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This practical introductory guide to injection molding simulation is aimed at both practicing engineers and students. It will help the reader to innovate and improve part design and molding processes, essential for efficient manufacturing. A user-friendly, case-study-based approach is applied, enhanced by many illustrations in full color. The book is conceptually divided into three parts: Chapters 1–5 introduce the fundamentals of injection molding, focusing the factors governing molding quality and how molding simulation methodology is developed. As they are essential to molding quality, the rheological, thermodynamic, thermal, mechanical, kinetic properties of plastics are fully elaborated in this part, as well as curing kinetics for thermoset plastics. Chapters 6–11 introduce CAE verification of design, a valuable tool for both part and mold designers toward avoiding molding problems in the design stage and to solve issues encountered in injection molding. This part covers design guidelines of part, gating, runner, and cooling channel systems. Temperature control in hot runner systems, prediction and control of warpage, and fiber orientation are also discussed. Chapters 12–17 introduce research and development in innovative molding, illustrating how CAE is applied to advanced molding techniques, including co-/bi-Injection molding, gas-/water-assisted injection molding, foam injection molding, powder injection molding, resin transfer molding, and integrated circuit packaging. The authors come from the creative simulation team at CoreTech System (Moldex3D), winner of the PPS James L. White Innovation Award 2015. Several CAE case study exercises for execution in the Moldex3D software are included to allow readers to practice what they have learned and test their understanding.
This book covers a wide range of applications and uses of simulation and modeling techniques in polymer injection molding, filling a noticeable gap in the literature of design, manufacturing, and the use of plastics injection molding. The authors help readers solve problems in the advanced control, simulation, monitoring, and optimization of injection molding processes. The book provides a tool for researchers and engineers to calculate the mold filling, optimization of processing control, and quality estimation before prototype molding.
This book covers fundamental principles and numerical methods relevant to the modeling of the injection molding process. As injection molding processing is related to rheology, mechanical and chemical engineering, polymer science and computational methods, and is a rapidly growing field, the book provides a multidisciplinary and comprehensive introduction to the subjects required for an understanding of the complex process. It addresses the up-to-date status of fundamental understanding and simulation technologies, without losing sight of still useful classical approaches. The main chapters of the book are devoted to the currently active fields of flow-induced crystallization and orientation evolution of fiber suspensions, respectively, followed by detailed discussion of their effects on mechanical property, shrinkage and warpage of injection-molded products. The level of the proposed book will be suitable for interested scientists, R&D engineers, application engineers, and graduate students in engineering.
Sheet Molding Compounds (SMC) are discontinuous fiber reinforced composites that are widely applied due to their ability to realize composite parts with long fibers at low cost. A novel Direct Bundle Simulation (DBS) method is proposed in this work to enable a direct simulation at component scale utilizing the observation that fiber bundles often remain in a bundled configuration during SMC compression molding.
Given the importance of injection molding as a process as well as the simulation industry that supports it, there was a need for a book that deals solely with the modeling and simulation of injection molding. This book meets that need. The modeling and simulation details of filling, packing, residual stress, shrinkage, and warpage of amorphous, semi-crystalline, and fiber-filled materials are described. This book is essential for simulation software users, as well as for graduate students and researchers who are interested in enhancing simulation. And for the specialist, numerous appendices provide detailed information on the topics discussed in the chapters.
There is a wealth of literature on modeling and simulation of polymer composite manufacturing processes. However, existing books neglect to provide a systematic explanation of how to formulate and apply science-based models in polymer composite manufacturing processes. Process Modeling in Composites Manufacturing, Second Edition provides tangible m
This book simultaneously addresses the subjects of successful molded product development and the practical application of injection molding simulation in this process. A strong emphasis is placed on establishing a clear understanding of the complex interaction between materials, process, mold design and part design, and how injection simulation can be used to evaluate this interaction.
This work presents novel simulation techniques for injection molding of fiber reinforced polymers. These include approaches for anisotropic flow modeling, hydrodynamic forces from fluid on fibers, contact forces between fibers, a novel fiber breakage modeling approach and anisotropic warpage analysis. Due to the coupling of fiber breakage and anisotropic flow modeling, the fiber breakage directly influences the modeled cavity pressure, which is validated with experimental data.
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Collection of 120 peer-reviewed papers that were presented at the 3rd International Conference on Advanced Research in Virtual and Rapid Prototyping, held in Leiria, Portugal in September 2007. Essential reading for all those working on V&RP, focused on inducing increased collaboration between industry and academia. In addition to key