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Infrared and Millimeter Waves, Volume 14: Millimeter Components and Techniques, Part V is concerned with millimeter-wave guided propagation and integrated circuits. In addition to millimeter-wave planar integrated circuits and subsystems, this book covers transducer configurations and integrated-circuit techniques, antenna arrays, optoelectronic devices, and tunable gyrotrons. Millimeter-wave gallium arsenide (GaAs) IMPATT diodes are also discussed. This monograph is comprised of six chapters and begins with a description of millimeter-wave integrated-circuit transducers, focusing on various designs and trade-offs and providing hardware examples. The next chapter deals with millimeter-wave planar integrated circuits based on three transmission media: microstrip lines, suspended strip lines, and fin lines. Various transmission media and substrates are first considered, followed by design considerations and performances of several integrated-circuit components, including mixers, IMPATT oscillators, frequency multipliers, switches, filters, couplers, and ferrite devices. A few selected subsystems are also discussed. The following chapters look at planar millimeter-wave antenna arrays; optoelectronic devices for millimeter waves; and the state of the art in GaAs IMPATT diode technology for both cw and pulsed modes of operation. The final chapter is devoted to the gyrotron or electron cyclotron resonance maser. This text will be a useful resource for physicists and electronics and electrical engineers.
This text covers the study of millimeter-waves from the basics to the state-of-the-art devices and application systems.
This book adopts the latest academic achievements of microwave and millimeter-wave chips based on thin-film integrated passive device technology as specific cases. Coherent processes of basic theories and design implementations of microwave and millimeter-wave chips are presented in detail. It forms a complete system from design theory, circuit simulation, full-wave electromagnetic simulation, and fabrication to measurement. Five representative microwave and millimeter-wave passive chips based on TFIPD technology are taken as examples to demonstrate the complete process from theory, design, simulation, fabrication, and measurement, which is comprehensive, systematical, and easy to learn and understand, convenient to operate, and close to the practical application. This book is mainly aimed at the design and simulation of microwave and millimeter-wave chips based on thin-film integrated passive device technology. On the basis of specific cases, it introduces the whole process from theory, design, simulation, optimization, fabrication to measurement of the balanced filter, microstrip filter, absorptive filter, power divider, and balun. This book is suitable for the professional technicians who are engaged in the design and engineering application of microwave and millimeter-wave device chips. It can also be used as the textbook of electronic science and technology, electromagnetic field and microwave technology, electronic engineering, radar engineering, integrated circuit, and other related majors in colleges and universities.
MM-wave/sub-Terahertz (THz) signal generation, radiation and detection has become increasingly attractive due to its fast-growing applications in spectroscopy, radar, biomedical and security imaging as well as high-speed wireless communication.Silicon technology, in one hand, offering high-density signal processing capabilities due to aggressive scaling of its feature size, and on the other hand, allowing integration of mm-wave/THz antenna elements owing to their shrunk footprint at these bands, is well-suited for implementation of fully-integrated multi-antenna mm-wave/THz wireless System-on-Chips (SoC's).Performance of such system is dominantly governed by the quality and efficiency of signal generation, transmission/reception and detection. Passive and active components as means of realizing these functionalities must be optimized for operation at these frequency range. However, excessive loss of on-chip passive components and limited gain and output power of transistors at such high frequencies demand novel passive and active structures. Furthermore, high level of integration implies that the co-design of front-end components leads to a better end-to-end performance, thus a holistic design methodology must be employed. Radiation characteristics of the wireless signal must also be engineered to improve its transmission quality. For example, circularly polarized radiation is found to be a viable choice for many imaging and communication applications by exhibiting excellent robustness against de-polarization effects.In this dissertation, silicon realization of on-chip waveguides, as low loss mediums for high-frequency wave propagation, is explored and implementations of low-loss cavity-backed passives are discussed. Furthermore, a silicon-integrated IMPATT diode, together with its fabrication and modeling is introduced as a solution for obtaining active behavior beyond fmax of transistors. Next, a high-power/efficiency mm-wave circularly-polarized cavity-backed radiator, employing a multi-port multi-function passive network as resonator, power combiner, and antenna, is introduced. Necessary conditions for robust operation of such multi-port oscillators/radiators are also derived. Fabricated in a 0.13mum SiGe BiCMOS process, the prototype chip achieves 14.2dBm EIRP, -99.3dBc/Hz phase noise at 1MHz offset, and 5.2% DC-to-EIRP conversion efficiency which is the highest reported value among silicon-based radiators not using silicon lens or substrate processing.Finally, a 210GHz low noise amplifier (LNA) is presented to address the detection challenges. This LNA, achieves 18dB of gain, with less than 12dB noise-figure and 3dB bandwidth of more than 15GHz, thereby showing best performance metrics among prior work. This is achieved by incorporating circuit and EM techniques enabling simultaneous optimization of stable gain-, noise- and bandwidth-performance parameters at this frequency range.
A variety of commercial and defense applications are expected to have sub-terahertz (THz) and mm-wave integrated circuits in the near future. Silicon (Si) technologies partly meet the demands but are limited in their power handling capability. III-V technologies, in particular InP, offer higher output power but fall short of their Si counterparts if it comes to integration density and complexity. Thus, research on hetero-integration of Si with InP has gained increasing interest. This work focuses on MMIC signal sources as important building blocks that are based on FBH’s 0.8 μm InP-DHBT transferred-substrate (TS) process, offering an InP-DHBT as well as an InP-on-BiCMOS version. This process is unique and provides interesting possibilities to realize integrated circuits in the frequency range between 100 GHz and more than 300 GHz. First, fundamental sources at 96 GHz and 197 GHz are presented. They deliver +9 dBm and 0 dBm output power with 25% and 0.5% overall DC-to-RF efficiency, respectively. Furthermore, 162 GHz and 270 GHz push-push sources are demonstrated utilizing an InP-on-BiCMOS process, which achieve -4.5 dBm and -9.5 dBm output power. Subsequently, multiplier-based signal sources are demonstrated including a full G-band (140-220 GHz) frequency doubler, which delivers +8.2 dBm at 180 GHz and more than +5 dBm in the range 160-200 GHz. The doubler circuit exhibits a power efficiency of 16% in this frequency range. Also, the highest frequency is reached by a wideband 328 GHz quadrupler, with -7 dBm output power at 325 GHz and 0.5% DC-to-RF efficiency. The final part is devoted to hetero-integrated circuits and the necessary design considerations. Two 250 GHz and 330 GHz sources are demonstrated that deliver -1.6 dBm and -12 dBm output power, respectively. These are the first hetero-integrated signal sources in this frequency range reported so far.
This book compiles and presents the research results from the past five years in mm-wave Silicon circuits. This area has received a great deal of interest from the research community including several university and research groups. The book covers device modeling, circuit building blocks, phased array systems, and antennas and packaging. It focuses on the techniques that uniquely take advantage of the scale and integration offered by silicon based technologies.