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A sunny September day. Heather Smithson, a senior MI5 controller, has a dilemma. Her job is on the line. She pauses in the sunshine to brood on recent events and what they mean in her life. Seattle, Genoa, New York: What is the battleground? Who is the enemy? Hyperlynx was performed as a one act rehearsed reading at the Edinburgh Festival in August 2001. Its grim premonition of the terrorist activity of September 11th, necessitated that John McGrath wrote a second act. He completed the play in November before his death in January 2002. Hyperlynx was the winner of the Fringe First Award, Edinburgh 2002
20-year-old Lexi Sobado is a woman with a psychic gift caught in the middle of a sinister web of crime and corruption. The victim of a stalker, Lexi finds herself romantically entangled with the special agent charged with protecting her. Thing is, Lexi herself has worked for the intelligence community in the past. What she hides, what she reveals and what she keeps trying to uncover become the juggling act our heroine deals with as she tries to save her own life and stop the killer.
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Based on over twenty years of hands-on experience with electromagnetic interference (EMI), Digital Design for Interference Specifications provides circuit designers concrete rules that can be applied immediately to the design of new digital products. The authors' techniques emphasize EMI source suppression at the printed circuit board level and considers shielding only as a last resort. The material is written in a how-to format with brief qualitative explanations of why or how design recommendations suppress emissions or reduce susceptibility. The described approaches toward design and prevention of EMI will save manufacturers time, product cost, and enhance manufacturability. Best of all, designers will not have to be EMI gurus to implement these processes but they will definitely look like experts when the final outcome is assessed. Digital Design for Interference Specifications is a very well written book targeted directly toward circuit designers and EMI professionals. The authors built a consulting company out of the knowledge presented in the book working with a huge list of clients over the years. The material is written to directly apply to circuit designers' projects helping them save money and time on each design. The book is heavily and clearly illustrated. A practical, hands-on guide to EMI suppression and prevention. Written by circuit designers for use by circuit designers. Heavily illustrated and easy to read.
This book is a comprehensive SiP design guide book. It is divided into three parts: concept and technology, design and simulation, project and case, for a total of 30 chapters. In Part one, the author proposes some new original concepts and thoughts, such as Function Density Law,Si3P and 4D integration. Part one also covers the latest technology of SiP and Advanced Packaging. Part two covers the latest SiP and Advanced Packaging design and simulation technologies, such as wire bonding, multi-step cavity, chip stacking, 2.5D TSV, 3D TSV, RDL, Fan- In, Fan-Out, Flip Chip, Embedded Passive, Embedded Chip, RF design, Rigid-Flex design, 4D SiP design, Multi-layout project and Team design, as well as SI, PI, thermal simulation, electrical verification and physical verification. Based on a real design case, part three introduces the design, simulation and implementation methods of different types of SiP, which has a -important reference significance for the research and development of SiP projects. This book comprehensively and deeply expounds the latest development, design ideas and design methods of contemporary SiP technology from three aspects: concept and technology, design and simulation, project and case. Through the detailed introduction of new concepts, design methods, actual projects and cases, this book describes the whole process of SiP products from the beginning of conception to the final realization and makes readers benefit from it.
Presents a range of CAD algorithms and techniques for synthesizing and optimizing interconnect Provides insight & intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits
If she fails, her whole team could be destroyed. Lexi "Lynx" Sabado is more than ready for her marriage with ex-SEAL Striker Rheas. But getting her happily ever after is fraught with hurdles when her psychic abilities start going haywire, giving her vague warnings of impending danger. As it turns out, identifying threats can be overwhelming when everything and everyone is the potential source. The guy at the CIA who mistook her for her mom, the undercover work she's doing with the FBI, her dear friend's upcoming wedding where the Assemblymen will gather...the peril could be coming from any direction. What's a psychic to do when danger is closing in on all sides and time is running out? Lexi must navigate this new labyrinth with her head on a swivel and her psychic warning system blaring. Grab your copy of HYPER LYNX, and let's go!
Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.
Thisvolumehasitsbeginningsinalaboratoryproject,developmentofaradiolocator for the Wi-Fi network that was growing by leaps and bounds on the campus of Indiana University at that time. What started as a very focused and practical attempt to improve network management, touched in its lifetime upon broader issues of the use of radio spectrum, design of system architectures for the wireless medium, and image formation outside the limits of geometrical optics. Ihaveintendedthisbookmostlyfortheaudienceofengineersandsystemdesi- ers, in the growing ?eld of radio communication among small, portable, ubiquitous devices that have become hybrid platforms for personal communication and p- sonal computing. It is also a book addressed to network professionals, people to whom radio is largely a black box, a medium that they usually rely upon, but s- dom fully understand. In fact, in the course of my work in the ?eld, I have witnessed, to my dismay, a wide disconnect between the networking world and the radio technology that n- working has come to depend upon so heavily. Perhaps, because digital wireless communication is seen as digital ?rst and wireless second, there is often a m- placed emphasis on its information-processingside, with the methodologycentered around the discrete symbol, and with little intuition of the underlying physics. I had it once suggested to me, in apparent seriousness, to use radio cards for intra-system communication within a radiolocator! Wireless communication is radio, plain and simple.