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Ultimate integration of power switch-mode converter relies on two research paths. One path experiments the development of switched-capacitor converters. This approach fits silicon integration but is still limited in term of power density. Inductive DC-DC architectures of converters suffer by the values and size of passive components. This limitation is addressed with an increase in frequency. Increase in switching losses in switches leads to consider advanced technological nodes. Consequently, the capability with respect to input voltage is then limited. Handling 3.3 V input voltage to deliver an output voltage in the range 0.6 V to 1.2 V appears a challenging specification for an inductive buck converter if the smallest footprint is targeted at +90 % efficiency. Smallest footprint is approached through a 3D assembly of passive components to the active silicon die. High switching frequency is also considered to shrink the values of passive components as much as possible. In the context of on-chip power supply, the silicon technology is dictated by the digital functions. Complementary Metal-Oxide- Semiconductor (CMOS) bulk C40 is selected as a study case for 3.3 V input voltage. 3.3 V Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) features poor figure of merits and 1.2 V standard core, regular devices are preferred. Moreover future integration as an on-chip power supply is more compatible. A three-MOSFET cascode arrangement is experimented and confronted experimentally to a standard buck arrangement in the same technology. The coupled-phase architecture enables to reduce the switching frequency to half the operating frequency of the passive devices. +100MHz is selected for operation of passive devices. CMOS bulk C40 offers Metal-Oxide-Metal (MOM) and MOS capacitors, in density too low to address the decoupling requirements. Capacitors have to be added externally to the silicon die but in a tight combination. Trench-cap technology is selected and capacitors are fabricated on a separate die that will act as an interposer to receive the silicon die as well as the inductors. The work delivers an object containing a one-phase buck converter with the silicon die flip-chipped on a capacitor interposer where a tiny inductor die is reported. The one-phase demonstrator is suitable for coupled-phase demonstration. Standard and cascode configurations are experimentally compared at 100 MHz and 200 MHz switching frequency. A design methodology is presented to cover a system-to-device approach. The active silicon die is the central design part as the capacitive interposer is fabricated by IPDiA and inductors are provided by Tyndall National Institute. The assembly of the converter sub-parts is achieved using an industrial process. The work details a large set of measurements to show the performances of the delivered DC/DC converters as well as its limitations. A 91.5% peak efficiency at 100MHz switching frequency has been demonstrated.
CMOS DC-DC Converters aims to provide a comprehensive dissertation on the matter of monolithic inductive Direct-Current to Direct-Current (DC-DC) converters. For this purpose seven chapters are defined which will allow the designer to gain specific knowledge on the design and implementation of monolithic inductive DC-DC converters, starting from the very basics.
Bachelor Thesis from the year 2013 in the subject Electrotechnology, grade: Bachelor, Harbin Engineering University (College of Automation), course: Electronics, language: English, abstract: In recent years, with the development of power electronic devices control theory and the increasing demand of high-quality power supply, power electronics technology has aroused widely attention from scholars. DC-DC power converters are employed in a variety of applications, including power supplies for personal computers, office equipment; spacecraft power systems, laptop, Cell phones, and telecommunications equipment, as well as dc motor drives. In this project a detailed study of zero current switching buck converters is done and also practically implemented in hardware. In addition a mathematical analysis of switching loss occurring in MOSFET's is also presented and a short study of zero voltage switching is also appended. During the hardware implementation the Ton, Toff and operating frequency were found out and thoroughly tuned through the IC555 circuit and various waveforms across inductors, capacitors, load resistor and test points were noted down. In this thesis, the Buck type circuit structure and working principle are analyzed and a DC-DC buck converter is designed. The designed converter uses ZCS scheme and realized the function that the power form is converted from 12V DC voltages to 5 V DC voltages. The output voltage can be adjusted according to the output resistor. The output voltage is stable and the performance of the designed converter is ensured. Simulation study was carried out and effectiveness of the designed converter is verified by simulation results. Finlay design is implemented in hardware and PCB layout as well.
This book analyzes multi-MHz high frequency resonant DC-DC power converters with operating frequencies ranging from several MHz to tens of MHz in detail, aiming to support researchers and engineers with a focus on multi-MHz high frequency converters. The inverter stage, rectifier stage, matching network stage are analyzed in detail. Based on the three basic stages, typical non-isolated and isolated resonant DC-DC converters are depicted. To reduce the high driving loss under multi-MHz, resonant driving methods are introduced and improved. Also, the design and selection methods of passive and active component under multi-MHz frequency are described, especially for aircore inductor and transformer. Furthermore, multi-MHz resonant converter provides an approach for achieving flexible system.