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This book presents a summary of the topic of supercooling during crystallization in condensed films. While recent findings are mainly published in English, the foundational classical results were originally published in Russian, with limited accessibility to general readers. The present work is based on a 2019 Ukrainian monograph, "Temperature Stability of the Supercooled Liquid Phase in Condensed Films," which has been extensively revised and expanded. The book includes a detailed analysis of the thermodynamics of supercooled fluids, with updated and expanded sections. Additionally, new results on the supercooling of indium-lead (In-Pb) alloys in contact with amorphous molybdenum and fusible metals in contact with nanocrystalline layers are presented. These layers occupy a middle ground between amorphous (carbon, molybdenum, as-deposited germanium films) and polycrystalline (copper, silver, aluminum) substrates. The book gives particular attention to the peculiarities of contracted geometry conditions, which are natural for multilayered structures and can occur through fusible component segregation at grain boundaries. The analysis of new data has prompted a rethinking of the role of the more refractory layer's microstructure on the crystallization processes of metastable melts. The book includes a thorough discussion of these findings, highlighting the crucial role of the microstructure in the crystallization process. This book is a valuable resource for researchers and students interested in crystallization in thin-film metallic systems. This comprehensive study provides a detailed and authoritative analysis of the thermodynamics of supercooled fluids, and the impact of microstructure on the crystallization processes of metastable melts, making it an essential addition to any academic library.
The Handbook of Thin Film Deposition Techniques: Principles, Methods, Equipment and Applications, Second Edition explores the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition tec
Colloidal processing has always been a major processing method. It facilitates control of particle interactions through a wide variety of schemes, which include surface coating, dispersion additives, and solvent control, among others. Controlling particle interactions also permits better resultant rheology and controlled green microstructures via a wide range of forming methods. In recent years, the particle size involved has been broadened into both the nanometer and the larger than micrometer ranges. This book covers fundamental issues encountered in colloidal processing nano-(less than 0.1 micron), micro-(from 0.1 to 5 micron) and macro-(larger than 5 micron) particulate systems and at the same time explore applications for these developments. Proceedings of the symposium held at the 105th Annual Meeting of The American Ceramic Society, April 27-30, in Nashville, Tennessee; Ceramic Transactions, Volume 152.
New second edition of the popular book on deposition (first edition by Klaus Schruegraf) for engineers, technicians, and plant personnel in the semiconductor and related industries. This book traces the technology behind the spectacular growth in the silicon semiconductor industry and the continued trend in miniaturization over the last 20 years. This growth has been fueled in large part by improved thin film deposition techniques and the development of highly specialized equipment to enable this deposition. The book includes much cutting-edge material. Entirely new chapters on contamination and contamination control describe the basics and the issues—as feature sizes shrink to sub-micron dimensions, cleanliness and particle elimination has to keep pace. A new chapter on metrology explains the growth of sophisticated, automatic tools capable of measuring thickness and spacing of sub-micron dimensions. The book also covers PVD, laser and e-beam assisted deposition, MBE, and ion beam methods to bring together all the physical vapor deposition techniques. Two entirely new areas receive full treatment: chemical mechanical polishing which helps attain the flatness that is required by modern lithography methods, and new materials used for interconnect dielectric materials, specifically organic polyimide materials.
The goal of producing devices that are smaller, faster, more functional, reproducible, reliable and economical has given thin film processing a unique role in technology. Principles of Vapor Deposition of Thin Films brings in to one place a diverse amount of scientific background that is considered essential to become knowledgeable in thin film depostition techniques. Its ultimate goal as a reference is to provide the foundation upon which thin film science and technological innovation are possible. * Offers detailed derivation of important formulae. * Thoroughly covers the basic principles of materials science that are important to any thin film preparation. * Careful attention to terminologies, concepts and definitions, as well as abundance of illustrations offer clear support for the text.
This book is a conceptual overview of surface and thin film science, providing a basic and straightforward understanding of the most common ideas and methods used in these fields. Fundamental scientific ideas, deposition methods, and characterization methods are all examined. Relying on simple, conceptual models and figures, fundamental scientific ideas are introduced and then applied to surfaces and thin films in the first half of the book. Topics include vacuum and plasma environments, crystal structure, atomic motion, thermodynamics, electrical and magnetic properties, optical and thermal properties, and adsorbed atoms on surfaces. Common methods of gas-phase thin film deposition are then introduced, starting with an overview of the film growth process and then a discussion of both physical and chemical vapor deposition methods. This is followed by an overview of a wide range of characterization techniques including imaging, structural, chemical, electrical, magnetic, optical, thermal, and mechanical techniques. Thin film science is a natural extension of surface science, especially as applications involve thinner and thinner films; distinct from other literature in the field, this book combines the two topics in a single volume. Simple, conceptual models and figures are used, supported by some mathematical expressions, to convey key ideas to students as well as practicing engineers, scientists, and technicians.
This book is a treatise on the thermodynamic and dynamic properties of thin liquid films at solid surfaces and, in particular, their rupture instabilities. For the quantitative study of these phenomena, polymer thin films (sometimes referred to as “ultrathin”) have proven to be an invaluable experimental model system. What is it that makes thin film instabilities special and interesting? First, thin polymeric films have an important range of applications. An understanding of their instabilities is therefore of practical relevance for the design of such films. The first chapter of the book intends to give a snapshot of current applications, and an outlook on promising future ones. Second, thin liquid films are an interdisciplinary research topic, which leads to a fairly heterogeneous community working on the topic. It justifies attempting to write a text which gives a coherent presentation of the field which researchers across their specialized communities might be interested in. Finally, thin liquid films are an interesting laboratory for a theorist to confront a well-established theory, hydrodynamics, with its limits. Thin films are therefore a field in which a highly fruitful exchange and collaboration exists between experimentalists and theorists. The book stretches from the more concrete to more abstract levels of study: we roughly progress from applications via theory and experiment to rigorous mathematical theory. For an experimental scientist, the book should serve as a reference and guide to what is the current consensus of the theoretical underpinnings of the field of thin film dynamics. Controversial problems on which such a consensus has not yet been reached are clearly indicated in the text, as well as discussed in a final chapter. From a theoretical point of view, the field of dewetting has mainly been treated in a mathematically ‘light’ yet elegant fashion, often making use of scaling arguments. For the untrained researcher, this approach is not always easy to follow. The present book attempts to bridge between the ‘light’ and the ‘rigorous’, always with the ambition to enhance insight and understanding - and to not let go the elegance of the theory.
As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.
For the first time the discipline of modern inorganic chemistry has been systematized according to a plan constructed by a council of editorial advisors and consultants, among them three Nobel laureates (E.O. Fischer, H. Taube and G. Wilkinson). Rather than producing a collection of unrelated review articles, the series creates a framework which reflects the creative potential of this scientific discipline. Thus, it stimulates future development by identifying areas which are fruitful for further research. The work is indexed in a unique way by a structured system which maximizes its usefulness to the reader. It augments the organization of the work by providing additional routes of access for specific compounds, reactions and other topics.