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Die jüngsten Fortschritte im Bereich der drahtlosen Telekommunikation und dem Internet der Dinge sorgen bei drahtlosen Systemen, beim Satellitenfernsehen und bei intelligenten Transportsystemen der 5. Generation für eine höhere Nachfrage nach dielektrischen Materialien und modernen Fertigungstechniken. Diese Materialien bieten ausgezeichnete elektrische, dielektrische und thermische Eigenschaften und verfügen über enormes Potenzial, vor allem bei der drahtlosen Kommunikation, bei flexibler Elektronik und gedruckter Elektronik. Microwave Materials and Applications erläutert die herkömmlichen Methoden zur Messung der dielektrischen Eigenschaften im Mikrowellenbereich, die verschiedenen Ansätze zur Lösung von Problemen der Materialchemie und von Kristallstrukturen, in den Bereichen Doping, Substitution und Aufbau von Verbundwerkstoffen. Besonderer Schwerpunkt liegt auf Verarbeitungstechniken, Einflüssen der Morphologie und der Anwendung von Materialien in der Mikrowellentechnik. Gleichzeitig werden viele der jüngsten Forschungserkenntnisse bei Mikrowellen-Dielektrika und -Anwendungen zusammengefasst. Die verschiedenen Kapitel untersuchen: Oxidkeramiken für dielektrische Resonatoren und Substrate, HTCC-, LTCC- und ULTCC-Bänder für Substrate, Polymer-Keramik-Verbundstoffe für Leiterplatten, Elastomer-Keramik-Verbundstoffe für flexible Elektronik, dielektrische Tinten, Materialien für die EMV-Abschirmung, Mikrowellen-Ferrite. Ein umfassender Anhang präsentiert die grundlegenden Eigenschaften von mehr als 4000 verlustarmen dielektrischen Keramiken, deren Zusammensetzung, kristalline Struktur und dielektrischen Eigenschaften für Mikrowellenanwendungen. Microwave Materials and Applications wirft einen Blick auf sämtliche Aspekte von Mikrowellenmaterialien und -anwendungen, ein nützliches Handbuch für Wissenschaftler, Unternehmen, Ingenieure und Studenten, die sich mit heutigen und neuen Anwendungen in den Bereichen drahtlose Kommunikation und Unterhaltungselektronik beschäftigen.
The book summarizes the current state of the know-how in the field of perovskite materials: synthesis, characterization, properties, and applications. Most chapters include a review on the actual knowledge and cutting-edge research results. Thus, this book is an essential source of reference for scientists with research fields in energy, physics, chemistry and materials. It is also a suitable reading material for graduate students.
The recent rapid progress in wireless telecommunication, including the Internet of Things, 5th generation wireless systems, satellite broadcasting, and intelligent transport systems has increased the need for low-loss dielectric materials and modern fabrication techniques. These materials have excellent electrical, dielectric, and thermal properties and have enormous potential, especially in wireless communication, flexible electronics, and printed electronics. Microwave Materials and Applications discusses the methods commonly employed for measuring microwave dielectric properties, the various attempts reported to solve problems of materials chemistry and crystal structure, doping, substitution, and composite formation, highlighting the processing techniques, morphology influences, and applications of microwave materials whilst summarizing many of the recent technical research accomplishments in the area of microwave dielectrics and applications Chapters examine: Oxide ceramics for dielectric resonators and substrates HTCC, LTCC and ULTCC tapes for substrates Polymer ceramic composites for printed circuit boards Elastomer-ceramic composites for flexible electronics Dielectric inks EMI shielding materials Microwave ferrites A comprehensive Appendix presents the fundamental properties for more than 4000 low-loss dielectric ceramics, their composition, crystal structure, and their microwave dielectric properties. Microwave Materials and Applications presents a comprehensive view of all aspects of microwave materials and applications, making it useful for scientists, industrialists, engineers, and students working on current and emerging applications of wireless communications and consumer electronics.
An overview of the virtual crack closure technique is presented. The approach used is discussed, the history summarized, and insight into its applications provided. Equations for two-dimensional quadrilateral elements with linear and quadratic shape functions are given. Formula for applying the technique in conjuction with three-dimensional solid elements as well as plate/shell elements are also provided. Necessary modifications for the use of the method with geometrically nonlinear finite element analysis and corrections required for elements at the crack tip with different lengths and widths are discussed. The problems associated with cracks or delaminations propagating between different materials are mentioned briefly, as well as a strategy to minimize these problems. Due to an increased interest in using a fracture mechanics based approach to assess the damage tolerance of composite structures in the design phase and during certification, the engineering problems selected as examples and given as references focus on the application of the technique to components made of composite materials.
