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Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.
This book commemorates four decades of research by Professor Magdy F. Iskander (Life Fellow IEEE) on materials and devices for the radiation, propagation, scattering, and applications of electromagnetic waves, chiefly in the MHz-THz frequency range as well on electromagnetics education. This synopsis of applied electromagnetics, stemming from the life and times of just one person, is meant to inspire junior researchers and reinvigorate mid-level researchers in the electromagnetics community. The authors of this book are internationally known researchers, including 14 IEEE fellows, who highlight interesting research and new directions in theoretical, experimental, and applied electromagnetics.
A step-by-step guide to parallelizing cem codes The future of computational electromagnetics is changing drastically as the new generation of computer chips evolves from single-core to multi-core. The burden now falls on software programmers to revamp existing codes and add new functionality to enable computational codes to run efficiently on this new generation of multi-core CPUs. In this book, you'll learn everything you need to know to deal with multi-core advances in chip design by employing highly efficient parallel electromagnetic code. Focusing only on the Method of Moments (MoM), the book covers: In-Core and Out-of-Core LU Factorization for Solving a Matrix Equation A Parallel MoM Code Using RWG Basis Functions and ScaLAPACK-Based In-Core and Out-of-Core Solvers A Parallel MoM Code Using Higher-Order Basis Functions and ScaLAPACK-Based In-Core and Out-of-Core Solvers Turning the Performance of a Parallel Integral Equation Solver Refinement of the Solution Using the Conjugate Gradient Method A Parallel MoM Code Using Higher-Order Basis Functions and Plapack-Based In-Core and Out-of-Core Solvers Applications of the Parallel Frequency Domain Integral Equation Solver Appendices are provided with detailed information on the various computer platforms used for computation; a demo shows you how to compile ScaLAPACK and PLAPACK on the Windows® operating system; and a demo parallel source code is available to solve the 2D electromagnetic scattering problems. Parallel Solution of Integral Equation-Based EM Problems in the Frequency Domain is indispensable reading for computational code designers, computational electromagnetics researchers, graduate students, and anyone working with CEM software.
This book provides an up-to-date presentation of a broad range of contemporary problems in inverse scattering involving acoustic, elastic and electromagnetic waves. Descriptions will be given of traditional (but still in use and subject to on-going improvements) and more recent methods for identifying either: a) the homogenized material parameters of (spatially) unbounded or bounded heterogeneous media, or b) the detailed composition (spatial distribution of the material parameters) of unbounded or bounded heterogeneous media, or c) the location, shape, orientation and material characteristics of an object embedded in a wellcharacterized homogeneous, homogenized or heterogeneous unbounded or bounded medium, by inversion of reflected, transmitted or scattered spatiotemporal recorded waveforms resulting from the propagation of probe radiation within the medium.
Describes the configuration and principles of a reflectarray antenna, its advantages over other antennas, the history of its development, analysis techniques, practical design procedures, bandwidth issues and wideband techniques, as well as applications and recent developments. Both authors are well respected practitioners who have build these antennas and developed them for space flight.
This practical resource provides a current and comprehensive treatment of GPS/GNSS antennas, taking into account modernized systems and new and developing applications. The book presents a number of key applications, describing corresponding receiver architectures and antenna details. You find important discussions on antenna characteristics, including theory of operation, gain, bandwidth, polarization, phase center, mutual coupling effects, and integration with active components. Moreover, you get expert guidance on the design of adaptive arrays and signal processing techniques used to mitigate interference such as jamming. Addressing critical GNSS antenna high precision requirements, this in-depth book explains the relationships between antenna gain, satellite visibility, geometric dilution of precision, and the carrier-to-noise density ratio. The book delineates requirements for both dual-band and tri-band antennas. You get detailed coverage of a wide range of antenna designs, including microstrip patch, quadrafilar helix, axial mode helix, spiral, inverted L, and planar inverted F antennas. Moreover, you find a discussion on new magnetic metamaterialù substrates and other dielectric substrate materials. Further, this comprehensive book presents designs for very compact GNSS antennas for personal handheld devices and automobiles.
This book highlights the application of active array antennas in high-resolution microwave imaging radar systems. It introduces the basic principles, analytical methods, and performance parameters of active array antennas to achieve low profile, high efficiency, and lightweight. The book systematically elaborates the architecture, analysis, and engineering practice to achieve wideband, multi-band, multi-polarization, and common aperture in active array antennas. It explores hotspot technologies of digital array antennas, microwave photonic array antennas, and active packaging antennas. By presenting over 300 illustrations and diagrams, including schematic diagrams, block diagrams, relation diagrams, and breakdown drawings, the book enables a thorough understanding of the antenna array microsystem as the advanced phase of active array antennas and the direction of future R&D. The book is a good reference source for researchers and engineers interested in the engineering and implementation of microwave imaging radar systems and antenna technology.
A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.
A comprehensive reference giving a thorough explanation of propagation mechanisms, channel characteristics results, measurement approaches and the modelling of channels Thoroughly covering channel characteristics and parameters, this book provides the knowledge needed to design various wireless systems, such as cellular communication systems, RFID and ad hoc wireless communication systems. It gives a detailed introduction to aspects of channels before presenting the novel estimation and modelling techniques which can be used to achieve accurate models. To systematically guide readers through the topic, the book is organised in three distinct parts. The first part covers the fundamentals of the characterization of propagation channels, including the conventional single-input single-output (SISO) propagation channel characterization as well as its extension to multiple-input multiple-output (MIMO) cases. Part two focuses on channel measurements and channel data post-processing. Wideband channel measurements are introduced, including the equipment, technology and advantages and disadvantages of different data acquisition schemes. The channel parameter estimation methods are then presented, which include conventional spectral-based estimation, the specular-path-model based high-resolution method, and the newly derived power spectrum estimation methods. Measurement results are used to compare the performance of the different estimation methods. The third part gives a complete introduction to different modelling approaches. Among them, both scattering theoretical channel modelling and measurement-based channel modelling approaches are detailed. This part also approaches how to utilize these two modelling approaches to investigate wireless channels for conventional cellular systems and some new emerging communication systems. This three-part approach means the book caters for the requirements of the audiences at different levels, including readers needing introductory knowledge, engineers who are looking for more advanced understanding, and expert researchers in wireless system design as a reference. Presents technical explanations, illustrated with examples of the theory in practice Discusses results applied to 4G communication systems and other emerging communication systems, such as relay, CoMP, and vehicle-to-vehicle rapid time-variant channels Can be used as comprehensive tutorial for students or a complete reference for engineers in industry Includes selected illustrations in color Program downloads available for readers Companion website with program downloads for readers and presentation slides and solution manual for instructors Essential reading for Graduate students and researchers interested in the characteristics of propagation channel, or who work in areas related to physical layer architectures, air interfaces, navigation, and wireless sensing