Download Free High Temperature Equipment Book in PDF and EPUB Free Download. You can read online High Temperature Equipment and write the review.

The only one-stop reference to design, analysis, and manufacturing concepts for power devices utilizing HTS. High temperature superconductors (HTS) have been used for building many devices for electric grids worldwide and for large ship propulsion motors for the U.S. Navy. And yet, there has been no single source discussing theory and design issues relating to power applications of HTS—until now. This book provides design and analysis for various devices and includes examples of devices built over the last decade. Starting with a complete overview of HTS, the subsequent chapters are dedicated to specific devices: cooling and thermal insulation systems; rotating AC and DC machines; transformers; fault current limiters; power cables; and Maglev transport. As applicable, each chapter provides a history of the device, principles, configuration, design and design challenges, prototypes, and manufacturing issues, with each ending with a summary of the material covered. The design analysis and design examples provide critical insight for readers to successfully design their own devices. Original equipment manufacturer (OEM) designers, industry and utilities users, universities and defense services research groups, and senior/postgraduate engineering students and instructors will rely on this resource. "HTS technology reduces electric losses and increases the efficiency of power equipment. This book by Swarn Kalsi, a leading expert on the HTS subject, provides a survey of the HTS technology and the design rules, performance analyses, and manufacturing concepts for power application-related devices. It compares conventional and HTS technology approaches for device design and provides significant examples of devices utilizing the HTS technology today. The book is useful for a broad spectrum of professionals worldwide: students, teaching staff, and OEM designers as well as users in industry and electric utilities." —Professor Dr. Rolf Hellinger, Research and Technologies Corporate Technology, Siemens AG
This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.
High Temperature Coatings, Second Edition, demonstrates how to counteract the thermal effects of rapid corrosion and degradation of exposed materials and equipment that can occur under high operating temperatures. This is the first true practical guide on the use of thermally protective coatings for high-temperature applications, including the latest developments in materials used for protective coatings. It covers the make-up and behavior of such materials under thermal stress and the methods used for applying them to specific types of substrates, as well as invaluable advice on inspection and repair of existing thermal coatings. With his long experience in the aerospace gas turbine industry, the author has compiled the very latest in coating materials and coating technologies, as well as hard-to-find guidance on maintaining and repairing thermal coatings, including appropriate inspection protocols. The book is supplemented with the latest reference information and additional support to help readers find more application- and industry-type coatings specifications and uses. - Offers an overview of the underlying fundamental concepts of thermally-protective coatings, including thermodynamics, energy kinetics, crystallography and equilibrium phases - Covers essential chemistry and physics of underlying substrates, including steels, nickel-iron alloys, nickel-cobalt alloys and titanium alloys - Provides detailed guidance on a wide variety of coating types, including those used against high temperature corrosion and oxidative degradation and thermal barrier coatings
The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.
High Temperature Metallography focuses on the reactions, processes, methodologies, and approaches involved in high temperature metallography. The publication first offers information on the basic principles of high temperature vacuum metallography, including the methods of heating test specimens in vacuo to high temperatures; specimens for investigating structure and properties of metals by heating in vacuo; and methods of regulating and controlling the temperature of specimens heated in vacuo. The text then ponders on vacuum systems in equipment for investigating the structure and properties of metals and alloys heated at low ultimate pressures, as well as gas flow through the tubes during evacuation; construction and characteristics of vacuum pumps used for high temperature metallography equipment; and approximate calculation of parameters of vacuum systems for equipment intended for investigating metals during heating in a vacuum. The book takes a look at equipment and instruments for investigating metals heated in a vacuum; method of investigation by studying microstructures and properties of metals and alloys while heated in vacuo; and methods for measuring elasticity, internal friction, and hardness, and for investigating the deformation of metals and alloys at high temperatures in vacuo. The text is a dependable reference for readers interested in high temperature metallography.
This book covers many aspects of thermal processing of milk and milk products with particular focus on UHT processing. It commences with an overview of the major thermal processing technologies: thermisation, pasteurisation, extended-shelf-life (ESL), UHT and in-container sterilisation. It discusses the principles of the technologies, the processing and packaging equipment used, processing issues such as temperature-time profiles, heat stability, fouling and cleaning, and the quality and safety aspects of the products produced. It provides a balance of the engineering aspects of the processes and the chemical, microbiological and sensory aspects of the products. The changes that occur in products during processing and storage, and the related defects which can arise, are central to the book. The discussions of these changes will be an aid to industry personnel in identifying the causes of quality defects in these products and devising measures which can be taken to eliminate or minimise the defects.
Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.
Maximize efficiency and minimize pollution: the breakthrough technology of high temperature air combustion (HiTAC) holds the potential to overcome the limitations of conventional combustion and allow engineers to finally meet this long-standing imperative. Research has shown that HiTAC technology can provide simultaneous reduction of CO2 and nitric
George Lai's 1990 book, High-Temperature Corrosion of Engineering Alloys, is recognized as authoritative and is frequently consulted and often cited by those in the industry. His new book, almost double in size with seven more chapters, addresses the new concerns, new technologies, and new materials available for those engaged in high-temperature applications. As we strive for energy efficiency, the realm of high-temperature environments is expanding and the need for information on high temperature materials applications was never greater. In addition to extensive expansion on most of the content of the original book, new topics include erosion and erosion-corrosion, low NOx combustion in coal-fired boilers, fluidized bed combustion, and the special demands of waste-to-energy boilers, waste incinerators, and black liquor recovery boilers in the pulp and paper industry. The corrosion induced by liquid metals is discussed and protection options are presented.