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Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Electromagnetic Non-destructive Evaluation (ENDE) is an invaluable, non-invasive diagnostic tool for the inspection, testing, evaluation and characterization of materials and structures. It has now become indispensible in a number of diverse fields ranging from biomedics to many branches of industry and engineering. This book presents the proceedings of the 24th International Workshop on Electromagnetic Nondestructive Evaluation, held in Chengdu, China from 11 - 14 September 2019. The 38 peer-reviewed and extended contributions included here were selected from 45 original submissions, and are divided into 7 sections: eddy current testing and evaluation; advanced sensors; analytical and numerical modeling; material characterization; inverse problem and signal processing; artificial intelligence in ENDE; and industrial applications of ENDE. The papers cover recent studies concerning the progress and application of electromagnetic (EM) fields in the non-destructive examination of materials and structures, and topics covered include evaluations at a micro-structural level, such as correlating the magnetic properties of a material with its grain structure, and a macroscopic level, such as techniques and applications for EM NDT&E. Recent developments and emerging materials such as advanced EM sensors, multi-physics NDT&E, intelligent data management and maintaining the integrity of structures are also explored. The book provides a current overview of developments in ENDE, and will be of interest to all those working in the field.
The three-volume set CCIS 1224, CCIS 1225, and CCIS 1226 contains the extended abstracts of the posters presented during the 21st International Conference on Human-Computer Interaction, HCII 2020, which took place in Copenhagen, Denmark, in July 2020.* HCII 2020 received a total of 6326 submissions, of which 1439 papers and 238 posters were accepted for publication in the pre-conference proceedings after a careful reviewing process. The 238 papers presented in these three volumes are organized in topical sections as follows: Part I: design and evaluation methods and tools; user characteristics, requirements and preferences; multimodal and natural interaction; recognizing human psychological states; user experience studies; human perception and cognition. -AI in HCI. Part II: virtual, augmented and mixed reality; virtual humans and motion modelling and tracking; learning technology. Part III: universal access, accessibility and design for the elderly; smartphones, social media and human behavior; interacting with cultural heritage; human-vehicle interaction; transport, safety and crisis management; security, privacy and trust; product and service design. *The conference was held virtually due to the COVID-19 pandemic. The chapter "“Developing an Interactive Tabletop Mediated Activity to Induce Collaboration by Implementing Design Considerations Based on Cooperative Learning Principles” is available open access under a Creative Commons Attribution 4.0 International License via link.springer.com.
This book presents various questions of continuum mechanical modeling in the context of experimental and numerical methods, in particular, multi-field problems that go beyond the standard models of continuum mechanics. In addition, it discusses dynamic problems and practical solutions in the field of numerical methods. It focuses on continuum mechanics, which is often overlooked in the traditional division of mechanics into statics, strength of materials and kinetics. The book is dedicated to Prof. Volker Ulbricht, who passed away on April 9, 2021.