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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
"This volume is the joint proceedings of papers presented in Symposium D, 'High-k Insulators and Ferroelectrics for Advanced Microelectronic Devices,' and Symposium E, 'Integration Challenges in Next-Generation Oxide-Based Nanoelectronics,' held April 13-16 at the 2004 MRS Spring Meeting in San Francisco, California."--p. x
This volume focuses on methods to measures and model small-volume mechanical and tribological properties. Nanoscale characterization of the mechanical and tribological properties of surfaces is important in many engineering applications.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
The scaling of device dimensions with a simultaneous increase in functional density has imposed tremendous challenges for materials, technology, integration and reliability of interconnects. To meet requirements of the ITRS roadmap, new materials are being introduced at a faster pace in all functions of multilevel interconnects. The issues addressed in this book cannot be dispelled as simply selecting a low-k material and integrating it into a copper damascene process. The intricacies of the back end for sub-100nm technology include novel processing of low-k materials, employing pore-sealing techniques and capping layers, introducing advanced dielectric and diffusion barriers, and developing novel integration schemes. This is in addition to concerns of performance, yield, and reliability appropriate to nanoscaled interconnects. Although many challenges continue to impede progress along the ITRS roadmap, the contributions in this book confront them head-on. It provides a scientific understanding of the issues and stimulate new approaches to advanced multilevel interconnects.
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.