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Gray body radiant heat transfer between two surfaces is a function of the geometrical arrangement of the surfaces, their emissivities, and their temperatures. A method is described for evaluating "radiosities" and solving the problem on either an analog or digital computer.
During the last half century, the development and testing of prediction models of combustion chamber performance have been an ongoing task at the International Flame Research Foundation (IFRF) in IJmuiden in the Netherlands and at many other research organizations. This task has brought forth a hierarchy of more or less standard numerical models for heat transfer predictions, in particular for the prediction of radiative heat transfer. Unfortunately all the methods developed, which certainly have a good physical foundation, are based on a large number of extreme sim plifications or uncontrolled assumptions. To date, the ever more stringent requirements for efficient production and use of energy and heat from com bustion chambers call for prediction algorithms of higher accuracy and more detailed radiative heat transfer calculations. The driving forces behind this are advanced technology requirements, the costs of large-scale experimen tal work, and the limitation of physical modeling. This interest is growing more acute and has increased the need for the publication of a textbook for more accurate treatment of radiative transfer in enclosures. The writing of a textbook on radiative heat transfer, however, in ad dition to working regularly on other subjects is a rather difficult task for which some years of meditation are necessary. The book must satisfy two requirements which are not easily reconciled. From the mathematical point of view, it must be written in accordance with standards of mathemati cal rigor and precision.
"This comprehensive text on the basics of heat and mass transfer provides a well-balanced treatment of theory and mathematical and empirical methods used for solving a variety of engineering problems. The book helps students develop an intuitive and practical under-standing of the processes by emphasizing the underlying physical phenomena involved. Focusing on the requirement to clearly explain the essential fundamentals and impart the art of problem-solving, the text is written to meet the needs of undergraduate students in mechanical engineering, production engineering, industrial engineering, auto-mobile engineering, aeronautical engineering, chemical engineering, and biotechnology.
This title provides professionals and students with a practical approach to core knowledge of heat transfer and fluid flow as it applies to space heating, water services and mechanical/natural ventilation in and associated with buildings.
A total revision of the author’s previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Presenting material in a way that is practical and useful to engineers and scientists, as well as engineering students, this book provides very detailed text examples and their solutions. This approach helps users at all levels of comprehension to strengthen their grasp of the subject and detect their own calculation errors. The beginning of this book is largely devoted to prediction of airflow and well-mixed air temperatures in systems and heat sinks, after which it explores convective heat transfer from heat sinks, circuit boards, and components. Applying a systematic presentation of information to enhance understanding and computational practice, this book: Provides complete mathematical derivations and supplements formulae with design plots Offers complete exercise solutions (MathcadTM worksheets and PDF images of Mathcad worksheets), lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this book Addresses topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction Presents mathematical descriptions of large thermal network problem formulation Discusses comprehensive thermal spreading resistance theory, and includes steady-state and time-dependent problems This reference is useful as a professional resource and also ideal for use in a complete course on the subject of electronics cooling, with its suggested course schedule and other helpful advice for instructors. Selected sections may be used as application examples in a traditional heat transfer course or to help professionals improve practical computational applications.
Revised to include more information on analytical models for wavelength independence, Radiation Heat Transfer, Augmented Edition has been rearranged, providing problems within each chapter rather than at the end of the book. Written by Ephraim M. Sparrow, a generalist who works on a very broad range of problems that encompasses almost all mechanical engineering topics, the book presents key ideas without being exhaustive. Sparrow oversees the Laboratory for Heat Transfer and Fluid Flow Practice, whose function in to undertake both industrially bases and fundamental problems that fall within the bounds of heat transfer and fluid flow.
The first edition of Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling was based on the author's lecture notes that he developed over the course of nearly 40 years of thermal design and analysis activity, the last 15 years of which included teaching a university course at the senior undergraduate and graduate levels. The subject material was developed from publications of respected researchers and includes topics and methods original to this author. Numerous students have contributed to both the first and second editions, the latter corrected, sections rewritten (e.g., radiation spatial effects, Green's function properties for thermal spreading, 1-D FEA theory and application), and some new material added. The flavor and organization of the first edition have been retained, whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first 20% of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems. Downloads (from the CRC website) include: MathcadTM text examples, exercise solutions (adopting professors only) plus PDF lecture aids (professors only), and a tutorial (Chapter 14) using free FEA software to solve a thermal spreading problem. This book is a valuable professional resource for self-study and is ideal for use in a course on electronics cooling. It is well-suited for a first course in heat transfer where applications are as important as theory.
The seventh edition of this classic text outlines the fundamental physical principles of thermal radiation, as well as analytical and numerical techniques for quantifying radiative transfer between surfaces and within participating media. The textbook includes newly expanded sections on surface properties, electromagnetic theory, scattering and absorption of particles, and near-field radiative transfer, and emphasizes the broader connections to thermodynamic principles. Sections on inverse analysis and Monte Carlo methods have been enhanced and updated to reflect current research developments, along with new material on manufacturing, renewable energy, climate change, building energy efficiency, and biomedical applications. Features: Offers full treatment of radiative transfer and radiation exchange in enclosures. Covers properties of surfaces and gaseous media, and radiative transfer equation development and solutions. Includes expanded coverage of inverse methods, electromagnetic theory, Monte Carlo methods, and scattering and absorption by particles. Features expanded coverage of near-field radiative transfer theory and applications. Discusses electromagnetic wave theory and how it is applied to thermal radiation transfer. This textbook is ideal for Professors and students involved in first-year or advanced graduate courses/modules in Radiative Heat Transfer in engineering programs. In addition, professional engineers, scientists and researchers working in heat transfer, energy engineering, aerospace and nuclear technology will find this an invaluable professional resource. Over 350 surface configuration factors are available online, many with online calculation capability. Online appendices provide information on related areas such as combustion, radiation in porous media, numerical methods, and biographies of important figures in the history of the field. A Solutions Manual is available for instructors adopting the text.
Comprehensive PE Mechanical Thermal and Fluids Systems Exam Coverage The Thermal and Fluids Systems Reference Manual prepares you for the NCEES Mechanical Thermal and Fluids Systems Exam. It provides a comprehensive review of the principles of thermal and fluids systems. You will learn how to apply concepts by reviewing and working the 88 end-of-topic practice problems. Each problem’s complete solution let you check your own problem-solving approach. After the exam, the Thermal and Fluids Systems Reference Manual is a valuable reference for your mechanical engineering career. Topics Covered Energy and Power Equipment Fluid Mechanics Heat Transfer Principles Hydraulic and Fluid Equipment Thermodynamics Key Features Thorough index easily directs you to the codes and concepts you will need during the exam. Additional support materials with cross references to more than 1500 equations, 300 figures, and 30 tables. Binding: Paperback Publisher: PPI, A Kaplan Company