This proceedings contains papers presented at the Advanced Dielectric Materials: Design, Preparation, Processing and Applications; and Advanced Dielectrics for Wireless Communications symposia. Topics include design of material, materials synthesis and processing, processing-microstructure-property relationship, multilayer device materials, thin and thick films, device applications, low temperature co-fired ceramics (LTCC)for multilayer devices, microwave dielectric materials and much more.
Ferroelectric materials have been and still are widely used in many applications, that have moved from sonar towards breakthrough technologies such as memories or optical devices. This book is a part of a four volume collection (covering material aspects, physical effects, characterization and modeling, and applications) and focuses on ways to obtain high-quality materials exhibiting large ferroelectric activity. The book covers the aspect of material synthesis and growth, doping and composites, lead-free devices, and thin film synthesis. The aim of this book is to provide an up-to-date review of recent scientific findings and recent advances in the field of ferroelectric materials, allowing a deep understanding of the material aspects of ferroelectricity.
This proceedings volume contains a collection of 34 papers from the following symposia held during the 2015 Materials Science and Technology (MS&T '15) meeting: Innovative Processing and Synthesis of Ceramics, Glasses and Composites Advances in Ceramic Matrix Composites Advanced Materials for Harsh Environments Advances in Dielectric Materials and Electronic Devices Controlled Synthesis, Processing, and Applications of Structure and Functional Nanomaterials Processing and Performance of Materials Using Microwaves, Electric and Magnetic Fields, Ultrasound, Lasers, and Mechanical Work, Rustum Roy Memorial Symposium Sintering and Related Powder Processing Science and Technologies Surface Protection for Enhanced Materials Performance: Science, Technology, and Application Thermal Protection Materials and Systems Ceramic Optical Materials Alumina at the Forefront of Technology
This volume comprises the main ideas and the latest results in the study of electromagnetic materials, as presented at the Symposium on Electromagnetic Materials, ICMAT 2005.The high quality contributions reflect the principle aims of the conference: to provide an international forum for scientists and engineers to report their most recent research findings, to exchange ideas and information, and to nuture and establish research ties. Electromagnetic materials have both civilian and defence applications, such as novel antenna designs, protection against high power transients in densely packed printed circuits, and special frequency response or polarization response to meet component or system specifications. An in-depth understanding of the responses of materials to electromagnetic waves may even enable us to design and fabricate materials with properties not found in nature.
Recent developments in microelectronics technologies have created a great demand for interlayer dielectric materials with a very low dielectric constant. They will play a crucial role in the future generation of IC devices (VLSI/UISI and high speed IC packaging). Considerable efforts have been made to develop new low as well as high dielectric constant materials for applications in electronics industries. Besides achieving either low or high dielectric constants, other materials' properties such as good processability, high mechanical strength, high thermal and environmental stability, low thermal expansion, low current leakage, low moisture absorption, corrosion resistant, etc., are of equal importance. Many chemical and physical strategies have been employed to get desired dielectric materials with high performance. This is a rapidly growing field of science--both in novel materials and their applications to future packing technologies. The experimental data on inorganic and organic materials having low or high dielectric constant remail scattered in the literature. It is timely, therfore, to consolidate the current knowledge on low and high dielectric constant materials into a sigle reference source. Handbook of Low and High Dielectric Constant Materials and Their Applications is aimed at bringing together under a sigle cover (in two volumes) all low and high dielectric constant materials currently studied in academic and industrial research covering all spects of inorgani an organic materials from their synthetic chemistry, processing techniques, physics, structure-property relationship to applications in IC devices. This book will summarize the current status of the field covering important scientific developments made over the past decade with contributions from internationally recognized experts from all over the world. Fully cross-referenced, this book has clear, precise, and wide appeal as an essential reference source for all those interested in low and high dielectric constant material.
This volume features fundamental research and applications in the field of the design and application of engineering materials, predominantly within the context of mechanical engineering applications. This includes a wide range of materials engineering and technology, including metals, e.g., polymers, composites, and ceramics. Advanced applications would include manufacturing in the new or newer materials, testing methods, multi-scale experimental and computational aspects. This book features fundamental research and applications in the design of engineering materials, predominantly within the context of mechanical engineering applications such as automobile, railway, marine, aerospace, biomedical, pressure vessel technology, and turbine technology. It covers a wide range of materials, including metals, polymers, composites, and ceramics. Advanced applications include the manufacturing of new materials, testing methods, multi-scale experimental and computational aspects. p>