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State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features: Models for interconnect as well as devices and the impact of scaling trends Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis An overview of the effects of inductance on on-chip interconnect Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance
Describes a variety of interconnect analysis techniques with different efficiency-accuracy tradeoffs. The authors survey very simple delay metrics that can be useful during the synthesis stage of IC design, higher order delay and signal integrity metrics suitable for physical design, and more accurate analysis methods appropriate for the final verification stages of chip design. The Elmore delay, asmptotic waveform evaluation, moment generation, passive reduced-order multiport models are covered. The final two chapters describe how to interface macromodels with circuit simulators and RC models with gate-delay models Annotation copyrighted by Book News, Inc., Portland, OR
As integrated circuit (IC) feature sizes scaled below a quarter of a micron, thereby defining the deep submicron (DSM) era, there began a gradual shift in the impact on performance due to the metal interconnections among the active circuit components. Once viewed as merely parasitics in terms of their relevance to the overall circuit behavior, the interconnect can now have a dominant impact on the IC area and performance. Beginning in the late 1980's there was significant research toward better modeling and characterization of the resistance, capacitance and ultimately the inductance of on-chip interconnect. IC Interconnect Analysis covers the state-of-the-art methods for modeling and analyzing IC interconnect based on the past fifteen years of research. This is done at a level suitable for most practitioners who work in the semiconductor and electronic design automation fields, but also includes significant depth for the research professionals who will ultimately extend this work into other areas and applications. IC Interconnect Analysis begins with an in-depth coverage of delay metrics, including the ubiquitous Elmore delay and its many variations. This is followed by an outline of moment matching methods, calculating moments efficiently, and Krylov subspace methods for model order reduction. The final two chapters describe how to interface these reduced-order models to circuit simulators and gate-level timing analyzers respectively. IC Interconnect Analysis is written for CAD tool developers, IC designers and graduate students.
In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.
Increased design complexity and time-to-market pressure in the integrated circuit (IC) industry call for a raised level of abstraction at which designs are specified. High-level synthesis is the process of generating register-transfer level (RTL) implementations from behavioral specifications, and it is the key enabler for a designing at a higher level beyond RTL. As IC manufacturing technology scales down to nanoscopic scale, the synthesis tools face a number of new challenges, including complexity, power and interconnect. In this dissertation, we propose a spectrum of new techniques in high-level synthesis to address the new challenges and to improve the quality of synthesis results. 1. Efficient and versatile scheduling engine using soft constraints. We present a scheduler that distinguishes soft constraints from hard constraints when exploring the design space, and identify a class of tractable scheduling problems with soft constraints. By exploiting the total unimodularity of the constraint matrix in an integer-linear programming formulation, we are able to solve the problem optimally in polynomial time. Compared to traditional methods, the proposed approach allows easier expression of various design intentions and optimization directions, and, at the same time, gives the scheduler freedom to make global trade-offs optimally. We show that this scheduling engine is flexible enough to support a variety of design considerations in high-level synthesis. 2. Behavior-level observability analysis and power optimization. We introduce the concept of behavior-level observability and its approximations in the context of high-level synthesis, and propose an efficient procedure to compute an approximated behavior-level observability of every operation in a dataflow graph. The algorithm exploits the observability-masking nature of some Boolean operations, as well as the select operation, and treats other operations as black boxes to allow efficient word-level analysis. The result is proven to be exact under the black-box abstraction. The behavior-level observability condition obtained by our analysis can be used to optimize operation gating in the scheduler. This leads to more opportunities in subsequent RTL synthesis for power reduction. To the best of our knowledge, this is the first time behavior-level observability analysis and optimization are performed in a systematic manner. 3. Layout-friendly high-level synthesis. We study a number of structural metrics for measuring the layout-friendliness of microarchitectures generated in high-level synthesis. For a piece of connected netlist, we introduce the spreading score to measures how far components can be spread from each other with bounded wire length in a graph embedding formulation. The intuition is that components in a layout-friendly netlist (e.g., a mesh) can spread over the layout region without introducing long interconnects. Spreading score can be approximated efficiently using a semidefinite programming relaxation. Another metric based on neighborhood population is also proposed. On a number of benchmarks, spreading score shows stronger bias in favor of interconnect structures that have shorter wire length after layout, compared to previous metrics based on cut size and total multiplexer inputs.
Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits
Over the past decade, system-on-chip (SoC) designs have evolved to address the ever increasing complexity of applications, fueled by the era of digital convergence. Improvements in process technology have effectively shrunk board-level components so they can be integrated on a single chip. New on-chip communication architectures have been designed to support all inter-component communication in a SoC design. These communication architecture fabrics have a critical impact on the power consumption, performance, cost and design cycle time of modern SoC designs. As application complexity strains the communication backbone of SoC designs, academic and industrial R&D efforts and dollars are increasingly focused on communication architecture design. On-Chip Communication Architecures is a comprehensive reference on concepts, research and trends in on-chip communication architecture design. It will provide readers with a comprehensive survey, not available elsewhere, of all current standards for on-chip communication architectures. A definitive guide to on-chip communication architectures, explaining key concepts, surveying research efforts and predicting future trends Detailed analysis of all popular standards for on-chip communication architectures Comprehensive survey of all research on communication architectures, covering a wide range of topics relevant to this area, spanning the past several years, and up to date with the most current research efforts Future trends that with have a significant impact on research and design of communication architectures over the next several years
Interconnects are an important constituent of any large scale integrated circuit, and accurate interconnect analysis is essential not only for post-layout verification but also for synthesis. For instance, extraction of interconnect capacitance is needed for the prediction of interconnect-induced delay, crosstalk, and other signal distortion related effects that are used to guide IC routing and floor planning. The continuous progress of semiconductor technology is leading ICs to the era of 45 nm technology and beyond. However, this progress has been associated with increasing variability during the manufacturing processes. This variability leads to stochastic variations in geometric and material parameters and has a significant impact on interconnect capacitance. It is therefore important to be able to quantify the effect of such process induced variations on interconnect capacitance. In this thesis, we have worked on a methodology towards modeling of interconnect capacitance in the presence of geometric uncertainties. More specifically, a methodology is proposed for the finite element solution of Laplace's equation for the calculation of the per-unit-length capacitance matrix of a multi-conductor interconnect structure embedded in a multi-layered insulating substrate and in the presence of statistical variation in conductor and substrate geometry. The proposed method is founded on the idea of defining a single, mean geometry, which is subsequently used with a single finite element discretization, to extract the statistics of the interconnect capacitance in an expedient fashion. We demonstrate the accuracy and efficiency of our method through its application to the extraction of capacitances in some representative geometries for IC interconnects.
Symbolic analysis is an intriguing topic in VLSI designs. The analysis methods are crucial for the applications to the parasitic reduction and analog circuit evaluation. However, analyzing circuits symbolically remains a challenging research issue. Therefore, in this book, we survey the recent results as the progress of on-going works rather than as the solution of the field. For parasitic reduction, we approximate a huge amount of electrical parameters into a simplified RLC network. This reduction allows us to handle very large integrated circuits with given memory capacity and CPU time. A symbolic analysis approach reduces the circuit according to the network topology. Thus, the designer can maintain the meaning of the original network and perform the analysis hierarchically. For analog circuit designs, symbolic analysis provides the relation between the tunable parameters and the characteristics of the circuit. The analysis allows us to optimize the circuit behavior. The book is divided into three parts. Part I touches on the basics of circuit analysis in time domain and in s domain. For an s domain expression, the Taylor's expansion with s approaching infinity is equivalent to the time domain solution after the inverse Laplace transform. On the other hand, the Taylor's expansion when s approaches zero derives the moments of the output responses in time domain. Part II focuses on the techniques for parasitic reduction. In Chapter 2, we present the approximation methods to match the first few moments with reduced circuit orders. In Chapter 3, we apply the Y-Delta transformation to reduce the dynamic linear network. The method finds the exact values of the low order coefficients of the numerator and denominator of the transfer function and thus matches part of the moments. In Chapter 4, we handle two major issues of the Y-Delta transformation: common factors in fractional expressions and round-off errors. Chapter 5 explains the stability of the reduced expression, in particular the Ruth-Hurwitz Criterion. We make an effort to describe the proof of the Criterion because the details are omitted in most of the contemporary textbooks. In Chapter 6, we present techniques to synthesize circuits to approximate the reduced expressions after the transformation. In Part III, we discuss symbolic generation of the determinants and cofactors for the application to analog designs. In Chapter 7, we depict the classical topological analysis approach. In Chapter 8, we describe a determinant decision diagram approach that exploits the sparsity of the matrix to accelerate the computation. In Chapter 9, we take only significant terms when we search through determinant decision diagram to approximate the solution. In Chapter 10, we extend the determinant decision diagram to a hierarchical model. The construction of the modules through the hierarchy is similar to the Y-Delta transformation in the sense that a byproduct of common factors appears in the numerator and denominator. Therefore, we describe the method to prune the common factors.