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&Quot;This book explores flow through passages with hydraulic diameters from about 1 [mu]m to 3 mm, covering the range of minichannels and microchannels. Design equations along with solved examples and practice problems are also included to serve the needs of practicing engineers and students in a graduate course."--BOOK JACKET.
This book comprises selected papers from the First International Conference on Convective Flow Boiling. The purpose of the conference is to examine state-of-science and recent developments in technology of flow boiling, i.e., boiling systems which are affected by convective flows.
The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.
For more than 50 years, the Springer VDI Heat Atlas has been an indispensable working means for engineers dealing with questions of heat transfer. Featuring 50% more content, this new edition covers most fields of heat transfer in industrial and engineering applications. It presents the interrelationships between basic scientific methods, experimental techniques, model-based analysis and their transfer to technical applications.
Advances in Heat Transfer fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in journals or texts. The articles, which serve as a broad review for experts in the field, will also be of great interest to non-specialists who need to keep up-to-date with the results of the latest research. This serial is essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, graduate schools or industry. Provides an overview of review articles on topics of current interest Bridges the gap between academic researchers and practitioners in industry A long-running and prestigious series
This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.
Advances in Heat Transfer presents review articles on topics of current interest. Each contribution starts from widely understood principles and brings the reader up to the forefront of the topic being addressed. The favorable response by the international scientific and engineering community to the 37 volumes published to date is an indication of the success of our authors in fulfilling this purpose. This is recommended reading for all mechanical engineers and researchers. - Provides an overview of review articles on topics of current interest - Bridges the gap between academic researchers and practitioners in industry - A long-running and prestigious series
Set IV is a new addition to the previous Sets I, II and III. It contains 23 invited chapters from international specialists on the topics of numerical modeling of pulsating heat pipes and of slug flows with evaporation; lattice Boltzmann modeling of pool boiling; fundamentals of boiling in microchannels and microfin tubes, CO2 and nanofluids; testing and modeling of micro-two-phase cooling systems for electronics; and various special topics (flow separation in microfluidics, two-phase sensors, wetting of anisotropic surfaces, ultra-compact heat exchangers, etc.). The invited authors are leading university researchers and well-known engineers from leading corporate research laboratories (ABB, IBM, Nokia Bell Labs). Numerous 'must read' chapters are also included here for the two-phase community. Set IV constitutes a 'must have' engineering and research reference together with previous Sets I, II and III for thermal engineering researchers and practitioners.
Provides a comprehensive coverage of the basic phenomena. It contains twenty-five chapters which cover different aspects of boiling and condensation. First the specific topic or phenomenon is described, followed by a brief survey of previous work, a phenomenological model based on current understanding, and finally a set of recommended design equa