Christophe Brun
Published: 2013
Total Pages: 258
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Nanoelectronics applications will face limits imposed by physics laws, material properties, circuits and systems characteristics, assembly and packaging conditions. In this context, packaging will play a major role by providing an effective capability of complementing the nanometric device features to the circuit boards. Interconnecting the nanometric devices will be a major problem, especially on the global level. Assembly approaches are moving toward the system-level integration paradigm and new packaging technologies are proposed (3D system integration, wafer-level packaging, electro/optical integration). The conventional materials used in the classical packaging are expected to be inadequate in terms of thermal, mechanical and electrical performances. A possibility under investigation is the use of new materials in nanopackaging such as carbon nanotubes (CNTs), nanowires, nanoparticules and graphene (monoatomic layer of graphite). In this manuscript, CNTs (rolled-up sheets of graphene) are studied and revealed unique physical, electrical and thermal properties, which make them extremely attractive for many applications in the area of nanoelectronics. This new field of research concerns the use of nanomaterials applied to the packaging of electronics or photonic components. That can be for interconnect, thermal, mechanical, etc managements. In this manuscript, we will mainly focused on two main applications: interconnections based on CNTs for flip-chip technology and wireless interconnections using CNT monopole.