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The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
The papers in this volume cover all aspects of laser assisted surface processing ranging from the preparation of high-Tc superconducting layer structures to industrial laser applications for device fabrication. The topics presented give recent results in organometallic chemistry and laser photochemistry, and novel surface characterization techniques. The ability to control the surface morphology by digital deposition and etching shows one of the future directions for exciting applications of laser surface processing, some of which may apply UV and VUV excitation. The understanding of elementary proceses is essential for the design of novel deposition methods, with diamond CVD being an outstanding example. The high quality of these contributions once again demonstrates that the E-MRS is an efficient forum for interaction between research workers and industry.
High purity, thin metal coatings have a variety of important commercial applications, for example, in the microelectronics industry, as catalysts, as protective and decorative coatings as well as in gas-diffusion barriers. This book offers detailed, up- to-date coverage of the chemistry behind the vapor deposition of different metals from organometallic precursors. In nine chapters, the CVD of metals including aluminum, tungsten, gold, silver, platinum, palladium, nickel, as well as copper from copper(I) and copper(II) compounds is covered. The synthesis and properties of the precursors, the growth process, morphology, quality and adhesion of the resulting films as well as laser- assisted, ion- assisted and plasma-assisted methods are discussed. Present applications and prospects for future developments are summarized. With ca. 1000 references and a glossary, this book is a unique source of in-depth information. It is indispensable for chemists, physicists, engineers and materials scientists working with metal- coating processes and technologies. From Reviews: 'I highly recommend this book to anyone interested in learning more about the chemistry of metal CVD.' J. Am Chem. Soc.
When we see a jumbo jet at the airport, we sometimes wonder how such a huge, heavy plane can fly high in the sky. To the extent that we think in a static way, it is certainly not understandable. In such a manner, dynamics yields behavior quite different from statics. When we want to prepare an iron nitride, for example, one of the most orthodox ways is to put iron in a nitrogen atmosphere under pressures higher than the dissociation pressure of the iron nitride at temperatures sufficiently high to let the nitrogen penetrate into the bulk iron. This is the way thermodynamics tells us to proceed, which requires an elaborate, expensive high-pressure apparatus, sophisticated techniques, and great efforts. However, if we flow ammonia over the iron, even under low pressures, we can easily prepare the nitride-provided the hydrogen pressure is sufficiently low. Since the nitrogen desorption rate is the determining step of the ammonia decomposition on the iron surface, the virtual pressure of nitrogen at the surface can reach an extremely high level (as is generally accepted) because, in such a dynamic system, the driving force of the ammonia decomposition reaction pushes the nitrogen into the bulk iron to form the nitride. Thus, dynamics is an approach considerably different from statics.
Materials processing with lasers is a rapidly expanding field which is increasingly captivating the attention of scientists, engineers and manufacturers alike. The aspect of most interest to scientists is provided by the basic interaction mechanisms between the intense light of a laser and materials exposed to a chemically reactive or nonreactive surrounding medium. Engineers and manufacturers see in the laser a new tool which will not only make manufacturing cheaper, faster, cleaner and more accurate but which also opens up entirely new technologies and manufacturing methods that are simply not available using existing techniques. Actual and potential applications range from laser machining to laser-induced materials transformation, coating, patterning, etc. , opening up the prospect of exciting new processing methods for micromechanics, metallurgy, integrated optics, semiconductor manufacture and chemical engineering. This book concentrates on the new and interdisciplinary field of 1 aser-i nduced chemicaZ process i ng of materi als. The techni que permits maskless single-step deposition of thin films of metals, semiconductors or insulators with lateral dimensions ranging from a few tenths of a micrometer up to several centimeters. Moreover, materials removal or synthesis, or surface modifications, such as oxidation, nitridation, reduction, metallization and doping, are also possible within similar dimensions. This book is meant as an introduction. It attempts to cater for the very broad range of specific interests which different groups of readers will have, and this thinking underlies the way in which the material has been arranged.
Polymeric materials are used for a legion of applications in a wide array of technological areas, and their proper surface/interface characteristics are of cardinal importance for their applications. Therefore, the need to characterize polymer surfaces/interfaces and their suitable modification to impart desired characteristics is quite patent. This book chronicles the proceedings of the Symposium on Polymer Surfaces and Interfaces: Characterization, Modification and Application held as a part of the Society of Plastics Engineers Annual Technical Conference, Boston, May 7--11, 1995. The articles in this book address many aspects of polymer surfaces and interfaces. Topics covered include: various ways (chemical, photochemical, laser, flame, corona) to modify polymer surfaces; modification of contact lens surfaces; various ways to analyze/characterize polymer surfaces; metal/polymer interfaces; metal/polyimide adhesion; metal/self-assembled organic monolayer interfaces; polymer alignment layers for liquid crystals; alignment of liquid crystal surfaces; polyimide alignment layers; molecular re-orientation of polymer surfaces; plasma polymerized organic coatings; epoxy/fiber interphase; epoxy underfill materials for packaging integrated circuits; transport in polymers; polymer miscibility; and cell adhesion.
This sequel to the 1978 classic, Thin Film Processes, gives a clear, practical exposition of important thin film deposition and etching processes that have not yet been adequately reviewed. It discusses selected processes in tutorial overviews with implementation guide lines and an introduction to the literature. Though edited to stand alone, when taken together, Thin Film Processes II and its predecessor present a thorough grounding in modern thin film techniques. - Provides an all-new sequel to the 1978 classic, Thin Film Processes - Introduces new topics, and several key topics presented in the original volume are updated - Emphasizes practical applications of major thin film deposition and etching processes - Helps readers find the appropriate technology for a particular application
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.
Laser Processing and Chemistry gives an overview of the fundamentals and applications of laser-matter interactions, in particular with regard to laser material processing. Special attention is given to laser-induced physical and chemical processes at gas-solid, liquid-solid, and solid-solid interfaces. Starting with the background physics, the book proceeds to examine applications of laser techniques in micro-machining, and the patterning, coating, and modification of material surfaces. This fourth edition has been revised and enlarged to cover new topics such as 3D microfabrication, advances in nanotechnology, ultrafast laser technology and laser chemical processing (LCP). Graduate students, physicists, chemists, engineers, and manufacturers alike will find this book an invaluable reference work on laser processing.