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Most MEMS accelerometers on the market today are capacitive accelerometers that are based on the displacement sensing mechanism. This book is intended to cover recent developments of MEMS silicon oscillating accelerometers (SOA), also referred to as MEMS resonant accelerometer. As contrast to the capacitive accelerometer, the MEMS SOA is based on the force sensing mechanism, where the input acceleration is converted to a frequency output. MEMS Silicon Oscillating Accelerometers and Readout Circuits consists of six chapters and covers both MEMS sensor and readout circuit, and provides an in-depth coverage on the design and modelling of the MEMS SOA with several recently reported prototypes. The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.
Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Micro-scaling makes MEMS sense capacitance small in a CMUT array element for intravascular ultrasound imaging. Smaller sensors lead to a lower active-to- parasitic ratio and thus, degrades sensitivity. Here capacitive feedback charge amplifier is shown as an alternative approach to resistive feedback amplifier. Capacitive feedback charge amplifier provides high sensitivity, small area, low distortion and power saving. This approach of charge amplifiers is also suitable in capacitive microphones where it provides low power and high sensitivity. In the case of biomimetic microphone structure, optical detection overcomes capacitive detection s thermal noise issues. Also with micro-scaling, optical detection overcomes the increased parasitics without any sensitivity degradation, unlike capacitive detection. For hearing aids, along with sensitivity, battery life is another challenge. We propose the use of 1- bit front-end sigma-delta ADC for overall improved hearing aid power efficiency. Front-end interface based on envelope detection and synchronous detection have also been designed. Circuit techniques are used for maximizing signal handling with low supplies.
Testing and calibration constitute a significant part of the overall manufacturing cost of microelectromechanical system (MEMS) devices. Developing a low-cost testing and calibration scheme applicable at the user side that ensures the continuous reliability and accuracy is a crucial need. The main purpose of testing is to eliminate defective devices and to verify the qualifications of a product is met. The calibration process for capacitive MEMS devices, for the most part, entails the determination of the mechanical sensitivity. In this work, a physical-stimulus-free built-in-self-test (BIST) integrated circuit (IC) design characterizing the sensitivity of capacitive MEMS accelerometers is presented. The BIST circuity can extract the amplitude and phase response of the acceleration sensor's mechanics under electrical excitation within 0.55% of error with respect to its mechanical sensitivity under the physical stimulus. Sensitivity characterization is performed using a low computation complexity multivariate linear regression model. The BIST circuitry maximizes the use of existing analog and mixed-signal readout signal chain and the host processor core, without the need for computationally expensive Fast Fourier Transform (FFT)-based approaches. The BIST IC is designed and fabricated using the 0.18-μm CMOS technology. The sensor analog front-end and BIST circuitry are integrated with a three-axis, low-g capacitive MEMS accelerometer in a single hermetically sealed package. The BIST circuitry occupies 0.3 mm2 with a total readout IC area of 1.0 mm2 and consumes 8.9 mW during self-test operation.
Sensors and devices, based on micromachining technology, known as micro-electro-mechanicalsystems or MEMS, have been received increasing attention so far in recent years. Micromachined inertial sensors, consisting of accelerometers and gyroscopes, are one of the most important types of silicon-based sensor. MEMS capacitive accelerometers have been extensively used in automobiles, inertial navigation systems, earth quake detection and many other bio-medical applications. This book deals with the design of a monolithic 3DOF MEMS capacitive accelerometer using both analytical and numerical techniques. Monolithic accelerometer is a single structure having three individual single axis Accelerometers on a single substrate and utilizes a surface micromachining technology using standard PolyMUMPs process. The designed accelerometer is 3mmx3.1mm in size, has low mechanical noise floor, high sense capacitance and high sensitivity along in-plane (x and y) and out-of-plane (z) axes. Performing a detailed finite element analysis in ANSYS 11.o, physical level simulation has been done to verify the deflection for x, y and z axes with respect to the applied acceleration (g).
This book is based on the 18 presentations during the 21st workshop on Advances in Analog Circuit Design. Expert designers provide readers with information about a variety of topics at the frontier of analog circuit design, including Nyquist analog-to-digital converters, capacitive sensor interfaces, reliability, variability, and connectivity. This book serves as a valuable reference to the state-of-the-art, for anyone involved in analog circuit research and development.
This book is a printed edition of the Special Issue "Interface Circuits for Microsensor Integrated Systems" that was published in Micromachines
Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.