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Higher Electronics is a comprehensive text for electronics undergraduates, covering analogue, digital electronics and microelectronics in a single volume - at a level suitable for most first and second year modules. The text is highly student-centred, providing numerous · worked examples with step-by-step guidance and hints · highlighted key facts and points of interest · self-check questions scattered through the text · problem sections (with answers supplied) It has been written to suit courses with an intake from a range of educational backgrounds, and a minimum of prior knowledge is assumed. Higher Electronics has been written to be fully in line with units 8-12 of the new BTEC Higher National specifications from Edexcel. This makes it the text of choice for all students following an electronics / electrical pathway through an HNC or HND. The student-centred text is ideal for the new course, and follows on especially well for students from a GNVQ background. The style and approach of Higher Electronics is consistent with the new text from Newnes, Higher National Engineering, which covers the mandatory units (units 1-7) of the new Higher National scheme.
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
High speed circuits are crucial for increasing the bandwidth of transmission and switching of voice/video/data over optical fiber networks. The ever-increasing demand for bit rates higher than those available due to the explosion of Internet traffic has driven engineers to develop integrated circuits of performance approaching 100 Gb/s. Commercial lightwave products using high speed circuits of 10 Gb/s and beyond are readily available.High Speed Circuits for Lightwave Communications presents the latest information on circuit design, measured results, applications, and product development. It covers electronic and opto-electronic circuits for transmission, receiving, and cross-point switching. These circuits were implemented with various state-of-the-art IC technologies, including Si BJT, GaAs MESFET, HEMT, HBT, as well as InP HEMT and HBT. The book, written by more than 50 experts, will benefit graduate students, researchers, and engineers who are interested in or work in this exciting and challenging field of optical communications.
The author compiles valuable lessons learned from his work with hundreds of suppliers and customers world-wide. The design of electronics is fundamental to quality and reliability; manufacturing must follow rules regarding what to and what not to do to make defect-free products; transportation, storage and warehousing operations must adhere to certain disciplines; installation should be done correctly to avoid premature degradation; and failed products must be repaired carefully to avoid damage. Large volume and complex logistics will amplify errors so mistakes in these steps will cost the business huge amounts of money. Also covered are criteria for relevant metrics. The book concisely summarizes few very specific and high impact precautions necessary to build the quality in design. It highlights pitfalls that must be avoided in subsequent manufacturing and delivery operations that can degrade product reliability. The author emphasizes the leadership team must inspire team dynamics and collaboration with central focus on customers. The book will be useful to management and technical ranks involved in design, manufacturing and deployment and customer service. Service provider companies will also benefit from this book. As technology evolves, new products are reaching the market faster, and customers are demanding higher quality and lower cost. For your business to thrive in this environment, it will need to master the processes discussed in these pages that will serve as a valuable reference for a roadmap to success.
There is a growing desire to install electronic power and control systems in high temperature harsh environments to improve the accuracy of critical measurements, reduce the amount of cabling and to eliminate cooling systems. Typical target applications include electronics for energy exploration, power generation and control systems. Technical topics presented in this book include:• High temperature electronics market• High temperature devices, materials and assembly processes• Design, manufacture and testing of multi-sensor data acquisition system for aero-engine control• Future applications for high temperature electronicsHigh Temperature Electronics Design for Aero Engine Controls and Health Monitoring contains details of state of the art design and manufacture of electronics targeted towards a high temperature aero-engine application. High Temperature Electronics Design for Aero Engine Controls and Health Monitoring is ideal for design, manufacturing and test personnel in the aerospace and other harsh environment industries as well as academic staff and master/research students in electronics engineering, materials science and aerospace engineering.
New Materials and Devices for 5G Applications and Beyond focuses on the materials, device architectures and enabling integration schemes for 5G applications and emerging technologies. It gives a comprehensive overview of the trade-offs, challenges and unique properties of novel upcoming technologies. Starting from the application side and its requirements, the book examines different technologies under consideration for the different functions, both more conventional to exploratory, and within this context the book provides guidance to the reader on how to possibly optimize the system for a particular application. This book aims at guiding the reader through the technologies required to enable 5G applications, with the main focus on mm-wave frequencies, up to THz. New Materials and Devises for 5G Applications and Beyond is suitable for industrial researchers and development engineers, and researchers in materials science, device engineering and circuit design. - Reviews challenges and emerging opportunities for materials, devices, and integration to enable 5G technologies - Includes discussion of technologies such as RF-MEMs, RF FINFETs, and transistors based on current and emerging materials (InP, GaN, etc.) - Focuses on mm-wave frequencies up to the terahertz regime