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The IEMT symposium provides a forum for sharing experiences and knowledge based on microelectronic research and development. This volume is the result of the 1997 symposium and topics include: flip chip and TAB, substrate, soldering process, manufacturing, and packaging technology.
Labs on Chip: Principles, Design and Technology provides a complete reference for the complex field of labs on chip in biotechnology. Merging three main areas— fluid dynamics, monolithic micro- and nanotechnology, and out-of-equilibrium biochemistry—this text integrates coverage of technology issues with strong theoretical explanations of design techniques. Analyzing each subject from basic principles to relevant applications, this book: Describes the biochemical elements required to work on labs on chip Discusses fabrication, microfluidic, and electronic and optical detection techniques Addresses planar technologies, polymer microfabrication, and process scalability to huge volumes Presents a global view of current lab-on-chip research and development Devotes an entire chapter to labs on chip for genetics Summarizing in one source the different technical competencies required, Labs on Chip: Principles, Design and Technology offers valuable guidance for the lab-on-chip design decision-making process, while exploring essential elements of labs on chip useful both to the professional who wants to approach a new field and to the specialist who wants to gain a broader perspective.
Die Globalisierung und Virtualisierung von Geschäftsbeziehungen vergrößert die Bedeutung und die Komplexität logistischer Herausforderungen. Das Management logistischer Netzwerke wird zu einem wesentlichen Wettbewerbsfaktor für Unternehmen. Das Buch wie die gleichnamige Tagung (September 2009) haben zum Ziel, den internationalen Gedankenaustausch und die Diskussion zwischen Wissenschaft und Praxis gezielt zu fördern, damit Strategien, Methoden und Werkzeuge entwickelt werden können, die es ermöglichen, den wachsenden Anforderungen gerecht zu werden.
With the approach of the 21st century, and the current trends in manufacturing, the role of computer-controlled flexible manufacturing an integral part in the success of manufacturing enterprises. will take Manufacturing environments are changing to small batch (with batch sizes diminishing to a quantity of one), larger product variety, produc tion on demand with low lead times, with the ability to be 'agile.' This is in stark contrast to conventional manufacturing which has relied on economies of scale, and where change is viewed as a disruption and is therefore detrimental to production. Computer integrated manufac turing (CIM) and flexible manufacturing practices are a key component in the transition from conventional manufacturing to the 'new' manu facturing environment. While the use of computers in manufacturing, from controlling indi vidual machines (NC, Robots, AGVs etc.) to controlling flexible manu facturing systems (FMS) has advanced the flexibility of manufacturing environments, it is still far from reaching its full potential in the environment of the future. Great strides have been made in individual technologies and control of FMS has been the subject of considerable research, but computerized shop floor control is not nearly as flexible or integrated as hyped in industrial and academic literature. In fact, the integrated systems have lagged far behind what could be achieved with existing technology.
Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging
Magnetic, Ferroelectric, and Multiferroic Metal Oxides covers the fundamental and theoretical aspects of ferroics and magnetoelectrics, their properties, and important technological applications, serving as the most comprehensive, up-to-date reference on the subject. Organized in four parts, Dr. Biljana Stojanovic leads expert contributors in providing the context to understand the material (Part I: Introduction), the theoretical and practical aspects of ferroelectrics (Part II: Ferroelectrics: From Theory, Structure and Preparation to Application), magnetic metal oxides (Part III: Magnetic Oxides: Ferromagnetics, Antiferromagnetics and Ferrimagnetics), multiferroics (Part IV: Multiferroic Metal Oxides) and future directions in research and application (Part V: Future of Metal Oxide Ferroics and Multiferroics). As ferroelectric materials are used to make capacitors with high dielectric constant, transducers, and actuators, and in sensors, reed heads, and memories based on giant magnetoresistive effects, this book will provide an ideal source for the most updated information. - Addresses ferroelectrics, ferromagnetics and multiferroelectrics, providing a one-stop reference for researchers - Provides fundamental theory and relevant, important technological applications - Highlights their use in capacitors with high dielectric constant, transducers, and actuators, and in sensors, reed heads, and memories based on giant magnetoresistive effects
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.