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The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.
This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.
Includes bibliographical references and index.
This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.
This book provides a comprehensive reference for both academia and industry on the fundamentals, technology details, and applications of Advanced Driver-Assistance Systems (ADAS) and autonomous driving, an emerging and rapidly growing area. The book written by experts covers the most recent research results and industry progress in the following areas: ADAS system design and test methodologies, advanced materials, modern automotive technologies, artificial intelligence, reliability concerns, and failure analysis in ADAS. Numerous images, tables, and didactic schematics are included throughout. This essential book equips readers with an in-depth understanding of all aspects of ADAS, providing insights into key areas for future research and development. • Provides comprehensive coverage of the state-of-the-art in ADAS • Covers advanced materials, deep learning, quality and reliability concerns, and fault isolation and failure analysis • Discusses ADAS system design and test methodologies, novel automotive technologies • Features contributions from both academic and industry authors, for a complete view of this important technology
Solid State Lighting Reliability: Components to Systems begins with an explanation of the major benefits of solid state lighting (SSL) when compared to conventional lighting systems including but not limited to long useful lifetimes of 50,000 (or more) hours and high efficacy. When designing effective devices that take advantage of SSL capabilities the reliability of internal components (optics, drive electronics, controls, thermal design) take on critical importance. As such a detailed discussion of reliability from performance at the device level to sub components is included as well as the integrated systems of SSL modules, lamps and luminaires including various failure modes, reliability testing and reliability performance. A follow-up, Solid State Lighting Reliability Part 2, was published in 2017.
Annotation Based on his training in metallurgy and experience in a large British gear manufacturing company, Parrish reviews the microstructural features of metal products that have been carbon case-hardened, and the influence of those features on the more important material properties. He is not concerned with the carbonizing process at all. He primarily addresses students of engineering and ferrous metallurgy, but also stress and design engineers who might want to understand more fully the specifications of the materials they are considering for their designs. He wrote the eight articles to summarize the field's literature of the early 1970s for his own convenience, but at invitation, published them as a series in the Heat Treatment of Metals during 1967-77, and collected them for a first edition of the volume in 1980. Annotation copyrighted by Book News, Inc., Portland, OR.
Unlike books currently on the market, this book attempts to satisfy two goals: combine circuits and electronics into a single, unified treatment, and establish a strong connection with the contemporary world of digital systems. It will introduce a new way of looking not only at the treatment of circuits, but also at the treatment of introductory coursework in engineering in general. Using the concept of ''abstraction,'' the book attempts to form a bridge between the world of physics and the world of large computer systems. In particular, it attempts to unify electrical engineering and computer science as the art of creating and exploiting successive abstractions to manage the complexity of building useful electrical systems. Computer systems are simply one type of electrical systems.+Balances circuits theory with practical digital electronics applications.+Illustrates concepts with real devices.+Supports the popular circuits and electronics course on the MIT OpenCourse Ware from which professionals worldwide study this new approach.+Written by two educators well known for their innovative teaching and research and their collaboration with industry.+Focuses on contemporary MOS technology.