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Nano Plating (II): A Metallurgical Approach to Electrochemical Theory and Its Applications to Technology is the result of the author’s 50 years of research. The author reviews the vast experimental results of electrochemical phenomena in light of metallurgical knowledge and proposes theories that can give new insights in electrochemical thermodynamics and predict many phenomena in this field. The book complements Tohru Watanabe’s previous book on nano-plating published by Elsevier in 2004. Covers new electrochemical theories related to plating, including electroplating and electroless plating Explains the mechanism of dissolution and corrosion of metals in aqueous solutions Explains the power generation mechanism of various batteries, such as acid batteries and alkaline batteries Written by an expert in the field who has five decades of experience in metal electrodeposition and its structural investigation
Nano-plating (III): Database of Plated Film Microstructures completes the trilogy of nanoplating books written by Tohru Watanabe. Nanoplating (I) covers microstructure formation theory of plated films, with Nanoplating (II) covering a metallurgical approach to electrochemical theory and its applications to technology. This third installment shows the relationship between composition and microstructure of 27 pure metals and 55 alloy plating films, including electrodeposition and electroless plating and provides a database of plated film microstructures. The book presents readers with an efficient reference work that helps optimize their syntheses in order to obtain specific deposit types. Provides a database of plated film microstructures Shows the relationship between composition and microstructure of 27 pure metals and 55 alloy plating films, including electrodeposition and electroless plating Written by a real expert in the field who has over five decades of experience in metal electrodeposition and structural investigation
Publisher Description
Modern plating technology is highly advanced, and has developed to cover a wide range of applications. In addition to the traditional use for surface finishing, plating technology can now offer novel processes to fabricate high-performance films or fine microstructural bodies in the microelectronics industry. This rapid progress reflects the potential for the electroplating plating method to become one of today's leading-edge technologies. This book will introduce a concept of a Microstructure Control Theory for plated films, describe and discuss various experimental results that support the theory, and finally, present a collection of experimental data on 53 types of plated metal/alloy systems with a special emphasis on their microstructure.The unique feature of this database is that most of the plating baths are simple and contain no additives. In addition, amorphous materials were used as substrates to avoid the effects of substrate structure, and single-crystal substrates were chosen to study the epitaxial growth phenomenon. * Contains a comprehensive database for the microstructure of plated films * The book is very logically structured with a very detailed contents which makes finding information easy * The book gives a very good overview of the research and development in this field and each chapter is fully referenced
These proceedings of the 2012 International Conference on Electrical Insulating Materials and Electrical Engineering (EIMEE 2012) are grouped into eight chapters: Materials Science and Engineering; Mechanical Engineering and Applied Mechanics; Electrical Machinery and Engineering; Data, Image and Signal Processing; Control Theory and Control Engineering; Communication and Networks; Information Engineering and Technology; Other Related Topics.
This work comprises papers selected from the 2nd International Conference on Advanced Engineering Materials and Technology (AEMT 2012) which was held on the 15th to 17th June 2012 in Zhuhai, China. The peer-reviewed papers are grouped into sixteen chapters: Thin Films; Surface Engineering/Coatings; Modeling, Analysis and Simulation; Materials Forming; Materials Machining; Welding and Joining; Mechanical Behavior and Fracture; Computer Aided Material Design; Laser Processing Technology; Theory and Application of Friction and Wear; Dynamic Mechanical Analysis, Optimization and Control; Thermal Engineering Theory and Applications; Precision Manufacturing Technology and Measurements; Material Physics and Chemistry; Dynamic Analysis of Processing; Advanced Design Technology.
Selected, peer reviewed papers from the 2013 2nd International Conference on Micro Nano Devices, Structure and Computing Systems (MNDSCS 2013), January 23-24, 2013, Shenzhen, China
Collection of selected, peer reviewed papers from the 2014 International Conference on Mechatronics Engineering and Computing Technology (ICMECT 2014), April 9-10, 2014, Shanghai, China. Volume is indexed by Thomson Reuters CPCI-S (WoS). The 1531 papers are grouped as follows: Chapter 1: Materials Science and Materials Processing Technologies, Chapter 2: Building, Construction and Environmental Research, Chapter 3: Researches in Applied Mechanics and Mechanical Engineering, Chapter 4: Power and Electric Research, Electronics and Microelectronics, Embedded and Integrated Systems, Chapter 5: Mechatronics, Automation and Control, Chapter 6: Measurement and Instrumentation, Monitoring, Testing, Detection and Identification Technologies, Chapter 7: Computation Methods and Algorithms for Modeling, Simulation and Optimization, Data Mining and Data Processing, Chapter 8: Communication, Signal and Image Processing, Chapter 9: Information Technologies, WEB and Networks Engineering, Information Security and Software Application, Chapter 10: Modern Tendency in Area of Management, Logistics, Economics, Education, Traffic and Urban Engineering