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The NODEPD symposium addressed the most recent developments in nanoscale electronic and photonic devices, encompassing one dimensional novel devices, processing, device fabrication, reliability, and other related topics.
The papers included in this issue of ECS Transactions were originally presented in the symposium ¿One-Dimensional Nanoscale Electronic and Photonic Devices 3¿, held during the 216th meeting of The Electrochemical Society, in Vienna, Austria from October 4 to 9, 2009.
In recent years, both Networks-on-Chip, as an architectural solution for high-speed interconnect, and power consumption, as a key design constraint, have continued to gain interest in the design and research communities. This book offers a single-source reference to some of the most important design techniques proposed in the context of low-power design for networks-on-chip architectures.
Advances in Inorganic Chemistry and Radiochemistry
Meeting the growing demands for speed and quality in rendering computer graphics images requires new techniques. Practical parallel rendering provides one of the most practical solutions. This book addresses the basic issues of rendering within a parallel or distributed computing environment, and considers the strengths and weaknesses of multiprocessor machines and networked render farms for graphics rendering. Case studies of working applications demonstrate, in detail, practical ways of dealing with complex issues involved in parallel processing.
With topics ranging from epitaxy through lattice defects and doping to quantum computation, this book provides a personalized survey of the development and use of silicon, the basis for the revolutionary changes in our lives sometimes called "The Silicon Age." Beginning with the very first developments more than 50 years ago, this reports on all aspects of silicon and silicon technology up to its use in exciting new technologies, including a glance at possible future developments.
During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.
This book describes the essentials of silicon wafer bonding from an engineering perspective. A beginning chapter deals with basic processes of wafer bonding in detail, and subsequent chapters cover bonding by mechanical removal, the Smart Cut method of hydrogen exfoliation, the ELTRAN thinning technique and hydrogen annealing, engineering methods of wafer characterization, and quality assurance for bonded wafers. A chapter on advanced applications looks at applications in optoelectronics, very large scale integration (VLSI), microelectromechanical systems (MEMS), and photonics. A glossary is included, plus a table comparing various bonding methods. The editors work in the private sector. Annotation copyrighted by Book News, Inc., Portland, OR
This book contains 35 review articles on nanoscience and nanotechnology that were first published in Nature Nanotechnology, Nature Materials and a number of other Nature journals. The articles are all written by leading authorities in their field and cover a wide range of areas in nanoscience and technology, from basic research (such as single-molecule devices and new materials) through to applications (in, for example, nanomedicine and data storage).