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This volume demonstrates that the key to the modeling, diagnosis and control of the next generation manufacturing processes is to integrate knowledge-based systems with traditional techniques. An up-to-date study is given here of this relatively recent development.The book is for those working primarily with traditional techniques and those working in the knowledge-based systems field. Both sets of readers will find it to be a source of many specific ideas about the integration of knowledge-based systems with traditional techniques, and carrying a wealth of useful references.
Despite the large volume of publications devoted to neural networks, fuzzy logic, and evolutionary programming, few address the applications of computational intelligence in design and manufacturing. Computational Intelligence in Manufacturing Handbook fills this void as it covers the most recent advances in this area and state-of-the-art applicati
Artificial Intelligence in Manufacturing: Applications and Case Studies provides detailed technical descriptions of emerging applications of AI in manufacturing using case studies to explain implementation. Artificial intelligence is increasingly being applied to all engineering disciplines, producing insights into how we understand the world and allowing us to create products in new ways. This book unlocks the advantages of this technology for manufacturing by drawing on work by leading researchers who have successfully used it in a range of applications. Processes including additive manufacturing, pharmaceutical manufacturing, painting, chemical engineering and machinery maintenance are all addressed. Case studies, worked examples, basic introductory material and step-by-step instructions on methods make the work accessible to a large group of interested professionals. - Explains innovative computational tools and methods in a practical and systematic way - Addresses a wide range of manufacturing types, including additive, chemical and pharmaceutical - Includes case studies from industry that describe how to overcome the challenges of implementing these methods in practice
Deals with the MANTECH project of the Air Force. Describes the program's successes, current initiatives, & future directions.
A practical guide to semiconductor manufacturing from processcontrol to yield modeling and experimental design Fundamentals of Semiconductor Manufacturing and Process Controlcovers all issues involved in manufacturing microelectronic devicesand circuits, including fabrication sequences, process control,experimental design, process modeling, yield modeling, and CIM/CAMsystems. Readers are introduced to both the theory and practice ofall basic manufacturing concepts. Following an overview of manufacturing and technology, the textexplores process monitoring methods, including those that focus onproduct wafers and those that focus on the equipment used toproduce wafers. Next, the text sets forth some fundamentals ofstatistics and yield modeling, which set the foundation for adetailed discussion of how statistical process control is used toanalyze quality and improve yields. The discussion of statistical experimental design offers readers apowerful approach for systematically varying controllable processconditions and determining their impact on output parameters thatmeasure quality. The authors introduce process modeling concepts,including several advanced process control topics such asrun-by-run, supervisory control, and process and equipmentdiagnosis. Critical coverage includes the following: * Combines process control and semiconductor manufacturing * Unique treatment of system and software technology and managementof overall manufacturing systems * Chapters include case studies, sample problems, and suggestedexercises * Instructor support includes electronic copies of the figures andan instructor's manual Graduate-level students and industrial practitioners will benefitfrom the detailed exami?nation of how electronic materials andsupplies are converted into finished integrated circuits andelectronic products in a high-volume manufacturingenvironment. An Instructor's Manual presenting detailed solutions to all theproblems in the book is available from the Wiley editorialdepartment. An Instructor Support FTP site is also available.
This book constitutes the refereed proceedings of the 19th International Conference on Industrial and Engineering Applications of Artificial Intelligence and Expert Systems, IEA/AIE 2006, held in Annecy, France, June 2006. The book presents 134 revised full papers together with 3 invited contributions, organized in topical sections on multi-agent systems, decision-support, genetic algorithms, data-mining and knowledge discovery, fuzzy logic, knowledge engineering, machine learning, speech recognition, systems for real life applications, and more.
About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.