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The IEEE International Conference on Electronics, Circuits, and Systems (ICECS) is the flagship conference of the IEEE Circuits & Systems (CAS) Society in Region 8 (Europe, Middle East and Africa) It presents design methodologies, techniques and experimental results in emerging electronics, circuits and systems topics
This book highlights the latest findings on nonlinear dynamical systems including two types of attractors: self-excited and hidden attractors. Further, it presents both theoretical and practical approaches to investigating nonlinear dynamical systems with self-excited and hidden attractors. The book includes 20 chapters contributed by respected experts, which focus on various applications such as biological systems, memristor-based systems, fractional-order systems, finance systems, business cycles, oscillators, coupled systems, hyperchaotic systems, flexible robot manipulators, electronic circuits, and control models. Special attention is given to modeling, design, circuit realization, and practical applications to address recent research problems in nonlinear dynamical systems. The book provides a valuable reference guide to nonlinear dynamical systems for engineers, researchers, and graduate students, especially those whose work involves mechanics, electrical engineering, and control systems.
The book presents high-quality research papers presented at the first international conference, ICICCD 2016, organised by the Department of Electronics, Instrumentation and Control Engineering of University of Petroleum and Energy Studies, Dehradun on 2nd and 3rd April, 2016. The book is broadly divided into three sections: Intelligent Communication, Intelligent Control and Intelligent Devices. The areas covered under these sections are wireless communication and radio technologies, optical communication, communication hardware evolution, machine-to-machine communication networks, routing techniques, network analytics, network applications and services, satellite and space communications, technologies for e-communication, wireless Ad-Hoc and sensor networks, communications and information security, signal processing for communications, communication software, microwave informatics, robotics and automation, optimization techniques and algorithms, intelligent transport, mechatronics system, guidance and navigation, algorithms, linear/non-linear control, home automation, sensors, smart cities, control systems, high performance computing, cognition control, adaptive control, distributed control, prediction models, hybrid control system, control applications, power system, manufacturing, agriculture cyber physical system, network control system, genetic control based, wearable devices, nano devices, MEMS, bio-inspired computing, embedded and real-time software, VLSI and embedded systems, FPGA, digital system and logic design, image and video processing, machine vision, medical imaging, and reconfigurable computing systems.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.
This book constitutes the refereed post-conference proceedings of the 9th International Conference on Broadband Communications, Networks, and Systems, Broadnets 2018, which took place in Faro, Portugal, in September 2018. The 30 revised full and 16 workshop papers were carefully reviewed and selected from 68 submissions. The papers are thematically grouped as follows: Advanced Techniques for IoT and WSNs; SDN and Network Virtualization; eHealth and Telemedicine Mobile Applications; Security and Privacy Preservation; Communication Reliability and Protocols; Spatial Modulation Techniques; Hardware Implementation and Antenna Design.