Published: 1993
Total Pages: 0
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This report describes research to reduce the intrinsic bonding defects in amorphous and microcrystalline Si alloys by controlling the bonding chemistry and the microstructure via the deposition process reactions. The specific approach was to use remote plasma-enhanced, chemical-vapor deposition (PECVD) and reactive magnetron sputtering to limit the multiplicity of deposition inaction pathways, and thereby gain increased control over the thin-film chemistry and microstrucre. The research included (1) the deposition of amorphous and microcrystalline Si alloy materials by the PECVD process and by reactive magnetron sputtering, and (2) the evaluation of the material properties of these films for potential applications in PV devices. The focus of the research was on pining a fundamental understanding of the relationships between deposition reaction pathways, the bonding of dopant and alloy atoms, and the electrical provides of importance for PV applications. This involved studying the factors that contribute to defect generation and to defect removal and/or neutralization. In addition to the experimental studies, the research also included theoretical and modeling studies aimed at understanding the relationships between local atomic arrangements of Si and alloy atoms, and the electrical, optical, vibrational, and defect properties.