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This book collects ​a number of papers presented at the International Conference on Sensing and Imaging, which was held at Chengdu University of Information Technology on June 5-7, 2017. Sensing and imaging is an interdisciplinary field covering a variety of sciences and techniques such as optics, electricity, magnetism, heat, sound, mathematics, and computing technology. The field has diverse applications of interest such as sensing techniques, imaging, and image processing techniques. This book will appeal to professionals and researchers within the field.
This book presents high-quality papers from the Fifth International Conference on Microelectronics, Computing & Communication Systems (MCCS 2020). It discusses the latest technological trends and advances in MEMS and nanoelectronics, wireless communication, optical communication, instrumentation, signal processing, image processing, bioengineering, green energy, hybrid vehicles, environmental science, weather forecasting, cloud computing, renewable energy, RFID, CMOS sensors, actuators, transducers, telemetry systems, embedded systems and sensor network applications. It includes papers based on original theoretical, practical and experimental simulations, development, applications, measurements and testing. The applications and solutions discussed here provide excellent reference material for future product development.
This book describes the physical operation of the Tunnel Field-effect Transistor (TFET) and circuits built with this device. Whereas the majority of publications on TFETs describe in detail the device, its characteristics, variants and performance, this will be the first book addressing TFET integrated circuits (TFET ICs). The authors describe the peculiarities of TFET ICs and their differences with MOSFETs. They also develop and analyze a number of logic circuits and memories. The discussion also includes complex circuits combining CMOS and TFET, as well as a potential fabrication process in Silicon.
This book presents the state-of-the art of one of the main concerns with microprocessors today, a phenomenon known as "dark silicon". Readers will learn how power constraints (both leakage and dynamic power) limit the extent to which large portions of a chip can be powered up at a given time, i.e. how much actual performance and functionality the microprocessor can provide. The authors describe their research toward the future of microprocessor development in the dark silicon era, covering a variety of important aspects of dark silicon-aware architectures including design, management, reliability, and test. Readers will benefit from specific recommendations for mitigating the dark silicon phenomenon, including energy-efficient, dedicated solutions and technologies to maximize the utilization and reliability of microprocessors.
The volume is a collection of high-quality peer-reviewed research papers presented in the International Conference on Artificial Intelligence and Evolutionary Computation in Engineering Systems (ICAIECES 2016) held at SRM University, Chennai, Tamilnadu, India. This conference is an international forum for industry professionals and researchers to deliberate and state their research findings, discuss the latest advancements and explore the future directions in the emerging areas of engineering and technology. The book presents original work and novel ideas, information, techniques and applications in the field of communication, computing and power technologies.
This book constitutes the refereed proceedings of the 11th International Symposium on Applied Reconfigurable Computing, ARC 2015, held in Bochum, Germany, in April 2015. The 23 full papers and 20 short papers presented in this volume were carefully reviewed and selected from 85 submissions. They are organized in topical headings named: architecture and modeling; tools and compilers; systems and applications; network-on-a-chip; cryptography applications; extended abstracts of posters. In addition, the book contains invited papers on funded R&D - running and completed projects and Horizon 2020 funded projects.
The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability.
This book constitutes the refereed proceedings of the 12th International Symposium on Applied Reconfigurable Computing, ARC 2016, held in Rio de Janeiro, Brazil, in March 2016. The 20 full papers presented in this volume were carefully reviewed and selected from 47 submissions. They are organized in topical headings named: video and image processing; fault-tolerant systems; tools and architectures; signal processing; and multicore systems. In addition, the book contains 3 invited papers and 8 poster papers on funded RD running and completed projects.
3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.