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This textbook contains information essential for successful experiments at low temperatures. The first chapters describe the low-temperature properties of liquids and solid matter, including liquid helium. Most of the book is devoted to refrigeration techniques and the physics on which they rely, the definition of temperature, thermometry, and a variety of design and construction techniques. The lively and practical style make it easy to read and particularly useful to anyone beginning research in low-temperature physics. Low-temperature scientists will find it of great value due to its extensive compilation of materials data and relevant new results.
This practical book provides recipes for the construction of devices used in low temperature experimentation. It emphasizes what works, rather than what might be the optimum method, and lists current sources for purchasing components and equipment.
Recent discoveries of new materials and improvements in calorimetric techniques have given new impetus to the subject of specific heat. Nevertheless, there is a serious lack of literature on the subject. This invaluable book, which goes some way towards remedying that, is concerned mainly with the specific heat of matter at ordinary temperatures. It discusses the principles that underlie the theory of specific heat and considers a number of theoretical models in some detail. The subject matter ranges from traditional materials to those recently discovered — heavy fermion compounds, high temperature superconductors, spin glasses and so on — and includes a large number of figures, tables and references. The book will be particularly useful for advanced undergraduate and postgraduate students as well as academics and researchers./a
In writing this monograph, the aim has been to consider the mechanical properties of the wide range of materials now available in such a way as to start with the fundamental nature of these properties and to follow the discussion through to the point at which the reader is able to comprehend the significance or otherwise of the large amounts of data now available in design manuals and other compilations. In short, it is hoped that this volume will be used as a companion to these data compilations and as an aid to their interpretation. In attempting to cover such a wide field, a large degree of selection has been necessary, as complete volumes have been written on topics which here have had to be covered in a few pages or less. It is inevitable that not everyone will agree with the choice made, especially if it is his own subject which has been discussed rather briefly, and the author accepts full res ponsibility for the selection made. The book is written at a level which should be easily followed by a university graduate in science or engineer ing, although, if his background has not included a course in materials science, some groundwork may be lacking.
Most descriptions of polymers start at room temperature and end at the melting point. This textbook starts at very low temperatures and ends at room temperature. At low temperatures, may processes and relaxations are frozen which allows singular processes or separate relaxations to be studied. At room temperatures, or at the main glass transitions, many processes overlap and the properties are determined by relaxations. At low temperatures, there are temperature ranges with negligible influences by glass transitions. They can be used for investigating so-called basic properties which arise from principles of solid state physics. The chain structure of polymers, however, requires stringent modifications for establishing solid state physics of polymers. Several processes which are specific of polymers, occur only at low temperatures. There are also technological aspects for considering polymers at low temperatures. More and more applications of polymeric materials in low temperature technology appear. Some examples are thermal and electrical insulations, support elements for cryogenic devices, low-loss materials for high frequency equipments. It is hoped that, in addition to the scientific part, a data collection in the appendix may help to apply polymers more intensively in low temperature technology. The author greatly appreciates the contributions by his coworkers of the Kernforschungszentrum Karlsruhe in measurement and discussion of many data presented in the textbook and its appendix. Fruitful disccussions with the colleagues Prof. H. Baur, Prof. S. Hunklinger, Prof. D. Munz and Prof. R.
This book addresses the growing interest in low temperature technologies. Since the subject of low temperature materials and mechanisms is multidisciplinary, the chapters reflect the broadest possible perspective of the field. Leading experts in the specific subject area address the various related science and engineering chemistry, material science, electrical engineering, mechanical engineering, metallurgy, and physics.
Low Temperature Electronics: Physics, Devices, Circuits, and Applications summarizes the recent advances in cryoelectronics starting from the fundamentals in physics and semiconductor devices to electronic systems, hybrid superconductor-semiconductor technologies, photonic devices, cryocoolers and thermal management. Furthermore, this book provides an exploration of the currently available theory, research, and technologies related to cryoelectronics, including treatment of the solid state physical properties of the materials used in these systems. Current applications are found in infrared systems, satellite communications and medical equipment. There are opportunities to expand in newer fields such as wireless and mobile communications, computers, and measurement and scientific equipment. Low temperature operations can offer certain advantages such as higher operational speeds, lower power dissipation, shorter signal transmission times, higher semiconductor and metal thermal conductivities, and improved digital and analog circuit performance.The computer, telecommunication, and cellular phone market is pushing the semiconductor industry towards the development of very aggressive device and integrated circuit fabrication technologies. This is taking these technologies towards the physical miniaturization limit, where quantum effects and fabrication costs are becoming a technological and economical barrier for further development. In view of these limitations, operation of semiconductor devices and circuits at low temperature (cryogenic temperature) is studied in this book.* It is a book intended for a wide audience: students, scientists, technology development engineers, private companies, universities, etc.* It contains information which is for the first time available as an all-in-one source; Interdisciplinary material is arranged and made compatible in this book* It is a must as reference source
The need for alternate energy sources has led to the develop ment of prototype fusion and MHD reactors. Both possible energy systems in current designs usually require the use of magnetic fields for plasma confinement and concentration. For the creation and maintenance of large 5 to 15 tesla magnetic fields, supercon ducting magnets appear more economical. But the high magnetic fields create large forces, and the complexities of the conceptual reactors create severe space restrictions. The combination of re quirements, plus the desire to keep construction costs at a mini mum, has created a need for stronger structural alloys for service at liquid helium temperature (4 K). The complexity of the required structures requires that these alloys be weldable. Furthermore, since the plasma is influenced by magnetic fields and since magnet ic forces from the use of ferromagnetic materials in many configur ations may be additive, the best structural alloy for most applica tions should be nonmagnetic. These requirements have led to consideration of higher strength austenitic steels. Strength increases at low temperatures are achieved by the addition of nitrogen. The stability of the austenitic structure is retained by adding manganese instead of nickel, which is more expensive. Research to develop these higher strength austenitic steels is in process, primarily in Japan and the United States.
The birth of this monograph is partly due to the persistent efforts of the General Editor, Dr. Klaus Timmerhaus, to persuade the authors that they encapsulate their forty or fifty years of struggle with the thermal properties of materials into a book before they either expired or became totally senile. We recognize his wisdom in wanting a monograph which includes the closely linked properties of heat capacity and thermal expansion, to which we have added a little 'cement' in the form of elastic moduli. There seems to be a dearth of practitioners in these areas, particularly among physics postgraduate students, sometimes temporarily alleviated when a new generation of exciting materials are found, be they heavy fermion compounds, high temperature superconductors, or fullerenes. And yet the needs of the space industry, telecommunications, energy conservation, astronomy, medical imaging, etc. , place demands for more data and understanding of these properties for all classes of materials - metals, polymers, glasses, ceramics, and mixtures thereof. There have been many useful books, including Specific Heats at Low Tempera tures by E. S. Raja Gopal (1966) in this Plenum Cryogenic Monograph Series, but few if any that covered these related topics in one book in a fashion designed to help the cryogenic engineer and cryophysicist. We hope that the introductory chapter will widen the horizons of many without a solid state background but with a general interest in physics and materials.