example of the osmosis that will exist between our cognitive structures and methods, on the one hand, and the hardware architectures and technologies that will support them, on the other....As we transition from the computing era to the cognitive one, it behooves us to remember the success story of VLSI CAD and to earnestly seek the help of the invisible hand so that our future cognitive systems are used to design more powerful cognitive systems. This book is very much aligned with this on-going transition from computing to cognition, and it is with deep pleasure that I recommend it to all those who are actively engaged in this exciting transformation. Dr. Ruchir Puri, IBM Fellow, IBM Watson CTO & Chief Architect, IBM T. J. Watson Research Center
"The last couple of years have been very busy for the semiconductor industry and researchers. The rapid speed of production channel length reduction has brought lithographic challenges to semiconductor modeling. These include stress optimization, transisto"
The two-volume set LNAI 10191 and 10192 constitutes the refereed proceedings of the 9th Asian Conference on Intelligent Information and Database Systems, ACIIDS 2017, held in Kanazawa, Japan, in April 2017. The total of 152 full papers accepted for publication in these proceedings was carefully reviewed and selected from 420 submissions. They were organized in topical sections named: Knowledge Engineering and Semantic Web; Social Networks and Recommender Systems; Text Processing and Information Retrieval; Intelligent Database Systems; Intelligent Information Systems; Decision Support and Control Systems; Machine Learning and Data Mining; Computer Vision Techniques; Advanced Data Mining Techniques and Applications; Intelligent and Context Systems; Multiple Model Approach to Machine Learning; Applications of Data Science; Artificial Intelligence Applications for E-services; Automated Reasoning and Proving Techniques with Applications in Intelligent Systems; Collective Intelligence for Service Innovation, Technology Opportunity, E-Learning and Fuzzy Intelligent Systems; Intelligent Computer Vision Systems and Applications; Intelligent Data Analysis, Applications and Technologies for Internet of Things; Intelligent Algorithms and Brain Functions; Intelligent Systems and Algorithms in Information Sciences; IT in Biomedicine; Intelligent Technologies in the Smart Cities in the 21st Century; Analysis of Image, Video and Motion Data in Life Sciences; Modern Applications of Machine Learning for Actionable Knowledge Extraction; Mathematics of Decision Sciences and Information Science; Scalable Data Analysis in Bioinformatics and Biomedical Informatics; and Technological Perspective of Agile Transformation in IT organizations.