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Abstract: "Several manufacturing challenges have accompanied the explosive growth in the scale of integration for VLSI circuits. One of these is the increased difficulty of generating manufacturing test sets, which has resulted from the vast increase in the ratio of the number of transistors to the number of I/O pins. The difficulty of test generation is crucial since it impacts both the resultant product quality and time to market, both of which continue to gain importance in the present day semiconductor industry. Design for testability (DFT) techniques can be used to offset this difficulty. The mechanics of such techniques are well understood. DFT techniques are also known to increase other manufacturing costs and to decrease performance. Thus the relevant issue facing designers is not how to use DFT, but rather if such techniques should be applied. The correct decision is a matter of economics. Integrated circuit (IC) designers must balance manufacturing costs, performance, time to market, and product quality concerns. Achieving the desired balance requires the ability to quantify trade-offs in the different manufacturing costs which various DFT techniques would affect. Unfortunately, test generation cost is among the least predictable of these affected costs, even though the principal reason that DFT techniques are often applied is to reduce the difficulty of test generation. Furthermore, there does not exist a complete understanding of which circuit attributes influence the difficulty of test generation. In this thesis, a model is developed which predicts the difficulty of automatic test generation for non-scan sequential circuits. This model is based on a newly recognized circuit attribute, termed density of encoding, which differs from those notions which have been used to describe this difficulty in the past. This thesis also discusses how the concept of the density of encoding can be applied to devise more powerful sequential automatic test pattern generation algorithms, more efficient DFT techniques, and more effective synthesis for testability schemes."
Abstract: "This paper introduces a model which describes the cost of automatic test pattern generation for (non-scan) sequential logic in terms of attributes of the circuit under test. This model addresses the core issue involved in IC design and test trade-offs, and can be used to evaluate the cost effectiveness of potential design-for-testability (DFT) techniques."
In Test Pattern Generation using Boolean Proof Engines, we give an introduction to ATPG. The basic concept and classical ATPG algorithms are reviewed. Then, the formulation as a SAT problem is considered. As the underlying engine, modern SAT solvers and their use on circuit related problems are comprehensively discussed. Advanced techniques for SAT-based ATPG are introduced and evaluated in the context of an industrial environment. The chapters of the book cover efficient instance generation, encoding of multiple-valued logic, usage of various fault models, and detailed experiments on multi-million gate designs. The book describes the state of the art in the field, highlights research aspects, and shows directions for future work.
Device testing represents the single largest manufacturing expense in the semiconductor industry, costing over $40 billion a year. The most comprehensive and wide-ranging book of its kind, Testing of Digital Systems covers everything you need to know about this vitally important subject. Starting right from the basics, the authors take the reader through every key area, including detailed treatment of the latest techniques such as system-on-a-chip and IDDQ testing. Written for students and engineers, it is both an excellent senior/graduate level textbook and a valuable reference.
Recent years have seen rapid strides in the level of sophistication of VLSI circuits. On the performance front, there is a vital need for techniques to design fast, low-power chips with minimum area for increasingly complex systems, while on the economic side there is the vastly increased pressure of time-to-market. These pressures have made the use of CAD tools mandatory in designing complex systems. Timing Analysis and Optimization of Sequential Circuits describes CAD algorithms for analyzing and optimizing the timing behavior of sequential circuits with special reference to performance parameters such as power and area. A unified approach to performance analysis and optimization of sequential circuits is presented. The state of the art in timing analysis and optimization techniques is described for circuits using edge-triggered or level-sensitive memory elements. Specific emphasis is placed on two methods that are true sequential timing optimizations techniques: retiming and clock skew optimization. Timing Analysis and Optimization of Sequential Circuits covers the following topics: Algorithms for sequential timing analysis Fast algorithms for clock skew optimization and their applications Efficient techniques for retiming large sequential circuits Coupling sequential and combinational optimizations. Timing Analysis and Optimization of Sequential Circuits is written for graduate students, researchers and professionals in the area of CAD for VLSI and VLSI circuit design.
The increase in speed and the shrinking of technology has led to modern day ICs becoming more sensitive to timing related defects. These defects must be rectified to prevent hazards in the circuit. The timing related defects can be identified with At-Speed Testing using the path delay fault model. A subset of the total number of paths known as critical paths cannot be sequentially activated i.e. we cannot find two successive vectors that activate a fault along the path. The elimination of untestable paths helps us to save a lot of time. In this report a new method, called the Launch-on-Shift is used to determine the testability of critical paths. The method uses a vector pair in which the first vector is the scan in steady state vector and the second vector is the function of the first vector.