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Understand the design, testing, and application of cleanroom robotics and get real-world examples and design tips with this practical guide.
Machining processes play an important role in the manufacture of a wide variety of components. While the processes required for metal components are well-established, they cannot always be applied to composite materials, which instead require new and innovative techniques. Machining technology for composite materials provides an extensive overview and analysis of both traditional and non-traditional methods of machining for different composite materials.The traditional methods of turning, drilling and grinding are discussed in part one, which also contains chapters analysing cutting forces, tool wear and surface quality. Part two covers non-traditional methods for machining composite materials, including electrical discharge and laser machining, among others. Finally, part three contains chapters that deal with special topics in machining processes for composite materials, such as cryogenic machining and processes for wood-based composites.With its renowned editor and distinguished team of international contributors, Machining technology for composite materials is an essential reference particularly for process designers and tool and production engineers in the field of composite manufacturing, but also for all those involved in the fabrication and assembly of composite structures, including the aerospace, marine, civil and leisure industry sectors. - Provides an extensive overview of machining methods for composite materials - Chapters analyse cutting forces, tool wear and surface quality - Cryogenic machining and processes for wood based composites are discussed
"Electrostatic Precipitation" includes selected papers presented at the 11th International Conference on Electrostatic Precipitation. It presents the newest developments in electrostatic precipitation, flue gas desulphurization (FGD), selective catalytic reduction (SCR), and non-thermal plasma techniques for multi-pollutants emission control. Almost all outstanding scientists and engineers world-wide in the field will report their on-going researches. The book will be a useful reference for scientists and engineers to keep abreast of the latest developments in environmental science and engineering.
Electrostatic discharge (ESD) failure mechanisms continue to impact semiconductor components and systems as technologies scale from micro- to nano-electronics. This book studies electrical overstress, ESD, and latchup from a failure analysis and case-study approach. It provides a clear insight into the physics of failure from a generalist perspective, followed by investigation of failure mechanisms in specific technologies, circuits, and systems. The book is unique in covering both the failure mechanism and the practical solutions to fix the problem from either a technology or circuit methodology. Look inside for extensive coverage on: failure analysis tools, EOS and ESD failure sources and failure models of semiconductor technology, and how to use failure analysis to design more robust semiconductor components and systems; electro-thermal models and technologies; the state-of-the-art technologies discussed include CMOS, BiCMOS, silicon on insulator (SOI), bipolar technology, high voltage CMOS (HVCMOS), RF CMOS, smart power, gallium arsenide (GaAs), gallium nitride (GaN), magneto-resistive (MR) , giant magneto-resistors (GMR), tunneling magneto-resistor (TMR), devices; micro electro-mechanical (MEM) systems, and photo-masks and reticles; practical methods to use failure analysis for the understanding of ESD circuit operation, temperature analysis, power distribution, ground rule development, internal bus distribution, current path analysis, quality metrics, (connecting the theoretical to the practical analysis); the failure of each key element of a technology from passives, active elements to the circuit, sub-system to package, highlighted by case studies of the elements, circuits and system-on-chip (SOC) in today’s products. ESD: Failure Mechanisms and Models is a continuation of the author’s series of books on ESD protection. It is an essential reference and a useful insight into the issues that confront modern technology as we enter the Nano-electronic era.
This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.
Simulation Methods for ESD Protection Development looks at the integration of new techniques into a comprehensive development flow, which is now available due advances made in the field during the recent years. These findings allow for an early, stable ESD concept at a very early stage of the technology development, which is essential now development cycles have been reduced. The book also offers ways of increasing the optimization and control of the technology concerning performance, thus making the process more cost effective and increasingly efficient. This title provides a guide through the latest research and technology presenting the ESD protection development methodology. This is based on a combination of process, device and circuit stimulation, and addresses the optimization of the industry critical issue, reduced development cycles.Written to address the needs of the ESD engineer, this text is required reading by all industry practitioners and researchers and students within this field. - The FIRST Extensive overview on the subject of ESD simulation - Addresses the industry critical issue of reduced development cycles, and provides solutions - Presents the latest research in the field with high practical relevance and its results
Major edited presentations of new developments in materials science and technology.