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The intent of this tutorial is to overview the technology of multi-level polysilicon surface micromachining, to present examples of devices which fully utilize this level of complexity, and to discuss what they believe to be significant issues which are not fully resolved. Following this intent, the tutorial consists of four sections. The first is an introduction and description of multi-level polysilicon surface micromachining and its potential benefits. Specifically, the inclusion of a third deposited layer of mechanical polysilicon greatly extends the degree of complexity available for micromechanism design. The second section introduces wafer planarization by CMP as a process tool for surface micromachining. The third section presents examples of actuated geared micromechanisms which require the multi-level fabrication process. Demonstration of actuation mechanisms coupled to external devices are illustrated. Finally, polysilicon surface micromachining fabrication technology has reached a level where many device designs, for the most part, can be embodied in the technology to produce a mechanical construct which provides the desired function. When designed properly, the fabricated mechanical element, if free to operate, will produce the desired function. However, one set of issues which can hinder or prevent operation are related to the post-fabricated device surfaces. These surface issues; namely, stiction, friction, and wear, are emphasized in the final section as a major hindrance to realizing the full potential of surface micromachined devices.
Learn Intel 64 assembly language and architecture, become proficient in C, and understand how the programs are compiled and executed down to machine instructions, enabling you to write robust, high-performance code. Low-Level Programming explains Intel 64 architecture as the result of von Neumann architecture evolution. The book teaches the latest version of the C language (C11) and assembly language from scratch. It covers the entire path from source code to program execution, including generation of ELF object files, and static and dynamic linking. Code examples and exercises are included along with the best code practices. Optimization capabilities and limits of modern compilers are examined, enabling you to balance between program readability and performance. The use of various performance-gain techniques is demonstrated, such as SSE instructions and pre-fetching. Relevant Computer Science topics such as models of computation and formal grammars are addressed, and their practical value explained. What You'll Learn Low-Level Programming teaches programmers to: Freely write in assembly language Understand the programming model of Intel 64 Write maintainable and robust code in C11 Follow the compilation process and decipher assembly listings Debug errors in compiled assembly code Use appropriate models of computation to greatly reduce program complexity Write performance-critical code Comprehend the impact of a weak memory model in multi-threaded applications Who This Book Is For Intermediate to advanced programmers and programming students
As one of the eighteen field-specific reports comprising the comprehensive scope of the strategic general report of the Chinese Academy of Sciences, this sub-report addresses long-range planning for developing science and technology in the field of advanced materials science. They each craft a roadmap for their sphere of development to 2050. In their entirety, the general and sub-group reports analyze the evolution and laws governing the development of science and technology, describe the decisive impact of science and technology on the modernization process, predict that the world is on the eve of an impending S&T revolution, and call for China to be fully prepared for this new round of S&T advancement. Based on the detailed study of the demands on S&T innovation in China's modernization, the reports draw a framework for eight basic and strategic systems of socio-economic development with the support of science and technology, work out China's S&T roadmaps for the relevant eight basic and strategic systems in line with China's reality, further detail S&T initiatives of strategic importance to China's modernization, and provide S&T decision-makers with comprehensive consultations for the development of S&T innovation consistent with China's reality. Supported by illustrations and tables of data, the reports provide researchers, government officials and entrepreneurs with guidance concerning research directions, the planning process, and investment. Founded in 1949, the Chinese Academy of Sciences is the nation's highest academic institution in natural sciences. Its major responsibilities are to conduct research in basic and technological sciences, to undertake nationwide integrated surveys on natural resources and ecological environment, to provide the country with scientific data and consultations for government's decision-making, to undertake government-assigned projects with regard to key S&T problems in the process of socio-economic development, to initiate personnel training, and to promote China's high-tech enterprises through its active engagement in these areas.
This book carefully details design tools and techniques for high-performance ASIC design. Using these techniques, the performance of ASIC designs can be improved by two to three times. Important topics include: Improving performance through microarchitecture; Timing-driven floorplanning; Controlling and exploiting clock skew; High performance latch-based design in an ASIC methodology; Automatically identifying and synthesizing complex logic gates; Automated cell sizing to increase performance and reduce power; Controlling process variation.These techniques are illustrated by designs running two to three times the speed of typical ASICs in the same process generation.
"WHAT DOES NOT NEED TO BE BIG, WILL BE SMALL", a word by an engineer at a recent conference on chips technology. This sentence is particularly true for chemistry. Microfabrication technology emerged from microelectronics into areas like mechanics and now chemistry and biology. The engineering of micron and submicron sized features on the surface of silicon, glass and polymers opens a whole new world. Micromotors smaller than human hair have been fabricated and they work fine. It is the declared goal of the authors to bring these different worlds together in this volume. Authors have been carefully chosen to guarantee for the quality of the contents. An engineer, a chemist or a biologist will find new impulses from the various chapters in this book.
A methodology for using domino logic in an ASIC design flow for graduate students, researchers, and circuit designers in industry.
Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, also describes the properties of other SOI devices, such as multiple gate MOSFETs, dynamic threshold devices and power MOSFETs. The advantages and performance of SOI circuits used in both niche and mainstream applications are discussed in detail. The SOI specialist will find this book invaluable as a source of compiled references covering the different aspects of SOI technology. For the non-specialist, the book serves an excellent introduction to the topic with detailed, yet simple and clear explanations. Silicon-on-Insulator Technology: Materials to VLSI, Third Edition is recommended for use as a textbook for classes on semiconductor device processing and physics at the graduate level.
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