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Micro-and Nanomechanics, Volume 5 of the Proceedings of the 2017 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the fifth volume of nine from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: MEMS & Energy Harvesting1D & 2D Materials/FabricationMicro/Nano Microscopy TechniquesNanomechanicsFlexible & Stretchable ElectronicsInterfaces & Adhesion
Micro-and Nanomechanics, Volume 5 of the Proceedings of the 2016 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the fifth volume of ten from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: MEMS: Materials & Interfaces Microscale & Microstructural Effects on Mechanical Behavior Novel Nano-scale Probes Nanoindentation & Beyond Nanomechanics Dynamic Micro/Nano Mechanics
Mechanics of Biological Systems & Micro-and Nanomechanics, Volume 4 of the Proceedings of the 2018 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the fourth volume of eight from the Conference, brings together contributions to important areas of research and engineering. The collection presents early findings and case studies on a wide range of topics, including: Cell Mechanics & Traumatic Brain Injury Micromechanical Testing Adhesion and Fracture MEMS Devices and Technology Nano-scale Deformation Mechanisms 1D & 2D Materials Tribology & Wear Research and Applications in Progress
Thermomechanics & Infrared Imaging, Inverse Problem Methodologies and Mechanics of Additive & Advanced Manufactured Materials, and Advancement of Optical Methods & Digital Image Correlation, Volume 4 of the Proceedings of the 2021 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the fourth volume of four from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including: Test Design and Inverse Method Algorithms Inverse Problems: Virtual Fields Method Material Characterizations Using Thermography Fatigue, Damage & Fracture Evaluation Using Infrared Thermography Mechanics of Additive & Advanced Manufactured Materials DIC Methods & Its Applications Photoelasticity and Interferometry Applications Micro-Optics and Microscopic Systems Multiscale and New Developments in Optical Methods
Rapid pace of electronic technology evolution and current economic climate compel a merger of such technical areas as low-power digital electronics, microwave power circuits, optoelectronics, etc., which collectively have become the foundation of today's electronic technology.This Workshop aims at encouraging active cross-fertilization of the different 'species' in this electronic planet. The WOFE2015 had gather experts from academia, industry, and government agencies to review the recent exciting breakthroughs and their underlying physical mechanisms.This Monographs includes ten invited articles; cover topics ranging from Ultra-thin silicon nanowire solar cells, to hydrogen generation under illumination of GaN-based structures and from ultrafast response of nanoscale device structures to Power device optimization.
Electronic Enclosures, Housings and Packages considers the problem of heat management for electronics from an encasement perspective. It addresses enclosures and their applications for industrial electronics, as well as LED lighting solutions for stationary and mobile markets. The book introduces fundamental concepts and defines dimensions of success in electrical enclosures. Other chapters discuss environmental considerations, shielding, standardization, materials selection, thermal management, product design principles, manufacturing techniques and sustainability. Final chapters focus on business fundamentals by outlining successful technical propositions and potential future directions.
Advancements in Optical Methods, Digital Image Correlation & Micro-and Nanomechanics, Volume 4 of the Proceedings of the 2022 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the fourth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of optical methods ranging from traditional photoelasticity and interferometry to more recent DIC and DVC techniques, and includes papers in the following general technical research areas: DIC Methods & Its Applications Photoelsticity and Interferometry Applications Micro-Optics and Microscopic Systems Multiscale and New Developments in Optical Methods Extreme Nanomechanics In-Situ Nanomechanics Expanding Boundaries in Metrology Micro and Nanoscale Deformation MEMS for Actuation, Sensing and Characterization 1D & 2D Materials
The comprehensive reference and textbook serves as a timely, practical introduction to the principles of nanotribology and nanomechanics. Assuming some familiarity with macroscopic tribology, the book comprises chapters by internationally recognized experts, who integrate knowledge of the field from the mechanics and materials-science perspectives. They cover key measurement techniques, their applications, and theoretical modelling of interfaces, each beginning their contributions with macro- and progressing to microconcepts.
Trends in Computational Nanomechanics reviews recent advances in analytical and computational modeling frameworks to describe the mechanics of materials on scales ranging from the atomistic, through the microstructure or transitional, and up to the continuum. The book presents new approaches in the theory of nanosystems, recent developments in theoretical and computational methods for studying problems in which multiple length and/or time scales must be simultaneously resolved, as well as example applications in nanomechanics. This title will be a useful tool of reference for professionals, graduates and undergraduates interested in Computational Chemistry and Physics, Materials Science, Nanotechnology.
This book comprehensively summarizes the recent achievements and trends in encapsulation of micro- and nanocontainers for applications in smart materials. It covers the fundamentals of processing and techniques for encapsulation with emphasis on preparation, properties, application, and future prospects of encapsulation process for smart applications in pharmaceuticals, textiles, biomedical, food packaging, composites, friction/wear, phase change materials, and coatings. Academics, researchers, scientists, engineers, and students in the field of smart materials will benefit from this book.