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Contains the papers presented at the fourth International Seminar Numerical Analysis of Weldability held in September 1997 at Schloss Seggau near Graz, Austria.
Contains the papers presented at the fourth International Seminar "Numerical Analysis of Weldability" held in September 1997 at Schloss Seggau near Graz, Austria.
This proceedings volume contains a selection of papers presented at the symposium "International Conference on High Performance Scientific Computing'' held at the Hanoi Institute of Mathematics of the Vietnam National Center for Natural Science and Technology (NCST), March 10-14, 2003. The conference has been organized by the Hanoi Institute of Mathematics, SFB 359 ''Reactive Flows, Transport and Diffusion'', Heidelberg, Ho Chi Minh City University of Technology and Interdisciplinary Center for Scientific Computing (IWR), Heidelberg. The contributions cover the broad interdisciplinary spectrum of scientific computing and present recent advances in theory, development of methods, and applications in practice. Subjects covered are mathematical modelling, numerical simulation, methods for optimization and optimal control, parallel computing, symbolic computing, software development, applications of scientific computing in physics, chemistry, biology and mechanics, environmental and hydrology problems, transport, logistics and site location, communication networks, production scheduling, industrial and commercial problems.
This is the third in a series of compendiums devoted to the subject of weld hot cracking. It contains 22 papers presented at the 3rd International Hot Cracking Workshop in Columbus, Ohio USA in March 2010. In the context of this workshop, the term “hot cracking” refers to elevated temperature cracking associated with either the weld metal or heat-affected zone. These hot cracking phenomena include weld solidification cracking, HAZ and weld metal liquation cracking, and ductility-dip cracking. The book is divided into three major sections based on material type; specifically aluminum alloys, steels, and nickel-base alloys. Each of these sections begins with a keynote paper from prominent researchers in the field: Dr. Sindo Kou from the University of Wisconsin, Dr. Thomas Böllinghaus from BAM and the University of Magdeburg, and Dr. John DuPont from Lehigh University. The papers contained within include the latest insight into the mechanisms associated with hot cracking in these materials and methods to prevent cracking through material selection, process modification, or other means. The three Hot Cracking Phenomena in Welds compendiums combined contain a total of 64 papers and represent the best collection of papers on the topic of hot cracking ever assembled.
The aim of this major reference work is to provide a first point of entry to the literature for the researchers in any field relating to structural integrity in the form of a definitive research/reference tool which links the various sub-disciplines that comprise the whole of structural integrity. Special emphasis will be given to the interaction between mechanics and materials and structural integrity applications. Because of the interdisciplinary and applied nature of the work, it will be of interest to mechanical engineers and materials scientists from both academic and industrial backgrounds including bioengineering, interface engineering and nanotechnology. The scope of this work encompasses, but is not restricted to: fracture mechanics, fatigue, creep, materials, dynamics, environmental degradation, numerical methods, failure mechanisms and damage mechanics, interfacial fracture and nano-technology, structural analysis, surface behaviour and heart valves. The structures under consideration include: pressure vessels and piping, off-shore structures, gas installations and pipelines, chemical plants, aircraft, railways, bridges, plates and shells, electronic circuits, interfaces, nanotechnology, artificial organs, biomaterial prostheses, cast structures, mining... and more. Case studies will form an integral part of the work.
This book describes and systemizes analytical and numerical solutions for a broad range of instantaneous and continuous, stationary and moving, concentrated and distributed, 1D, 2D and 3D heat sources in semi-infinite bodies, thick plane layers, thin plates and cylinders under various boundary conditions. The analytical solutions were mainly obtained by the superimposing principle for various parts of the proposed 1D, 2D and 3D heat sources and based on the assumption that only heat conduction plays a major role in the thermal analysis of welds. Other complex effects of heat transfer in weld phenomena are incorporated in the solutions by means of various geometrical and energetic parameters of the heat source. The book is divided into 13 chapters. Chapter 1 briefly reviews various welding processes and the energy characteristics of welding heat sources, while Chapter 2 covers the main thermophysical properties of the most commonly used alloys. Chapter 3 describes the physical fundamentals of heat conduction during welding, and Chapter 4 introduces several useful methods for solving the problem of heat conduction in welding. Chapters 5 and 6 focus on the derivation of analytical solutions for many types of heat sources in semi-infinite bodies, thick plane layers, thin plates and cylinders under various boundary conditions. The heat sources can be instantaneous or continuous, stationary or moving, concentrated or distributed (1D, 2D or 3D). In Chapter 7 the temperature field under programmed heat input (pulsed power sources and weaving sources) is analyzed. In turn, Chapters 8 and 9 cover the thermal cycle, melting and solidification of the base metal. Heating and melting of filler metal are considered in Chapter 10. Chapter 11 addresses the formulation and solution of inverse heat conduction problems using zero-, first- and second-order algorithms, while Chapter 12 focuses on applying the solutions developed here to the optimization of welding conditions. In addition, case studies confirm the usefulness and feasibility of the respective solutions. Lastly, Chapter 13 demonstrates the prediction of local microstructure and mechanical properties of welded joint metals, while taking into account their thermal cycle. The book is intended for all researches, welding engineers, mechanical design engineers, research engineers and postgraduate students who deal with problems such as microstructure modeling of welds, analysis of the mechanical properties of welded metals, weldability, residual stresses and distortions, optimization of welding and allied processes (prewelding heating, cladding, thermal cutting, additive technologies, etc.). It also offers a useful reference guide for software engineers who are interested in writing application software for simulating welding processes, microstructure modeling, residual stress analysis of welds, and for robotic-welding control systems.
This book fills a gap by presenting our current knowledge and understanding of continuum-based concepts behind computational methods used for microstructure and process simulation of engineering materials above the atomic scale. The volume provides an excellent overview on the different methods, comparing the different methods in terms of their respective particular weaknesses and advantages. This trains readers to identify appropriate approaches to the new challenges that emerge every day in this exciting domain. Divided into three main parts, the first is a basic overview covering fundamental key methods in the field of continuum scale materials simulation. The second one then goes on to look at applications of these methods to the prediction of microstructures, dealing with explicit simulation examples, while the third part discusses example applications in the field of process simulation. By presenting a spectrum of different computational approaches to materials, the book aims to initiate the development of corresponding virtual laboratories in the industry in which these methods are exploited. As such, it addresses graduates and undergraduates, lecturers, materials scientists and engineers, physicists, biologists, chemists, mathematicians, and mechanical engineers.