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Sensors and devices, based on micromachining technology, known as micro-electro-mechanicalsystems or MEMS, have been received increasing attention so far in recent years. Micromachined inertial sensors, consisting of accelerometers and gyroscopes, are one of the most important types of silicon-based sensor. MEMS capacitive accelerometers have been extensively used in automobiles, inertial navigation systems, earth quake detection and many other bio-medical applications. This book deals with the design of a monolithic 3DOF MEMS capacitive accelerometer using both analytical and numerical techniques. Monolithic accelerometer is a single structure having three individual single axis Accelerometers on a single substrate and utilizes a surface micromachining technology using standard PolyMUMPs process. The designed accelerometer is 3mmx3.1mm in size, has low mechanical noise floor, high sense capacitance and high sensitivity along in-plane (x and y) and out-of-plane (z) axes. Performing a detailed finite element analysis in ANSYS 11.o, physical level simulation has been done to verify the deflection for x, y and z axes with respect to the applied acceleration (g).
Most MEMS accelerometers on the market today are capacitive accelerometers that are based on the displacement sensing mechanism. This book is intended to cover recent developments of MEMS silicon oscillating accelerometers (SOA), also referred to as MEMS resonant accelerometer. As contrast to the capacitive accelerometer, the MEMS SOA is based on the force sensing mechanism, where the input acceleration is converted to a frequency output. MEMS Silicon Oscillating Accelerometers and Readout Circuits consists of six chapters and covers both MEMS sensor and readout circuit, and provides an in-depth coverage on the design and modelling of the MEMS SOA with several recently reported prototypes. The book is not only useful to researchers and engineers who are familiar with the topic, but also appeals to those who have general interests in MEMS inertial sensors. The book includes extensive references that provide further information on this topic.
Micro-electro-mechanical system (MEMS) devices are widely used for inertia, pressure, and ultrasound sensing applications. Research on integrated MEMS technology has undergone extensive development driven by the requirements of a compact footprint, low cost, and increased functionality. Accelerometers are among the most widely used sensors implemented in MEMS technology. MEMS accelerometers are showing a growing presence in almost all industries ranging from automotive to medical. A traditional MEMS accelerometer employs a proof mass suspended to springs, which displaces in response to an external acceleration. A single proof mass can be used for one- or multi-axis sensing. A variety of transduction mechanisms have been used to detect the displacement. They include capacitive, piezoelectric, thermal, tunneling, and optical mechanisms. Capacitive accelerometers are widely used due to their DC measurement interface, thermal stability, reliability, and low cost. However, they are sensitive to electromagnetic field interferences and have poor performance for high-end applications (e.g., precise attitude control for the satellite). Over the past three decades, steady progress has been made in the area of optical accelerometers for high-performance and high-sensitivity applications but several challenges are still to be tackled by researchers and engineers to fully realize opto-mechanical accelerometers, such as chip-scale integration, scaling, low bandwidth, etc. This Special Issue on "MEMS Accelerometers" seeks to highlight research papers, short communications, and review articles that focus on: Novel designs, fabrication platforms, characterization, optimization, and modeling of MEMS accelerometers. Alternative transduction techniques with special emphasis on opto-mechanical sensing. Novel applications employing MEMS accelerometers for consumer electronics, industries, medicine, entertainment, navigation, etc. Multi-physics design tools and methodologies, including MEMS-electronics co-design. Novel accelerometer technologies and 9DoF IMU integration. Multi-accelerometer platforms and their data fusion.
