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Proceedings of the May 1995 workshop. Contains 33 papers which review advances in Multichip Modules (MCM) technology, including ceramic based MCM-C, thin film MCM-D and organic laminate based MCM-L. Sensors based on micromachined silicon structures, thin, and thick film technology are reviewed. Applications of MCM to higher level integration and sensor integration and reliability impacts are presented. The authors address new materials development, characterized methods, and high level integration of sensors into electronic packaging. Annotation copyrighted by Book News, Inc., Portland, OR
Multi-chip modules (MCMs) with high wiring density, controlled impedance interconnects, and thermal management capability have recently been developed to address the problems posed by advances in electronic systems that make demands for higher speeds and complexity. MCM-C/Mixed Technologies and Thick Film Sensors highlights recent advances in MCM-C technology. Developments in materials and processes which have led to increased interconnection density are reviewed: finer resolution thick film inks, high performance-low temperature dielectric tapes, precision via generation by both laser and mechanical methods, and enhanced screen printing technologies have given us feature resolution to the 50 mum line/space level. Thermal management has greatly benefitted from such new materials as cofire AIN and diamond. MCM-C technology is compatible with thick film sensors, and work is reviewed on environmental gas sensors, pressure and temperature sensors, and the development of novel materials in this area.
Now in its third edition, Understanding Smart Sensors is the most complete, up-to-date, and authoritative summary of the latest applications and developments impacting smart sensors in a single volume. This thoroughly expanded and revised edition of an Artech bestseller contains a wealth of new material, including critical coverage of sensor fusion and energy harvesting, the latest details on wireless technology, the role and challenges involved with sensor apps and cloud sensing, greater emphasis on applications throughout the book, and dozens of figures and examples of current technologies from over 50 companies. This edition provides you with knowledge regarding a broad spectrum of possibilities for technology advancements based on current industry, university and national laboratories R & D efforts in smart sensors. Updated material also identifies the need for trusted sensing, the efforts of many organizations that impact smart sensing, and more. Utilizing the latest in smart sensor, microelectromechanical systems (MEMS) and microelectronic research and development, you get the technical and practical information you need keep your designs and products on the cutting edge. Plus, you see how network (wired and wireless) connectivity continues to impact smart sensor development. By combining information on micromachining and microelectronics, this is the first book that links these two important aspects of smart sensor technology so you don't have to keep multiple references on hand. This comprehensive resource also includes an extensive list of smart sensor acronyms and a glossary of key terms. With an effective blend of historical information and the latest content, the third edition of Understanding Smart Sensors provides a unique combination of foundational and future-changing information.
Explore the potential for nanotechnologies to transform future mobile and Internet communications. Based on a research collaboration between Nokia, Helsinki University of Technology, and the University of Cambridge, here leading researchers review the current state-of-the art and future prospects for: • Novel multifunctional materials, dirt repellent, self-healing surface materials, and lightweight structural materials capable of adapting their shape • Portable energy storage using supercapacitor-battery hybrids based on new materials including carbon nanohorns and porous electrodes, fuel cell technologies, energy harvesting and more efficient solar cells • Electronics and computing advances reaching beyond IC scaling limits, new computing approaches and architectures, embedded intelligence and future memory technologies. • Nanoscale transducers for mechanical, optical and chemical sensing, sensor signal processing, and nanoscale actuation • Nanoelectronics to create ultrafast and adaptive electronics for future radio technologies • Flat panel displays with greater robustness, improved resolution, brightness and contrast, and mechanical flexibility • Manufacturing and innovation processes, plus commercialization of nanotechnologies.
Sensors are the front end devices for information acquisition from the natural and/or artificial world. Higher performance of advanced sensing systems is achieved by using various types of machine intelligence. Intelligent sensors are smart devices with signal processing functions shared by distributed machine intelligence. Typical examples of intelligent sensors are the receptors and dedicated signal processing systems of the human sensory systems. The most important job of information processing in the sensory system is to extract necessary information from the receptors signals and transmit the useful information to the brain. This dedicated information processing is carried out in a distributed manner to reduce the work load of the brain. The processing also lightens the load of signal transmission through the neural network, the capacity of which is limited. Although the performance of the receptors in our human sensory system is not always ideal and is frequently inferior to that of man-made sensors, the total performance is usually far superior to those of our technical sensing systems. The weak points of human receptors are masked by the information processing. This processing makes our sensory system adaptable to the environment and optimizes system performance. The basic idea of this book, which contains new computing paradigms, is that the most advanced intelligent sensing system is the human sensory system. Section I reviews the technologies of intelligent sensors and discusses how they developed. Typical approaches for the realization of intelligent sensors emphasizing the architecture of intelligent sensing systems are also described. In section II, fundamental technologies for the fabrication of intelligent sensors and actuators are presented. Integration and micro-miniaturization techniques are emphasized. Section III presents advanced technologies approaching human sensory systems, these technologies are not directly aimed at practical applications, but introduce the readers to the development of engineering models of sensory systems. Technologies of integrated intelligent sensors, which will shortly be in use are introduced in section IV. In section V, examples are given of intelligent sensing systems which are used in industrial installations. Hardware for machine intelligence is not integrated at present, but can soon be implemented in the monolithic integrated structure. Without this machine intelligence, new functions, for example, self diagnosis or defects identification, cannot be realized. This section also demonstrates the potential of intelligent sensors in industry. Section VI introduces two interesting topics which are closely related to intelligent sensing systems. The first one is multisensor fusion. It is expected to be one of the fundamental and powerful technologies for realizing an advanced intelligent sensing systems. The second is visualizing technology of the sensed states for easy comprehension of the dynamic multi-dimensional state. This is useful for intelligent man-machine interfaces. This book will be recognised by readers as a milestone in the rapid progress of intelligent sensors.