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Unlike extensive major reference works or handbooks, Chemical Engineering: Trends and Developments provides readers with a ready-reference to latest techniques in selected areas of chemical engineering where research is and will be focused in the future. These areas are: bioseparations; particle science and design; nanotechnology; and reaction engineering. The aim of the book is to provide academic and R&D researchers with an overview of the main areas of technical development and how these techniques can be applied. Each chapter focuses on a technique, plus a selection of applications or examples of where the technique could be applied.
This volume chronicles the proceedings of the Symposium on Adhesion Aspects of Polymeric Coatings held under the auspices of the Electrochemical Society in Minneapolis, MN, May 10-15, 1981. This event was cosponsored by the Dielectric and Insulation, and Electrothermics and Metallurgy Divisions. Polymeric coatings are used for a number of purposes, e. g. , decorative, protective, functional (as dielectrics or insulators) and a special application of polymeric (organic) coatings is their use as lithographic materials for making integrated circuit elements. Irrespective of the purpose of the coating, it must adhere well to the underlying substrate. So the need to under stand the factors which influence adhesion of organic coatings and the ways to attain desired adhesion is quite manifest. This Symposium was designed to bring together scientists and technologists interested in the adhesion aspects of polymeric coatings, to provide a forum for discussion of latest findings, and to provide an opportunity for cross-pollination of ideas. The technical program contained a total of 46 papers by authors from various corners of the world. The program comprised both invited overviews and contributed original research papers, as this blend is the best way to present the state of knowledge of a topic. The invited speakers were selected so as to represent widely differ ing disciplines and interests and they hailed from various aca demic and industrial research laboratories.
Faculties, publications and doctoral theses in departments or divisions of chemistry, chemical engineering, biochemistry and pharmaceutical and/or medicinal chemistry at universities in the United States and Canada.
This comprehensive study of extrusion coating technology describes the process and applications in detail, combining experimental data with computer modeling and the author's 30 years of experience. This methodology provides insight, clarity and assistance in problem solving, process optimization and new product development. The oportunities to exploit a wide range of polymers by the extrusion coater are discussed in detail. These include LDPE, HDPE, PP, ionomers, copolymers and blends and speciality materials, such as EVOH and PET. Everything you wanted to know about: Screw and die design for mono and coextrusion. Chill roll design and winders. Maximizing adhesion at high line speeds:- time in air gap and melt relaxation. Adhesion promotion:- corona, flame, ozone treatment and chemical primers. Feedblock and dual manifold coextrusion compared. Coextrusion:- control layer arrangement and eliminate interfacial instabilities. Optimize melt stability and minimize neck-in in air gap. Material selection:- polyethylenes, copolymers, ionomers, metallocenes, polypropylene etc. Substrates: pulp and paper, aluminium foil, plastic films etc. Applications for extrusion coatings and laminates. Minimize odor and off-taste and the scalping phenomenon in food packaging. Trouble shooting and many more insights. Target Audience: Engineers, marketers, technicians and students involved with the extrusion coating process. Table of Contents: The Extrusion Coating Process Equipment and Screw Design Die Design Stretching Flows and Neck-In Adhesion Coextrusion Adhesion Promotion Methods Polymers for Extrusion Coating: includes, coplymers, ionomers, PP, blends, metallocene PEs Speciality Polymers: EVOH and PET Improving organoleptic properties Substrates and Films for the EXtrusion Coater Extrusion Coated Products and Applications
Dislocation Based Crystal Plasticity: Theory and Computation at Micron and Submicron Scale provides a comprehensive introduction to the continuum and discreteness dislocation mechanism-based theories and computational methods of crystal plasticity at the micron and submicron scale. Sections cover the fundamental concept of conventional crystal plasticity theory at the macro-scale without size effect, strain gradient crystal plasticity theory based on Taylar law dislocation, mechanism at the mesoscale, phase-field theory of crystal plasticity, computation at the submicron scale, including single crystal plasticity theory, and the discrete-continuous model of crystal plasticity with three-dimensional discrete dislocation dynamics coupling finite element method (DDD-FEM). Three kinds of plastic deformation mechanisms for submicron pillars are systematically presented. Further sections discuss dislocation nucleation and starvation at high strain rate and temperature effect for dislocation annihilation mechanism. - Covers dislocation mechanism-based crystal plasticity theory and computation at the micron and submicron scale - Presents crystal plasticity theory without size effect - Deals with the 3D discrete-continuous (3D DCM) theoretic and computational model of crystal plasticity with 3D discrete dislocation dynamics (3D DDD) coupling finite element method (FEM) - Includes discrete dislocation mechanism-based theory and computation at the submicron scale with single arm source, coating micropillar, lower cyclic loading pillars, and dislocation starvation at the submicron scale
This thesis transports you to a wonderful and fascinating small-scale world and tells you the origin of several new phenomena. The investigative tool is the improved discrete dislocation-based multi-scale approaches, bridging the continuum modeling and atomistic simulation. Mechanism-based theoretical models are put forward to conveniently predict the mechanical responses and defect evolution. The findings presented in this thesis yield valuable new guidelines for microdevice design, reliability analysis and defect tuning.