Sensors and actuators are now part of our everyday life and appear in many appliances, such as cars, vending machines and washing machines. MEMS (Micro Electro Mechanical Systems) are micro systems consisting of micro mechanical sensors, actuators and micro electronic circuits. A variety of MEMS devices have been developed and many mass produced, but the information on these is widely dispersed in the literature. This book presents the analysis and design principles of MEMS devices. The information is comprehensive, focusing on microdynamics, such as the mechanics of beam and diaphragm structures, air damping and its effect on the motion of mechanical structures. Using practical examples, the author examines problems associated with analysis and design, and solutions are included at the back of the book. The ideal advanced level textbook for graduates, Analysis and Design Principles of MEMS Devices is a suitable source of reference for researchers and engineers in the field. * Presents the analysis and design principles of MEMS devices more systematically than ever before. * Includes the theories essential for the analysis and design of MEMS includes the dynamics of micro mechanical structures * A problem section is included at the end of each chapter with answers provided at the end of the book.
Diploma Thesis from the year 2005 in the subject Electrotechnology, grade: Master 9.8/10, , language: English, abstract: Microelectromechanical systems (MEMS) are collection of microsensors and actuators that have the ability to sense its environment and react to changes in that environment with the use of a microcircuit control. They also include the conventional microelectronics packaging, integrating antenna structures for command signals into microelectromechanical structures for desired sensing and actuating functions. The system may also need micropower supply, microrelay, and microsignal processing units. Microcomponents make the system faster, more reliable, cheaper, and capable of incorporating more complex functions. In the beginning of 1990s, MEMS appeared with the aid of the development of integrated circuit fabrication processes, in which sensors, actuators, and control functions are co-fabricated in silicon [1]. Since then, remarkable research progresses have been achieved in MEMS under the strong promotions from both government and industries. In addition to the commercialization of some less integrated MEMS devices, such as microaccelerometers, inkjet printer head, micromirrors for projection, etc., the concepts and feasibility of more complex MEMS devices have been proposed and demonstrated for the applications in such varied fields as microfluidics, aerospace, biomedical, chemical analysis, wireless communications, data storage, display, optics, etc. Some branches of MEMS, appearing as microoptoelectromechanical systems (MOEMS), micro total analysis systems, etc., have attracted a great research since their potential applications’ market.
MEMS technology is rapidly taking an important role in today's and future military systems. MEMS are able to lower the device size from millimeter to micrometer and maintain and sometimes surpass the performance of conventional devices. This thesis encompasses the knowledge acquired throughout the MEMS courses to design a two-axis capacitive accelerometer. The required acceleration and operating temperature range were ł50g in each axis and -40ʻC to +80 ʻC, respectively. The accelerometer was also needed to survive within a dynamic shocking environment with accelerations of up to 225g. The parameters of the accelerometer to achieve above specifications were calculated using lumped element approximation and the results were used for initial layout of it. A finite element analysis code (ANSYS) was used to perform simulations of the accelerometer under various operating conditions and to determine the optimum configuration. The simulated results were found to be within about 5% of the calculations indicating the validity of lumped element approach. The response of the designed accelerometer was 7 mV/g and with sensitivity of 1.3g at 3dB. It was also found that the accelerometer was stable in the desired range of operation including under the shock. Two axes sensing can be achieved using two identical accelerometers having their sensing axes perpendicular to each other.
MEMS technology is rapidly taking an important role in today's and future military systems. MEMS are able to lower the device size from millimeter to micrometer and maintain and sometimes surpass the performance of conventional devices. This thesis encompasses the knowledge acquired throughout the MEMS courses to design a two-axis capacitive accelerometer. The required acceleration and operating temperature range were 50g in each axis and -40 C to +80 C, respectively. The accelerometer was also needed to survive within a dynamic shocking environment with accelerations of up to 225g. The parameters of the accelerometer to achieve above specifications were calculated using lumped element approximation and the results were used for initial layout of it. A finite element analysis code (ANSYS) was used to perform simulations of the accelerometer under various operating conditions and to determine the optimum configuration. The simulated results were found to be within about 5% of the calculations indicating the validity of lumped element approach. The response of the designed accelerometer was 7 mV/g and with sensitivity of 1.3g at 3dB. It was also found that the accelerometer was stable in the desired range of operation including under the shock. Two axes sensing can be achieved using two identical accelerometers having their sensing axes perpendicular to each other.