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A variety of industries – information technology, aerospace, automobile, and basic and new materials manufacturing – need technological innovations, which bring high-value-added and high-quality products at low cost not only because of global competition, but also because of the perspective of en- ronmental consciousness and regulation. Thermophysical properties of hi- temperature melts are indispensable for numerical simulations of material processes such as semiconductor and optical crystal growth of the melt, and castingofsuper-high-temperaturealloysforjet-engineturbineblades,inad- tion to welding in automobile manufacturing. Recent developments in process modeling provide 3D unsteady analysis of melt convection, temperature, and heat ?ux distribution, which enables us to predict product quality. In fact, 3D process visualization using computer modeling helps us to understand complicated phenomena occurring in the melt and to control the process. Accurate data are necessary to improve the modeling, which co- e?ectively engenders high-quality products. However, crucial obstacles render measurements of thermophysical properties di?cult at elevated temperatures because of high chemical reactivity and ?uidity of melts. Substantial and persistent challenges have been made to ascertain the precise thermophysical properties of high-temperature melts. This book describes the new techniques and latest developments in the measurements of atomic structure, density, surface tension, viscosity, heat capacity, thermal and mass di?usivity, th- mal conductivity, emissivity, and electrical conductivity of high-temperature melts. In addition to up-to-date improvements in conventional techniques, some new attempts are introduced to open a new scienti?c ?eld, that is, physics of high-temperature melts.
Die exakte Temperaturmessung ist ein wichtiger Parameter in vielen Bereichen. Dieser Band wurde komplett überarbeitet und aktualisiert und enthält darüber hinaus die neuesten IEC Standards. Theorie und instrumentelle Praxis der Temperaturbestimmung werden hier umfassend behandelt. (09/00)
This book describes the practice of radiation thermometry, both at a primary level and for a variety of applications, such as in the materials processing industries and remote sensing. This book is written for those who will a) apply radiation thermometry in industrial practice b) use radiation thermometers for scientific research, c) the radiation thermometry specialist in a national measurement institute d) developers of radiation thermometers who are working to innovate products for instrument manufacturers and e) developers non-contact thermometry methods to address challenging thermometry problems. The author(s) of each chapter were chosen from a group of international scientists who are experts in the field and specialist(s) on the subject matter covered in the chapter. A large number of references are included at the end of each chapter as a resource for those seeking a deeper or more detailed understanding. This book is more than a practice guide. Readers will gain in-depth knowledge in: (1) the proper selection of the type of thermometer; (2) the best practice in using the radiation thermometers; (3) awareness of the error sources and subsequent appropriate procedure to reduce the overall uncertainty; and (4) understanding of the calibration chain and its current limitations. - Coverage of all fundamental aspects of the radiometric measurements - Coverage of practical applications with details on the instrumentation, calibration, and error sources - Authors are from the national labs internationally leading in R&D in temperature measurements - Comprehensive coverage with large number of references
Temperature * General temperature measurement considerations * Invasive temperature measurement * Semi-invasive temperature measurement * Non-invasive temperature measurement * Temperature measurement technique selection * Heat flux measurement * Conclusions.
Covers the fundamentals of measuring temperature at the nanoscale, luminescence-based and non-luminescence based thermometry techniques, and applications.
The main purpose of the book is to present a description of the mechanism of high-temperature superconductivity and to discuss the physics of high-temperature superconductors, both entirely based on experimental facts. The pairing mechanism of this remarkable phenomenon is based on an anomaly found in tunneling (V) characteristics of some cuprates. By using the soliton theory, it is then shown that this anomaly is caused by pairs of quasi-one dimensional excitations - bisolitons - bound due to a moderately strong, nonlinear electron-phonon interaction. At the same time, analysis of experimental data unambiguously shows that magnetic (spin) fluctuations mediate the phase coherence in cuprates. The mechanism of superconductivity in quasi-one dimensional organic superconductors and heavy fermions is discussed too. In cuprates, the origins of five different energy/temperature scales are identified. Finally, three main principles of superconductivity are introduced at the end of the book. Analysis of tunneling and angle-resolved photoemission measurements is presented in the last chapter. The book which contains 300 pages with 180 illustrations is addressed to researchers and graduate students in all branches of exact sciences.
This book summarizes the state of the art in combustion synthesis of advanced materials. It is a first attempt to summarize and critically review in one monograph the mechanisms of combustion and product structure formation for a variety of systems, including nanosystems. The authors discuss a wide range of topics including phenomenology, theory, and modern in-situ experimental approaches to investigate the heterogeneous self-sustained reactions, as well as properties of the product synthesized, and methods for large-scale materials production.
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.