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This book provides a systemized presentation of new techniques and methods in electronics manufacture. It helps the reader reduce the cost and increase the reliability of electronic products by employing up-to-date technology. It also details the latest ideas for reducing the scale of electronic components and products to the nano-scale by organizing all the elements of the complicated modern electronics manufacturing process showing how they affect each other.
Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.
This book explains why SiC is so useful in electronics, gives clear guidance on the various processing steps (growth, doping, etching, contact formation, dielectrics etc) and describes how these are integrated in device manufacture.
Approx.512 pagesApprox.512 pages
This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. - Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics - Includes coverage of environmentally friendly 'green encapsulants' - Presents coverage of faults and defects, and how to analyze and avoid them
The drive toward new semiconductor technologies is intricately related to market demands for cheaper, smaller, faster, and more reliable circuits with lower power consumption. The development of new processing tools and technologies is aimed at optimizing one or more of these requirements. This goal can, however, only be achieved by a concerted effort between scientists, engineers, technicians, and operators in research, development, and manufac turing. It is therefore important that experts in specific disciplines, such as device and circuit design, understand the principle, capabil ities, and limitations of tools and processing technologies. It is also important that those working on specific unit processes, such as lithography or hot processes, be familiar with other unit processes used to manufacture the product. Several excellent books have been published on the subject of process technologies. These texts, however, cover subjects in too much detail, or do not cover topics important to modem tech nologies. This book is written with the need for a "bridge" between different disciplines in mind. It is intended to present to engineers and scientists those parts of modem processing technologies that are of greatest importance to the design and manufacture of semi conductor circuits. The material is presented with sufficient detail to understand and analyze interactions between processing and other semiconductor disciplines, such as design of devices and cir cuits, their electrical parameters, reliability, and yield.
Electronic Waste Management and Treatment Technology applies the latest research for designing waste treatment and disposal strategies. Written for researchers who are exploring this emerging topic, the book begins with a short, but rigorous, discussion of electric waste management that outlines common hazardous materials. such as mercury, lead, silver and flame-retardants. The book also discusses the fate of metals contained in waste electrical and electronic equipment in municipal waste treatment. Materials and methods for the remediation, recycling and treatment of plastic waste collected from waste electrical and electronic equipment (WEEE) are also covered. Finally, the book covers the depollution benchmarks for capacitors, batteries and printed circuit boards from waste electrical and electronic equipment (WEEE) and the recovery of waste printed circuit boards through pyrometallurgy. - Describes depollution benchmarks for capacitors, batteries and printed wiring boards from waste electronics - Covers metals contained in waste electrical and electronic equipment in municipal waste - Provides tactics for the recycling of mixed plastic waste from electrical and electronic equipment
This twenty-nine chapter textbook is intended for use in community colleges, technical colleges, universities and corporate settings in which Introduction to Process Technology is taught. However, educators in many disciplines will find these materialsa complete reference for both theory and practical application. Students will find this textbook to be a valuable resource throughout their process technology career. topics addressed in this book include:
Based on the author's experience working with technicians directly on the factory floor in major industries, this handbook/reference coversallof the electronic technology found in modern industrial systems, going into the depth required to install, troubleshoot, and repaircomplexautomation systems. Each stand-alone (but cross-referenced) chapter explores either an entire system or individual circuits and components that are used over and over in a large variety of complex systems. Features a large number of figures, diagrams, and pictures, and typical “Job Assignment” s, with solutions.Advanced Solid State Logic: Flip-Flops, Shift Registers, Counters and Timers. Programmable Controllers. Solid-State Devices Used to Control Power: SCRs, TRIACs and Power Transistors. Solid-State Devices Used for Firing Circuits. Photoelectronics, Lasers and Fiber Optics. Industrial Power Supplies, Inverters and Converters. Operational Amplifiers. Open-Loop and Closed-Loop Feedback Systems. Input Devices: Sensors, Transducers, and Transmitters for Measurement. Output Devices: Amplifiers, Valves, Relays, Variable-Frequency Drives, Stepper Motors and Servomotor Drives. AC and DC Motors and Generators, Transformers, and Three-Phase Electricity. Case Studies of Four Industrial Applications. Robots and Other Motion Control Systems. Motor-Control Devices and Circuits. Data Communications for Industrial Electronics.For Instrumentation and Process Control Technicians, PLC and Motion Control Technicians.