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With the inclusion of the two new hot topics in signal integrity, power integrity and high speed serial links, this book will be the most up to date complete guide to understanding and designing for signal integrity.
This thorough review of the fundamental principles associated with signal integrity provides engineering principles behind signal integrity effects, and applies this understanding to solving problems.
ROADMAPS OF PACKAGING TECHNOLOGY. IC packaging technology is driven by four forces: Faster, Denser, Cheaper, NOW! It is squeezed from both sides by advances in IC technologies and by the demands of the users. These forces drive the packaging industry to constantly evolve. This book tells this story.