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Thin films play a key role in the material science of microelectronics, and the subject matter of thin-films divides naturally into two headings: processing / structure relationship, and structure / properties relationship. The first volume of Materials Science in Microelectronics focuses on the first relationship – that between processing and the structure of the thin-film. The state of the thin film’s surface during the period that one monolayer exists - before being buried in the next layer – determines the ultimate structure of the thin film, and thus its properties. This volume takes into consideration the following potential influencing factors: crystal defects, void structure, grain structure, interface structure in epitaxial films, the structure of amorphous films, and reaction-induced structure. An ideal text or reference work for students and researchers in material science, who need to learn the basics of thin films.
This book contains stories of women engineers’ paths through the golden age of microelectronics, stemming from the invention of the transistor in 1947. These stories, like the biographies of Marie Curie and the National Geographic’s stories of Jane Goodall’s research that inspired the authors will inspire and guide readers along unconventional pathways to contributions to microelectronics that we can only begin to imagine. The book explores why and how the women writing here chose their career paths and how they navigated their careers. This topic is of interest to a vast audience, from students to professionals to university advisers to industry CEOs, who can imagine the advantages of a future with a diverse work force. Provides insight into women’s early contributions to the field of microelectronics and celebrates the challenges they overcame; Presents compelling innovations from academia, research, and industry into advances, applications, and the future of microelectronics; Includes a fascinating look into topics such as nanotechnologies, video games, analog electronics, design automation, and neuromorphic circuits.
By helping students develop an intuitive understanding of the subject, Microelectronics teaches them to think like engineers. The second edition of Razavi’s Microelectronics retains its hallmark emphasis on analysis by inspection and building students’ design intuition, and it incorporates a host of new pedagogical features that make it easier to teach and learn from, including: application sidebars, self-check problems with answers, simulation problems with SPICE and MULTISIM, and an expanded problem set that is organized by degree of difficulty and more clearly associated with specific chapter sections.
The microelectronics evolution has given rise to many modern benefits but has also changed design methods and attitudes to learning. Technology advancements shifted focus from simple circuits to complex systems with major attention to high-level descriptions. The design methods moved from a bottom-up to a top-down approach. For today’s students, the most beneficial approach to learning is this top-down method that demonstrates a global view of electronics before going into specifics. Franco Maloberti uses this approach to explain the fundamentals of electronics, such as processing functions, signals and their properties. Here he presents a helpful balance of theory, examples, and verification of results, while keeping mathematics and signal processing theory to a minimum. Key features: Presents a new learning approach that will greatly improve students’ ability to retain key concepts in electronics studies Match the evolution of Computer Aided Design (CAD) which focuses increasingly on high-level design Covers sub-functions as well as basic circuits and basic components Provides real-world examples to inspire a thorough understanding of global issues, before going into the detail of components and devices Discusses power conversion and management; an important area that is missing in other books on the subject End-of-chapter problems and self-training sections support the reader in exploring systems and understanding them at increasing levels of complexity Inside this book you will find a complete explanation of electronics that can be applied across a range of disciplines including electrical engineering and physics. This comprehensive introduction will be of benefit to students studying electronics, as well as their lecturers and professors. Postgraduate engineers, those in vocational training, and design and application engineers will also find this book useful.
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Focuses on the design and production of integrated circuits specifically designed for a particular application from original equipment manufacturers. The book outlines silicon and GaAs semiconductor fabrication techniques and circuit configurations; compares custom design style; discusses computer-aided design tools; and more.
Microelectronic Circuit Designis known for being a technically excellent text. The new edition has been revised to make the material more motivating and accessible to students while retaining a student-friendly approach.Jaeger has added more pedagogy and an emphaisis on design through the use of design examples and design notes. Some pedagogical elements include chapter opening vignettes, chapter objectives, "Electronics in Action" boxes, a problem solving methodology, and "design note" boxes. The number of examples, including new design examples, has been increased, giving students more opportunity to see problems worked out. Additionally,some of the less fundamental mathematical material has been moved to the ARIS website. In addition this edition comes with aHomework Management System called ARIS, which includes 450 static problems.
When it comes to electronics, demand grows as technology shrinks. From consumer and industrial markets to military and aerospace applications, the call is for more functionality in smaller and smaller devices. Culled from the second edition of the best-selling Electronics Handbook, Microelectronics, Second Edition presents a summary of the current state of microelectronics and its innovative directions. This book focuses on the materials, devices, and applications of microelectronics technology. It details the IC design process and VLSI circuits, including gate arrays, programmable logic devices and arrays, parasitic capacitance, and transmission line delays. Coverage ranges from thermal properties and semiconductor materials to MOSFETs, digital logic families, memory devices, microprocessors, digital-to-analog and analog-to-digital converters, digital filters, and multichip module technology. Expert contributors discuss applications in machine vision, ad hoc networks, printing technologies, and data and optical storage systems. The book also includes defining terms, references, and suggestions for further reading. This edition features two new sections on fundamental properties and semiconductor devices. With updated material and references in every chapter, Microelectronics, Second Edition is an essential reference for work with microelectronics, electronics, circuits, systems, semiconductors, logic design, and microprocessors.
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The