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This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.
This book is a first attempt to merge two different communities: scientists and technologists. Therefore, it is not a general overview covering all the fields of nanopackaging, but is mainly focused on two topics. The first topic deals with atomic scale devices or circuit requirements, as well as related recent technological developments; for example, surface science engineering and atomic scale interconnects studies. The second main part of the book brings CNT nano-materials solutions for resolving interconnect or thermal management problems in microelectronics device packaging. This book is not just useful for those who attended the International Workshop on Nanopackaging in Grenoble, but can provide valuable information to scientists and technologists in the nanopackaging community.
Written by leading international experts, this book summarizes the advances in sample preparation, design and construction of dangling bond atomic scale wires and logic gate circuits at the surface of a passivated semi-conductor. Individual chapters cover different aspects of the sample fabrication from research and development point of view, present design and construction as well as microscopic and spectroscopic characteristics of single dangling atomic wires and logic gates, and discuss the tools for design of large atomic scale circuit on a surface.This edited volume includes selected contributions from the “International Workshop on Atomic Wires” held in Krakow in September 2014 completed and updated with most current results up to mid-2016, and offers for the first time an overview of up-to-date knowledge in the burgeoning field of atomic scale circuits. The book will appeal to researchers and scholars interested in nanoscience and its various sub-fields including, in particular, molecular electronics, atomic scale electronics and nanoelectronics.
This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. The book is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of progress in their field, and others with interests in nanotechnology. It surveys the application of nanotechnologies to electronics packaging, as represented by current research across the field.
This book draws on the main themes covered during the International Workshop on Molecular Architectonics which took place in Shiretoko, Japan from August 3 to 6, 2015. The concepts and results explored in this book relate to the term “molecular architectonics” which stands for electronic, optical and information-processing functions being orchestrated by molecular assemblies. This area is defined as the third stage of single-molecule electronics and builds on stage one, where measurements were performed on single-molecule layered films, and stage two, the resulting quantitative analyses. In this work, experts come together to write about the most important aspects of molecular architectonics. This interdisciplinary, visionary and unique book is of interest to scientists working on electronic materials, surface science and information processing sciences using noise and fluctuation.
This book provides readers with an incisive look at cutting-edge peridynamic modeling methods, numerical techniques, their applications, and potential future directions for the field. It starts with an introductory chapter authored by Stewart Silling, who originally developed peridynamics. It then looks at new concepts in the field, with chapters covering dual-horizon peridynamics, peridynamics for axisymmetric analysis, beam and plate models in peridynamics, coupled peridynamics and XFEM, peridynamics for dynamic fracture modeling, and more. From there, it segues into coverage of cutting-edge applications of peridynamics, exploring its biological applications, modeling at the nanoscale, peridynamics for composites delamination and damage in ceramics, and more, concluding with a chapter on the application of artificial intelligence and machine learning in peridynamics. Covers modeling methods, numerical techniques, applications, and future directions for the field Discusses techniques such as dual-horizon peridynamics, damage modeling using the phase-field approach, and contact analysis of rigid and deformable bodies with refined non-ordinary state-based peridynamics Looks at a range of different peridynamic applications such as ice modeling, fiber-reinforced composite modeling, modeling at nanoscale, and more
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
This book covers diverse areas in which nanoscience and nanotechnology have led to significant technological advances and practical applications, with special emphasis on novel types of nanomaterials and their applicability into a new generation of nano- and micro-devices. Different nanomaterials are reviewed with a focus on several practical application areas and their commercial utilization. Production technologies of nanomaterials are presented as one of the challenges today. Sectors where nanotechnology has already significantly contributed are presented, along with specific nanotechnology solutions: energy related sectors, NEMS/MEMS, micro power generators, spintronics and healthcare. The basic properties and applications of nanostructured thermoelectric materials, ferroelectric and piezoelectric nanomaterials are reviewed. Examples of several developed thin-film thermogenerators are shown. A review of existing solutions and developing challenges are given regarding sustainable energy production, photovoltaics, solar cells, hydrogen economy and improved classes of batteries as contributions to green products and circular economy. Novel, highly promising areas in nanotechnology, are shown, such as voltage-driven nano-spintronics. Recent advances in friction characterisation at the nano level are described. Several proven nanomaterials have been reviewed pertaining to biomedicine. The use of nanomaterials in ophthalmology and cosmetic industry are reviewed, and the potential for silver nanoparticles and iron-based nanomaterials in biomedicine, also with recognised challenges and possible threats of non-controlled use of nanomaterials. This work is the result of joint efforts of different companies, academic, and research institutions participating in WIMB Tempus project, 543898-TEMPUS-1-2013-1-ES-TEMPUS-JPHES, "Development of Sustainable Interrelations between Education, Research and Innovation at WBC Universities in Nanotechnologies and Advanced Materials where Innovation Means Business", co-funded by the Tempus Programme of the European Union.
Smart Nanocontainers explores the fundamental concepts and emerging applications of nanocontainers in biomedicine, pharmaceuticals and smart materials. In pharmaceuticals, nanocontainers have advantages over their micro-counterparts, including more efficient drug detoxification, higher intracellular uptake, better stability, less side effects and higher biocompatibility with tissue and cells. In materials science, such as coating technology, they help by making coatings smarter, stronger and more durable. This important reference will help anyone who wants to learn more on how nanocontainers are used to provide the controlled release of active agents, including their applications in smart coatings, corrosion, drug delivery, diagnosis, agri-food and gas storage. Discusses how the molecular design of nanocarriers can be optimized to increase performance Explores how nanocarriers are being used to produce a new generation of active coatings Explains how nanocarriers are being used to deliver more effective nanoscale drug delivery
Nanotechnology for Food Packaging: Materials, Processing Technologies, and Safety Issues showcases the latest research in the use of nanotechnology in food packaging, providing an in-depth and interdisciplinary overview of the field. Nanoscale advances in materials science, processing technology and analytical techniques have led to the introduction of new, cheaper and safer packaging techniques. Simultaneously, the increasing use of renewable nanomaterials has made food packaging more sustainable. Chapters provide a comprehensive review on materials used, their structure–function relationship, and new processing technologies for the application and production of nanotechnology-based packaging materials. In addition, the book discusses the use of functional materials for the development of active, smart and intelligent packaging, possible migration and toxicity of nanomaterials for foods and regulatory aspects, and commercial applications. Provides detailed information on the use of nanomaterials and methodologies in food packaging, possible applications and regulatory barriers to commercialization Presents an interdisciplinary approach that brings together materials science, bioscience, and the industrial and regulatory aspects of the creation and uses of food packaging Helps those undertaking research and development in food packaging gain a cogent understanding on how nanotechnology is leading to the emergence of new packaging technologies