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Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. - Reviews the most relevant techniques and processes for CMP of dielectric and metal films - Includes chapters devoted to CMP for current and emerging materials - Addresses consumables and process control for improved CMP, including post-CMP
The objective of this monograph is to provide a concise introduction to the dynamics of systems comprised of charged small-scale particles. Flowing, small-scale, particles ("particulates'') are ubiquitous in industrial processes and in the natural sciences. Applications include electrostatic copiers, inkjet printers, powder coating machines, etc., and a variety of manufacturing processes. Due to their small-scale size, external electromagnetic fields can be utilized to manipulate and control charged particulates in industrial processes in order to achieve results that are not possible by purely mechanical means alone. A unique feature of small-scale particulate flows is that they exhibit a strong sensitivity to interparticle near-field forces, leading to nonstandard particulate dynamics, agglomeration and cluster formation, which can strongly affect manufactured product quality. This monograph also provides an introduction to the mathematically-related topic of the dynamics of swarms of interacting objects, which has gained the attention of a number of scientific communities. In summary, the following topics are discussed in detail: (1) Dynamics of an individual charged particle, (2) Dynamics of rigid clusters of charged particles, (3) Dynamics of flowing charged particles, (4) Dynamics of charged particle impact with electrified surfaces and (5) An introduction to the mechanistic modeling of swarms. The text can be viewed as a research monograph suitable for use in an upper division undergraduate or first year graduate course geared towards students in the applied sciences, mechanics and mathematics that have an interest in the analysis of particulate materials.
Increased demand for and developments in micromanufacturing have created a need for a resource that covers both the science and technology of this rapidly growing area. With contributions from eminent professors and researchers actively engaged in teaching, research, and development, Micromanufacturing Processes details the basic principles, tools, techniques, and latest advances in micromanufacturing processes. It includes coverage of measurement techniques and research trends as well as a large number of cross-references, making it useful to the students and researchers alike. The book outlines the challenges faced not only in micromanufacturing but also in meso- and nanomanufacturing, exploring topics such as micromachining, micro welding, microforming, micromolding, nanofinishing and micro-/nano-metrology. It includes examples that demonstrate the capabilities of fabricating micro- / nano-products and micro- / nano-features on the macro and micro products. The text also discusses nanofinishing techniques giving surface finish in the domain of sub-nano level, micro welding techniques, namely, laser beam micro welding, electron beam micro welding, micro / nano patterning in large quantities, and micro / nano metrology principles and equipments. It goes on to describe devices such as nano spring, micro mixer, micro cantilever, to name just a few. Unique in its level of coverage, the book highlights new challenges in manufacturing and covers several different types of micromanufacturing processes, such as micromachining, microforming, microcasting, microjoining, nanofinishing, and micrometrology. The level of details, extensive references, figures, and diagrams make the book a reference that will become the standard for this field.
This book walks the reader through all the aspects of manufacturability and yield in a nano-CMOS process. It covers all CAD/CAE aspects of a SOC design flow and addresses a new topic (DFM/DFY) critical at 90 nm and beyond. This book is a must read book the serious practicing IC designer and an excellent primer for any graduate student intent on having a career in IC design or in EDA tool development.
An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.
Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.
High quality optical components for consumer products made of glass and plastic are mostly fabricated by replication. This highly developed production technology requires several consecutive, well-matched processing steps called a "process chain" covering all steps from mold design, advanced machining and coating of molds, up to the actual replication and final precision measurement of the quality of the optical components. Current market demands for leading edge optical applications require high precision and cost effective parts in large volumes. For meeting these demands it is necessary to develop high quality process chains and moreover, to crosslink all demands and interdependencies within these process chains. The Transregional Collaborative Research Center "Process chains for the replication of complex optical elements" at Bremen, Aachen and Stillwater worked extensively and thoroughly in this field from 2001 to 2012. This volume will present the latest scientific results for the complete process chain giving a profound insight into present-day high-tech production.