Download Free Dielectrics In Emerging Technologies Book in PDF and EPUB Free Download. You can read online Dielectrics In Emerging Technologies and write the review.

"Papers presented at the First International Symposium on Science and Technology of Dielectrics in Emerging Fields, held from 27th April to 2nd May, 2003 in Paris, France"--Pref.
Semiconductor technologies are moving at such a fast pace that new materials are needed in all types of application. Manipulating the materials and their properties at atomic dimensions has become a must. This book presents the case of interlayer dielectrics materials whilst considering these challenges. Interlayer Dielectrics for Semiconductor Technologies cover the science, properties and applications of dielectrics, their preparation, patterning, reliability and characterisation, followed by the discussion of different materials including those with high dielctric constants and those useful for waveguide applications in optical communications on the chip and the package.* Brings together for the FIRST time the science and technology of interlayer deilectrics materials, in one volume* written by renowned experts in the field* Provides an up-to-date starting point in this young research field.
Dielectric Elastomers as Electromechanical Transducers provides a comprehensive and updated insight into dielectric elastomers; one of the most promising classes of polymer-based smart materials and technologies. This technology can be used in a very broad range of applications, from robotics and automation to the biomedical field. The need for improved transducer performance has resulted in considerable efforts towards the development of devices relying on materials with intrinsic transduction properties. These materials, often termed as "smart or "intelligent, include improved piezoelectrics and magnetostrictive or shape-memory materials. Emerging electromechanical transduction technologies, based on so-called ElectroActive Polymers (EAP), have gained considerable attention. EAP offer the potential for performance exceeding other smart materials, while retaining the cost and versatility inherent to polymer materials. Within the EAP family, "dielectric elastomers, are of particular interest as they show good overall performance, simplicity of structure and robustness. Dielectric elastomer transducers are rapidly emerging as high-performance "pseudo-muscular actuators, useful for different kinds of tasks. Further, in addition to actuation, dielectric elastomers have also been shown to offer unique possibilities for improved generator and sensing devices. Dielectric elastomer transduction is enabling an enormous range of new applications that were precluded to any other EAP or smart-material technology until recently. This book provides a comprehensive and updated insight into dielectric elastomer transduction, covering all its fundamental aspects. The book deals with transduction principles, basic materials properties, design of efficient device architectures, material and device modelling, along with applications. - Concise and comprehensive treatment for practitioners and academics - Guides the reader through the latest developments in electroactive-polymer-based technology - Designed for ease of use with sections on fundamentals, materials, devices, models and applications
Proceedings of the NATO Advanced Study Institute, Erice, Italy, April 8-20, 2000
Dielectric Polymer Nanocomposites provides the first in-depth discussion of nano-dielectrics, an emerging and fast moving topic in electrical insulation. The text begins with an overview of the background, principles and promise of nanodielectrics, followed by a discussion of the processing of nanocomposites and then proceeds with special considerations of clay based processes, mechanical, thermal and electric properties and surface properties as well as erosion resistance. Carbon nanotubes are discussed as a means of creation of non linear conductivity, the text concludes with a industrial applications perspective.
Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for
The main goal of this book is to review at the nano and atomic scale the very complex scientific issues that pertain to the use of advanced high dielectric constant (high-k) materials in next generation semiconductor devices. One of the key obstacles to integrate this novel class of materials into Si nano-technology are the electronic defects in high-k dielectrics. It has been established that defects do exist in high-k dielectrics and they play an important role in device operation. The unique feature of this book is a special focus on the important issue of defects. The subject is covered from various angles, including silicon technology, processing aspects, materials properties, electrical defects, microstructural studies, and theory. The authors who have contributed to the book represents a diverse group of leading scientists from academic, industrial and governmental labs worldwide who bring a broad array of backgrounds (basic and applied physics, chemistry, electrical engineering, surface science, and materials science). The contributions to this book are accessible to both expert scientists and engineers who need to keep up with leading edge research, and newcomers to the field who wish to learn more about the exciting basic and applied research issues relevant to next generation device technology.
Issues relating to the high-K gate dielectric are among the greatest challenges for the evolving International Technology Roadmap for Semiconductors (ITRS). More than just an historical overview, this book will assess previous and present approaches related to scaling the gate dielectric and their impact, along with the creative directions and forthcoming challenges that will define the future of gate dielectric scaling technology. Topics include: an extensive review of Moore's Law, the classical regime for SiO2 gate dielectrics; the transition to silicon oxynitride gate dielectrics; the transition to high-K gate dielectrics (including the drive towards equivalent oxide thickness in the single-digit nanometer regime); and future directions and issues for ultimate technology generation scaling. The vision, wisdom, and experience of the team of authors will make this book a timely, relevant, and interesting, resource focusing on fundamentals of the 45 nm Technology Generation and beyond.
This book presents the fundamentals of novel gate dielectrics that are being introduced into semiconductor manufacturing to ensure the continuous scaling of CMOS devices. As this is a rapidly evolving field of research we choose to focus on the materials that determine the performance of device applications. Most of these materials are transition metal oxides. Ironically, the d-orbitals responsible for the high dielectric constant cause severe integration difficulties, thus intrinsically limiting high-k dielectrics. Though new in the electronics industry many of these materials are well-known in the field of ceramics, and we describe this unique connection. The complexity of the structure-property relations in TM oxides requires the use of state-of-the-art first-principles calculations. Several chapters give a detailed description of the modern theory of polarization, and heterojunction band discontinuity within the framework of the density functional theory. Experimental methods include oxide melt solution calorimetry and differential scanning calorimetry, Raman scattering and other optical characterization techniques, transmission electron microscopy, and X-ray photoelectron spectroscopy. Many of the problems encountered in the world of CMOS are also relevant for other semiconductors such as GaAs. A comprehensive review of recent developments in this field is thus also given.
High Temperature Polymer Dielectrics Overview on how to achieve polymer dielectrics at high temperatures, with emphasis on diverse applications in various electrical insulation fields High Temperature Polymer Dielectrics: Fundamentals and Applications in Power Equipment systematically describes the latest research progress surrounding high-temperature polymer dielectric (HTPD) materials and their applications in electrical insulation fields such as high-temperature energy storage capacitors, motors, packaging, printed circuit board, new energy power equipment, and aerospace electrical equipment. The comprehensive text provides a description of the market demand and theoretical research value of HTPDs in electrical equipment and enables readers to improve the performance and design of existing HTPD materials, and to develop efficient new high temperature polymer dielectric materials in general. Specific sample topics covered in High Temperature Polymer Dielectrics include: Thermal and electrical properties of high-temperature polymers, and the excellent thermal stability, mechanical properties, and long service life of polymer dielectrics Why fluorinated polymers are more thermally stable than their corresponding hydrogen-substituted polymers Static Thermomechanical Analysis (TMA), a technique for measuring the functional relationship between the deformation of the materials and the temperature and time under different actions Polyetheretherketone (PEEK), a semi-crystalline polymer material with ether bonds and ketone carbonyl groups in molecular chains Providing a complete overview of the state-of-the-art high temperature polymer dielectrics, with a focus on fundamental background and recent advances, High Temperature Polymer Dielectrics is an essential resource for materials scientists, electrical engineers, polymer chemists, physicists, and professionals working in the chemical industry as a whole.